公开(公告)号：US20100248426A1

公开(公告)日：2010-09-30

申请号：US12727258

申请日：2010-03-19

Applicant: Zhe Li ,  Qingchun He ,  Guanhua Wang ,  Zhijie Wang ,  Nan Xu

Inventor： Zhe Li ,  Qingchun He ,  Guanhua Wang ,  Zhijie Wang ,  Nan Xu

IPC: H01L21/78 ,  H01L21/56 ,  H01L21/306

CPC classification number: H01L21/565 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49513 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/83099 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/85013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/35121 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A process for assembling a Chip-On-Lead packaged semiconductor device includes the steps of: mounting and sawing a wafer to provide individual semiconductor dies; performing a first molding operation on a lead frame; depositing epoxy on the lead frame via a screen printing process; attaching one of the singulated dies on the lead frame with the epoxy, where the die attach is done at room temperature; and curing the epoxy in an oven. Throughput improvements may be ascribed to not including a hot die attach process. An optional plasma cleaning step may be performed, which greatly improves wire bonding quality and a second molding quality. In addition, since a first molding operation is performed before the formation of epoxy to avoid the problem of the epoxy hanging in the air, the delamination risk between the epoxy and the die is avoided.

Abstract translation: 芯片引线封装半导体器件的组装方法包括以下步骤：安装和锯切晶片以提供单独的半导体管芯; 在引线框上执行第一模制操作; 通过丝网印刷工艺在引线框架上沉积环氧树脂; 在引线框架上用环氧树脂将一个单模模具附着在模具附着在室温下进行; 并在烘箱中固化环氧树脂。 吞吐量改进可归因于不包括热模附着过程。 可以进行可选的等离子体清洗步骤，这大大提高了引线接合质量和第二成型质量。 此外，由于在形成环氧树脂之前进行第一次成型操作以避免环氧树脂悬挂在空气中的问题，所以避免了环氧树脂和模具之间的脱层危险。

公开(公告)号：US20090111220A1

公开(公告)日：2009-04-30

申请号：US12129686

申请日：2008-05-30

Applicant: Chao Wang ,  Qing Chun He ,  Zhe Li ,  Zhijie Wang ,  Dehong Ye

Inventor： Chao Wang ,  Qing Chun He ,  Zhe Li ,  Zhijie Wang ,  Dehong Ye

IPC: H01L23/52 ,  H01L23/49 ,  B05D3/02 ,  H01L23/495

CPC classification number: H01L21/4835 ,  H01L23/49513 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/85001 ,  H01L2224/85011 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01007 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  Y10T428/12014 ,  Y10T428/12493 ,  Y10T428/12646 ,  H01L2224/78 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A lead frame having a coating of organic compounds on its lead fingers prevents tin and flux from contaminating the lead fingers after die attach. The coating is removed prior to wire bonding. The coating allows for reliable second bonds (bond between wires and lead fingers) to be formed, decreasing the likelihood of non-stick and improving wire peel strength.

Abstract translation: 引线框架在其引线上具有有机化合物的涂层，防止锡和焊剂在芯片附着后污染铅指。 在引线接合之前去除涂层。 该涂层允许形成可靠的第二结合（电​​线和引线指之间的结合），降低不粘的可能性并提高线剥离强度。

公开(公告)号：US20090021816A1

公开(公告)日：2009-01-22

申请号：US11853815

申请日：2007-09-12

Applicant: Xin Simon Luo ,  Pei Chuang Chen ,  Leming Wang ,  Zhijie Wang

Inventor： Xin Simon Luo ,  Pei Chuang Chen ,  Leming Wang ,  Zhijie Wang

IPC: G02B26/08

CPC classification number: G02B26/0833 ,  G02B6/4222 ,  G02B6/4225 ,  G02B6/4249

Abstract: An apparatus and method steer a light through a lens into a receiving port via a steering device. The steering device is located between the lens and a light source. A feedback mechanism adjusts the steering device to correct for aberration.

