公开(公告)号：US08779011B2

公开(公告)日：2014-07-15

申请号：US13405027

申请日：2012-02-24

Applicant: Deepak Mahulikar ,  Yuhu Wang ,  Ken A. Delbridge ,  Gert R. M. Moyaerts ,  Saeed H. Mohseni ,  Nichole R. Koontz ,  Bin Hu ,  Liqing Wen

Inventor： Deepak Mahulikar ,  Yuhu Wang ,  Ken A. Delbridge ,  Gert R. M. Moyaerts ,  Saeed H. Mohseni ,  Nichole R. Koontz ,  Bin Hu ,  Liqing Wen

IPC: C01B33/141 ,  C01B33/143 ,  C09C1/68 ,  C09K13/06

CPC classification number: C23F3/04 ,  C01B33/1435 ,  C01B33/1485 ,  C01P2004/62 ,  C01P2004/64 ,  C01P2006/80 ,  C09G1/02 ,  C09K3/1463 ,  C09K3/1472 ,  H01L21/31053 ,  H01L21/3212

Abstract: A method for producing and using an ultrapure colloidal silica dispersion is disclosed. The ultrapure colloidal silica dispersion has less than 200 ppb of each trace metal impurity disposed therein, excluding potassium and sodium, and less than 2 ppm residual alcohol. The method comprises dissolving a fumed silica in an aqueous solvent comprising an alkali metal hydroxide to produce an alkaline silicate solution, removing the alkali metal via ion exchange to generate a silicic acid solution, adjusting temperature, concentration and pH of said silicic acid solution to values sufficient to initiate nucleation and particle growth, and cooling the silicic acid solution at a rate sufficient to produce the colloidal silica dispersion.

Abstract translation: 公开了一种制备和使用超纯胶体二氧化硅分散体的方法。 超纯胶体二氧化硅分散体中含有少于200ppb的痕量金属杂质，不包括钾和钠，少于2ppm的残余醇。 该方法包括将热解法二氧化硅溶解在包含碱金属氢氧化物的水性溶剂中以产生碱性硅酸盐溶液，通过离子交换除去碱金属以产生硅酸溶液，将所述硅酸溶液的温度，浓度和pH值调节至数值 足以引发成核和颗粒生长，并以足以产生胶体二氧化硅分散体的速率冷却硅酸溶液。

公开(公告)号：US08404143B2

公开(公告)日：2013-03-26

申请号：US13402365

申请日：2012-02-22

Applicant: Hyungjun Kim ,  Richard Wen ,  Bin Hu ,  Minae Tanaka ,  Deepak Mahulikar

Inventor： Hyungjun Kim ,  Richard Wen ,  Bin Hu ,  Minae Tanaka ,  Deepak Mahulikar

IPC: C09K13/00

CPC classification number: H01L21/30625 ,  C09G1/02 ,  H01L21/3212 ,  H01L21/7684

Abstract: The present disclosure provides a concentrate for use in chemical mechanical polishing slurries, and a method of diluting that concentrate to a point of use slurry. The concentrate comprises abrasive, complexing agent, and corrosion inhibitor, and the concentrate is diluted with water and oxidizer. These components are present in amounts such that the concentrate can be diluted at very high dilution ratios, without affecting the polishing performance.

Abstract translation: 本公开提供了用于化学机械抛光浆料的浓缩物，以及将该浓缩物稀释到使用点浆料的方法。 浓缩物包括研磨剂，络合剂和缓蚀剂，浓缩物用水和氧化剂稀释。 这些组分的存在量使得浓缩物可以以非常高的稀释比稀释，而不影响抛光性能。

公开(公告)号：US20120145951A1

公开(公告)日：2012-06-14

申请号：US13402365

申请日：2012-02-22

Applicant: Hyungjun Kim ,  Richard Wen ,  Bin Hu ,  Minae Tanaka ,  Deepak Mahulikar

Inventor： Hyungjun Kim ,  Richard Wen ,  Bin Hu ,  Minae Tanaka ,  Deepak Mahulikar

IPC: C09K13/00 ,  C09K13/04

CPC classification number: H01L21/30625 ,  C09G1/02 ,  H01L21/3212 ,  H01L21/7684

Abstract: The present disclosure provides a concentrate for use in chemical mechanical polishing slurries, and a method of diluting that concentrate to a point of use slurry. The concentrate comprises abrasive, complexing agent, and corrosion inhibitor, and the concentrate is diluted with water and oxidizer. These components are present in amounts such that the concentrate can be diluted at very high dilution ratios, without affecting the polishing performance.