Abstract translation: 一种装置和方法通过转向装置将光通过透镜转向接收端口。 转向装置位于透镜和光源之间。 反馈机构调整转向装置以校正像差。

公开(公告)号：US09397066B2

公开(公告)日：2016-07-19

申请号：US14693881

申请日：2015-04-23

Applicant: Zhijie Wang ,  Zhigang Bai ,  Huchang Zhang

Inventor： Zhijie Wang ,  Zhigang Bai ,  Huchang Zhang

IPC: B23K31/02 ,  H01L23/00 ,  B23K31/12 ,  B23K37/047 ,  B23K20/00

CPC classification number: H01L24/78 ,  B23K20/005 ,  B23K31/12 ,  B23K37/047 ,  B65H51/18 ,  B65H2701/36 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/78301 ,  H01L2224/78611 ,  H01L2224/78621 ,  H01L2224/78631 ,  H01L2224/789 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599

Abstract: A bond wire feed system has a wire tensioning unit with a chamber that has a wire inlet aperture and a wire outlet aperture. The wire inlet and outlet apertures have centers that are aligned with a central axis of the chamber. A clamp is positioned to receive a bond wire provided from the wire outlet aperture. The clamp has at least two jaws movable relative to each other and arranged to grip the wire to align a central axis of the wire with the central axis of the chamber. The jaws are also movable along the central axis of the wire in order to pull the wire through the wire tensioning unit.

Abstract translation: 接合丝馈送系统具有线张紧单元，其具有具有线入口孔和线出口孔的腔室。 电线入口和出口孔具有与腔室的中心轴线对准的中心。 定位夹具以接收从线出口孔提供的接合线。 夹具具有至少两个可相对于彼此移动的夹爪，并布置成夹持线以将线的中心轴线与腔室的中心轴线对准。 夹爪也可以沿着导线的中心轴线移动，以便将线材拉过线材拉紧单元。

公开(公告)号：US20160155718A1

公开(公告)日：2016-06-02

申请号：US14693881

申请日：2015-04-23

Applicant: ZHIJIE WANG ,  Zhigang Bai ,  Huchang Zhang

Inventor： ZHIJIE WANG ,  Zhigang Bai ,  Huchang Zhang

IPC: H01L23/00 ,  B23K37/047 ,  B23K31/12

CPC classification number: H01L24/78 ,  B23K20/005 ,  B23K31/12 ,  B23K37/047 ,  B65H51/18 ,  B65H2701/36 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/78301 ,  H01L2224/78611 ,  H01L2224/78621 ,  H01L2224/78631 ,  H01L2224/789 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599

Abstract: A bond wire feed system has a wire tensioning unit with a chamber that has a wire inlet aperture and a wire outlet aperture. The wire inlet and outlet apertures have centers that are aligned with a central axis of the chamber. A clamp is positioned to receive a bond wire provided from the wire outlet aperture. The clamp has at least two jaws movable relative to each other and arranged to grip the wire to align a central axis of the wire with the central axis of the chamber. The jaws are also movable along the central axis of the wire in order to pull the wire through the wire tensioning unit.

Abstract translation: 接合丝馈送系统具有线张紧单元，其具有具有线入口孔和线出口孔的腔室。 电线入口和出口孔具有与腔室的中心轴线对准的中心。 定位夹具以接收从线出口孔提供的接合线。 夹具具有至少两个可相对于彼此移动的夹爪，并布置成夹持线以将线的中心轴线与腔室的中心轴线对准。 夹爪也可以沿着导线的中心轴线移动，以便将线材拉过线材拉紧单元。

公开(公告)号：US09214413B2

公开(公告)日：2015-12-15

申请号：US14551069

申请日：2014-11-23

Applicant: Zhijie Wang ,  Zhigang Bai ,  Aipeng Shu ,  Yanbo Xu ,  Huchang Zhang ,  Fei Zong

Inventor： Zhijie Wang ,  Zhigang Bai ,  Aipeng Shu ,  Yanbo Xu ,  Huchang Zhang ,  Fei Zong

IPC: H01L21/50 ,  H01L23/495 ,  H01L21/56 ,  H01L23/373 ,  H01L23/42

CPC classification number: H01L23/49503 ,  H01L21/56 ,  H01L21/561 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49568 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A semiconductor die is packaged by providing a die assembly that includes a semiconductor die with an active surface and an opposite mounting surface with an attached thermally conductive substrate. The die assembly is mounted on a first surface of a lead frame die flag so that the thermally conductive substrate is sandwiched between the die flag and the semiconductor die. Bonding pads of the die are electrically connected with bond wires to lead frame lead fingers. A mold compound then encapsulates the semiconductor die, bond wires, and thermally conductive substrate. A second surface of the die flag is exposed through the mold compound.