Abstract translation: 本公开提供了用于化学机械抛光浆料的浓缩物，以及将该浓缩物稀释到使用点浆料的方法。 浓缩物包括研磨剂，络合剂和缓蚀剂，浓缩物用水和氧化剂稀释。 这些组分的存在量使得浓缩物可以以非常高的稀释比稀释，而不影响抛光性能。

公开(公告)号：US20070254964A1

公开(公告)日：2007-11-01

申请号：US11818730

申请日：2007-06-15

Applicant: Deepak Mahulikar ,  Yuhu Wang ,  Ken Delbridge ,  Gert Moyaerts ,  Saeed Mohseni ,  Nichole Koontz ,  Bin Hu ,  Liqing Wen

Inventor： Deepak Mahulikar ,  Yuhu Wang ,  Ken Delbridge ,  Gert Moyaerts ,  Saeed Mohseni ,  Nichole Koontz ,  Bin Hu ,  Liqing Wen

IPC: B01F3/12 ,  B08B7/00

CPC classification number: C23F3/04 ,  C01B33/1435 ,  C01B33/1485 ,  C01P2004/62 ,  C01P2004/64 ,  C01P2006/80 ,  C09G1/02 ,  C09K3/1463 ,  C09K3/1472 ,  H01L21/31053 ,  H01L21/3212

Abstract: An ultrapure colloidal silica dispersion comprising colloidal silica particles having a mean or aggregate particle size from about 10 to about 200 nm, wherein the colloidal silica dispersion has less than 200 ppb of each trace metal impurity disposed therein, excluding potassium and sodium, and have less than 2 ppm residual alcohol.

Abstract translation: 一种超纯胶体二氧化硅分散体，其包含平均或聚集体粒径为约10至约200nm的胶体二氧化硅颗粒，其中所述胶体二氧化硅分散体在其中排列的不含钾和钠的痕量金属杂质少于200ppb， 超过2 ppm的残留酒精。

公开(公告)号：US06083840A

公开(公告)日：2000-07-04

申请号：US200518

申请日：1998-11-25

Applicant: Brian Mravic, deceased ,  Anthony Mark Pasqualoni ,  Deepak Mahulikar

Inventor： Brian Mravic, deceased ,  Anthony Mark Pasqualoni ,  Deepak Mahulikar

IPC: C09G1/02 ,  C09K3/14 ,  H01L21/321 ,  H01L21/00

CPC classification number: C09K3/1463 ,  C09G1/02 ,  C09K3/1436 ,  H01L21/3212

Abstract: The present invention relates to an improved chemical-mechanical polishing (CMP) method for polishing a copper coated wafer containing a copper adhesion-promoting layer and a silicon-based layer. The method polishes copper layers with high removal rates, low defect densities and reduced amounts of dishing and erosion. The method involves a two step process. The first step is to utilize a bulk copper removal slurry that rapidly removes the majority the copper on the substrate. The second step utilizes a 1:1:1 selectivity copper/tantalum/silicon dioxide (Cu/Ta/SiO.sub.2) slurry that has approximately the same polishing rates for the copper layer, the adhesion-promoting layer and the silicon-based substrate. The second slurry reduces the amount of dishing and erosion that occurs in the copper trenches and dense copper arrays.

Abstract translation: 本发明涉及一种用于抛光含铜粘合促进层和硅基层的铜涂层晶片的改进的化学机械抛光（CMP）方法。 该方法以高去除率，低缺陷密度和减少的凹陷和侵蚀量抛光铜层。 该方法涉及两步法。 第一步是使用快速去除基底上大部分铜的大量铜去除浆液。 第二步采用对铜层，粘合促进层和硅基底板具有大致相同抛光速率的1：1：1选择性铜/钽/二氧化硅（Cu / Ta / SiO2）浆料。 第二种浆料减少了在铜沟槽和致密铜阵列中发生的凹陷和腐蚀的量。

公开(公告)号：US5939214A

公开(公告)日：1999-08-17

申请号：US984147

申请日：1992-11-24

Applicant: Deepak Mahulikar ,  Jacob Crane ,  Abid Ali Khan

Inventor： Deepak Mahulikar ,  Jacob Crane ,  Abid Ali Khan

IPC: H01L23/10 ,  H01L23/373 ,  H01L23/433 ,  H01L23/495 ,  H01L33/00 ,  H01L23/28 ,  H01L23/36

CPC classification number: H01L23/4334 ,  H01L23/10 ,  H01L23/3735 ,  H01L23/49582 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01028 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  Y10T428/12569 ,  Y10T428/1275

Abstract: Composite materials for electronic packages are disclosed. The composite materials comprise a core layer and first and second cladding layers. The core and cladding layer compositions and thicknesses are selected to maximize thermal and electrical conductivity and to minimize the coefficient of thermal expansion of the composite. The composite material may be employed to fashion the package base, the leadframe, a heat spreader or combinations thereof. In one embodiment, a portion of the first cladding layer is removed so that an electronic device may be mounted directly to a high thermal conductivity core.

Abstract translation: 公开了用于电子封装的复合材料。 复合材料包括芯层和第一和第二覆层。 选择芯层和包覆层的组成和厚度以使热和电导率最大化并使复合材料的热膨胀系数最小化。 可以使用复合材料来形成封装基座，引线框架，散热器或其组合。 在一个实施例中，去除第一包层的一部分，使得电子器件可以直接安装到高导热性核心。

公开(公告)号：US5650592A

公开(公告)日：1997-07-22

申请号：US42913

申请日：1993-04-05

Applicant: Harvey Cheskis ,  Deepak Mahulikar

Inventor： Harvey Cheskis ,  Deepak Mahulikar

IPC: H01L23/06 ,  H01L23/14 ,  H01L23/373 ,  H01L23/02

CPC classification number: H01L23/3733 ,  H01L23/06 ,  H01L23/142 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16152 ,  H01L2924/167 ,  H01L2924/16787 ,  H01L2924/1679

Abstract: There is provided a component for use in electronic packaging. The component is a composite having a graphite matrix which is infiltrated with a metal or a metal alloy and the external surfaces of the composite then coated with a metallic layer to provide environmental and mechanical protection. The packaging components are lightweight, have a coefficient of thermal expansion close to that of a silicon based integrated circuit device and further, have a high coefficient of thermal conductivity.

Abstract translation: 提供了用于电子包装的部件。 组分是具有用金属或金属合金渗透的石墨基质的复合材料，然后复合材料的外表面涂覆有金属层以提供环境和机械保护。 封装部件重量轻，热膨胀系数接近硅基集成电路器件的热膨胀系数，并且还具有高导热系数。

公开(公告)号：US5629835A

公开(公告)日：1997-05-13

申请号：US277387

申请日：1994-07-19

Applicant: Deepak Mahulikar ,  Paul R. Hoffman ,  Jeffrey S. Braden

Inventor： Deepak Mahulikar ,  Paul R. Hoffman ,  Jeffrey S. Braden

IPC: H01L23/12 ,  H01L21/48 ,  H01L23/13 ,  H01L23/14 ,  H01L23/24 ,  H01L23/498 ,  H01L23/50 ,  H01L25/065 ,  H01L25/10 ,  H05K7/20 ,  H01L23/34

CPC classification number: H01L25/0657 ,  H01L21/4828 ,  H01L23/13 ,  H01L23/142 ,  H01L23/24 ,  H01L23/49816 ,  H01L25/105 ,  H01L2221/68377 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/1058 ,  H01L2225/1076 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01025 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/16152 ,  H01L2924/163 ,  H01L2924/181 ,  H01L2924/3025

Abstract: There is disclosed components for electronic packaging applications having integral bumps. A leadframe is formed by etching a metallic strip from one side to form outwardly extending, substantially perpendicular integral bumps. The metallic strip is then etched from the opposite side to form individual leads. When the integrally bumped component is an package base, fatigue of solder balls is reduced.

Abstract translation: 公开了具有整体凸块的用于电子封装应用的部件。 通过从一侧蚀刻金属带形成向外延伸的基本垂直的整体凸块来形成引线框架。 然后从相对侧蚀刻金属条形成单个引线。 当整体凸起的部件是封装基座时，焊球的疲劳减小。

公开(公告)号：US5506446A

公开(公告)日：1996-04-09

申请号：US450292

申请日：1995-05-25

Applicant: Paul R. Hoffman ,  George A. Brathwaite ,  Doanh D. Bui ,  Deepak Mahulikar

Inventor： Paul R. Hoffman ,  George A. Brathwaite ,  Doanh D. Bui ,  Deepak Mahulikar

IPC: H01L23/057 ,  H01L23/498 ,  H01L23/06 ,  H01L23/10

CPC classification number: H01L24/32 ,  H01L23/057 ,  H01L23/49861 ,  H01L2224/32013 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181

Abstract: There is provided a base for an electronic package. The base includes a peripheral portion for a polymer adhesive and a central portion for one or more semiconductor devices. A lead support is adjacent the substrate and located between the peripheral portion and the central portion. When a polymer adhesive bonds a leadframe to the package base, the lead support prevents deflection of the inner lead tips.

Abstract translation: 为电子包装提供了一个基地。 基座包括用于聚合物粘合剂的周边部分和用于一个或多个半导体器件的中心部分。 引线支撑件邻近基板并且位于周边部分和中心部分之间。 当聚合物粘合剂将引线框结合到封装基底时，引线支撑件防止内部引线端部的偏转。

公开(公告)号：US5403975A

公开(公告)日：1995-04-04

申请号：US114994

申请日：1993-08-31

Applicant: Anthony M. Pasqualoni ,  Deepak Mahulikar ,  Satish K. Jalota ,  Andrew J. Brock

Inventor： Anthony M. Pasqualoni ,  Deepak Mahulikar ,  Satish K. Jalota ,  Andrew J. Brock

IPC: C25D11/04 ,  C25D11/06 ,  C25D11/14 ,  H01L23/06 ,  H05K3/44 ,  H01L23/02

CPC classification number: C25D11/14 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01025 ,  H01L2924/01039 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16152 ,  H05K3/44

Abstract: A process for producing electronic package components from an aluminum alloy is disclosed. The components have a black color through integral color anodization. The desired color, thickness and surface finish are achieved by regulation of amperage during anodization. The amperage is rapidly raised to in excess of 80 amps per square foot and then allowed to gradually decrease as a function of oxide growth.

Abstract translation: 公开了一种从铝合金制造电子封装部件的方法。 这些组件通过整体颜色阳极氧化处理具有黑色。 所需的颜色，厚度和表面光洁度是通过在阳极氧化期间调节电流强度来实现的。 电流强度迅速升高至超过80安培/平方英尺，然后随着氧化物生长而逐渐降低。