Abstract translation: 通过提供包括具有活性表面的半导体管芯和具有附接的导热衬底的相对安装表面的管芯组件来封装半导体管芯。 模具组件安装在引线框架模具标记的第一表面上，使得导热基板夹在模具标记和半导体管芯之间。 管芯的接合焊盘与接合线电连接以引导框架引线指。 然后，模制化合物封装半导体管芯，接合线和导热衬底。 模具标记的第二表面通过模具化合物暴露。

公开(公告)号：US20150343510A1

公开(公告)日：2015-12-03

申请号：US14763585

申请日：2013-01-29

Applicant: Zhijie WANG ,  MingJen YU ,  TungYang HU ,  Kevin L. MASSARO ,  Chun-Pu CHEN ,  Dimitre MEHANDJIYSKY ,  HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Zhijie Wang ,  Ming-Jen Yu ,  Tung-Yang Hu ,  Kevin L. Massaro ,  Chun-Pu Chen ,  Dimitre D. Mehandjiysky

IPC: B21D5/16 ,  B21D53/00

CPC classification number: B21D5/16 ,  B21D53/00 ,  G06F1/1616 ,  G06F1/1656

Abstract: Bending members having slanted faces to engage folded edge portions of a housing panel, wherein the relative sliding movement between the folded edge portions and the bending members cause bending of each of the folded edge portions to an inwardly slanted angle.

Abstract translation: 具有倾斜面的弯曲构件接合壳体面板的折叠边缘部分，其中折叠边缘部分和弯曲构件之间的相对滑动运动导致每个折叠边缘部分弯曲成向内倾斜的角度。

公开(公告)号：US20150028468A1

公开(公告)日：2015-01-29

申请号：US14277061

申请日：2014-05-14

Applicant: Zhigang Bai ,  Zhijie Wang ,  Jinzhong Yao

Inventor： Zhigang Bai ,  Zhijie Wang ,  Jinzhong Yao

IPC: H01L23/08 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L24/85 ,  H01L21/4842 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/32245 ,  H01L2224/48245 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A no-lead type semiconductor package has a mold cap that forms a mold body. The corners of the mold body are reinforced with mold columns such that the corners have rounded protrusions and do not form 90° angles. The mold columns prevent the corner pads from peeling.

Abstract translation: 无引线型半导体封装具有形成模体的模盖。 模具体的角部用模具柱加强，使得拐角具有圆形的突起并且不形成90°的角度。 模具柱防止角垫脱落。

公开(公告)号：US20120326288A1

公开(公告)日：2012-12-27

申请号：US13489462

申请日：2012-06-06

Applicant: Meiquan Huang ,  Hejin Liu ,  Zhijie Wang ,  Dehong Ye ,  Hanmin Zhang

Inventor： Meiquan Huang ,  Hejin Liu ,  Zhijie Wang ,  Dehong Ye ,  Hanmin Zhang

IPC: H01L21/56 ,  H01L23/495

CPC classification number: H01L23/49582 ,  H01L21/4832 ,  H01L23/3107 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16245 ,  H01L2224/16258 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2924/00

Abstract: A method of assembling a semiconductor device includes providing a conductive lead frame panel and selectively half-etching a top side of the lead frame panel to provide a pin pads. A flip chip die is attached and electrically connected to the pin pads and then the lead frame panel and die are encapsulated with molding compound. A second selective half etching step is performed on a backside of the lead frame panel to form a plurality of separate input/output pins. The side walls of each input/output pin include arcuate surfaces in cross-section.

Abstract translation: 一种组装半导体器件的方法包括：提供导电引线框架面板，并选择性地半导体蚀刻引线框架面板的顶侧以提供引脚焊盘。 连接倒装芯片并电连接到引脚焊盘，然后将引线框架板和模具用模塑料封装。 在引线框板的背面执行第二选择性半蚀刻步骤，以形成多个单独的输入/输出引脚。 每个输入/输出销的侧壁包括横截面的弧形表面。

公开(公告)号：US07931186B2

公开(公告)日：2011-04-26

申请号：US12093403

申请日：2007-03-13

Applicant: Michael T. Deley ,  Peter M. Lister ,  Deepak Sood ,  Zhijie Wang

Inventor： Michael T. Deley ,  Peter M. Lister ,  Deepak Sood ,  Zhijie Wang

IPC: B23K31/00 ,  B23K11/00

CPC classification number: B23K20/004 ,  B23K2101/40 ,  H01L23/544 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/78901 ,  H01L2224/85121 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  Y10S228/904 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/05556 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.

Abstract translation: 提供了一种教导用于引线键合操作的眼点的方法。 该方法包括：（1）从半导体器件的区域中选择一组形状用作眼点，以及（2）使用（a）样品半导体器件或 （b）与半导体器件相关的预定数据。 教学步骤包括相对于彼此定义每个形状的位置。