公开(公告)号：US06268739B1

公开(公告)日：2001-07-31

申请号：US09478678

申请日：2000-01-06

申请人： William E. Bernier ,  Michael A. Gaynes ,  Wayne J. Howell ,  Mark V. Pierson ,  Ajit K. Trivedi ,  Charles G. Woychik

发明人： William E. Bernier ,  Michael A. Gaynes ,  Wayne J. Howell ,  Mark V. Pierson ,  Ajit K. Trivedi ,  Charles G. Woychik

IPC分类号： G01R3102

CPC分类号： G01R31/2886 ,  H01L2224/45144 ,  H01L2224/81385 ,  H01L2224/83101 ,  H05K3/321 ,  H01L2924/00

摘要： A method and device for testing and burning-in semiconductor circuits. The method and device permit the entire wafer to be tested by temporarily attaching the wafer to a test substrate using electrically conductive adhesive (ECA). The ECA conforms to deviations from co-planarity of the contact points of both the wafer and test substrate while providing a quality electrical connection at each point. ECA material can be deposited on either the wafer contacts or the substrate pads. In addition, the ECA may be deposited on C4 bumps or tin-capped lead bases. Variations in the method and device include filling vias of a non-conductive interposer with ECA. The electrical connection may be enhanced by forming conductive dendrites on test pads while the ECA is deposited on the wafer contacts. To further enhance the electrical connection, the ECA material can be plasma etched to remove some of its polymer matrix and to expose the electrically conductive particles on one side and then plating with palladium. After the palladium-plated ECA is brought into contact with aluminum pads, palladium-coated aluminum pads, or even C4 solder bumps, conductive dendrites are formed on the palladium-treated ECA bumps.

公开(公告)号：US06199751B1

公开(公告)日：2001-03-13

申请号：US09533196

申请日：2000-03-23

申请人： Michael A. Gaynes ,  Kostas I. Papathomas ,  Giana M. Phelan ,  Charles G. Woychik

发明人： Michael A. Gaynes ,  Kostas I. Papathomas ,  Giana M. Phelan ,  Charles G. Woychik

IPC分类号： B23K2000

CPC分类号： H01L24/31 ,  B23K35/0244 ,  B23K35/26 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29409 ,  H01L2224/29411 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2203/0425 ,  Y10T428/12014 ,  Y10T428/12181 ,  Y10T428/12569 ,  Y10T428/12646 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12903 ,  H01L2924/00 ,  H01L2924/00014

摘要： A technique of forming a metallurgical bond between pads on two surfaces is provided. A metal coating placed on each surface includes a first metal base layer and a second metal surface layer. The first and second metals include a low melting point constituent. A first ratio of the two metals forms a liquid phase with a second ratio of the two metals forming a solid phase. The volume of the base layer metal exceeds the volume necessary to form the solid phase between the base metal and the surface metal. Conductive metal particles are provided having a core metal and a coating metal dispersed in an uncured polymer material, at a volume fraction above the percolation threshold. The core metal and the coating metal together include a low melting point constituent. At a first ratio the components form a liquid phase and at a second ratio the two components form a solid phase. The polymer containing particles is placed between the two metal surfaces with the particles interfacing with each other and the surface layer of metal. The structure is heated to a temperature higher than the low melting liquid constituent to form a liquid phase which extends to include the surface of the pads and the surface of the particles, and thereafter form a solid phase by diffusion of the core material into the surface material and the base metal into the coating material.

摘要翻译： 提供了在两个表面上的焊盘之间形成冶金结合的技术。 放置在每个表面上的金属涂层包括第一金属基底层和第二金属表面层。 第一和第二种金属包括低熔点成分。 两种金属的第一比率形成液相，其中第二比例的两种金属形成固相。 基底层金属的体积超过在母材和表面金属之间形成固相所需的体积。 提供导电金属颗粒，其具有分散在未固化的聚合物材料中的芯金属和涂覆金属，其体积分数高于渗滤阈值。 核心金属和涂覆金属一起包括低熔点成分。 以第一比例，组分形成液相，并且以第二比例，两种组分形成固相。 含有聚合物的颗粒被放置在两个金属表面之间，其中颗粒彼此接合并且金属的表面层。 将该结构加热到比低熔点液体成分高的温度，形成液相，其延伸以包括焊盘的表面和颗粒的表面，然后通过将芯材扩散到表面中而形成固相 材料和贱金属进入涂料。

公开(公告)号：US08963310B2

公开(公告)日：2015-02-24

申请号：US13216918

申请日：2011-08-24

申请人： Kishor Desai ,  Qwai H. Low ,  Chok J. Chia ,  Charles G. Woychik ,  Huailiang Wei

发明人： Kishor Desai ,  Qwai H. Low ,  Chok J. Chia ,  Charles G. Woychik ,  Huailiang Wei

IPC分类号： H01L23/495 ,  H01L23/02 ,  H01L23/48 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L23/49575 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49531 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic assembly includes a substrate, a first and second microelectronic elements, a lead finger, electrical connections extending between contacts of the second microelectronic element and the lead fingers, and an encapsulant overlying at least portions of the first and second microelectronic elements, lead finger and electrical connections. The substrate has contacts at a first surface and terminals at an opposed second surface that are electrically connected with the substrate contacts. The first microelectronic element has contacts exposed at its front face. The front face of the first microelectronic element is joined to the substrate contacts. The second microelectronic element overlies the first microelectronic element and has contacts at a front face facing away from the substrate. The lead frame has lead fingers, wherein the second surface of the substrate and the lead fingers define a common interface for electrical interconnection to a component external to the microelectronic assembly.

摘要翻译： 微电子组件包括衬底，第一和第二微电子元件，引线指，在第二微电子元件的触点和引线指之间延伸的电连接，以及覆盖第一和第二微电子元件的至少一部分的引线指 和电气连接。 基板在第一表面具有接触，在相对的第二表面具有与基板触点电连接的端子。 第一微电子元件在其前面具有暴露的触点。 第一微电子元件的正面连接到基板触点。 第二微电子元件覆盖第一微电子元件并且在面向背离衬底的前面具有接触。 引线框架具有引线指，其中基板的第二表面和引线指限定用于与微电子组件外部的部件的电互连的公共接口。

公开(公告)号：US20130118784A1

公开(公告)日：2013-05-16

申请号：US13293698

申请日：2011-11-10

申请人： Cyprian Uzoh ,  Charles G. Woychik ,  Terrence Caskey ,  Belgacem Haba ,  Philip Damberg

发明人： Cyprian Uzoh ,  Charles G. Woychik ,  Terrence Caskey ,  Belgacem Haba ,  Philip Damberg

IPC分类号： H05K1/09 ,  H05K3/10

CPC分类号： H05K1/115 ,  H01L23/14 ,  H01L23/49827 ,  H01L23/49866 ,  H01L2924/0002 ,  H05K1/03 ,  H05K1/09 ,  H05K3/42 ,  H05K2201/0141 ,  H05K2201/0175 ,  H05K2201/09509 ,  H05K2201/10378 ,  H05K2203/025 ,  H05K2203/1105 ,  Y10T29/49165 ,  H01L2924/00

摘要： A component includes a support structure having first and second spaced-apart and parallel surfaces and a plurality of conductive elements extending in a direction between the first and second surfaces. Each conductive element contains an alloy of a wiring metal selected from the group consisting of copper, aluminum, nickel and chromium, and an additive selected from the group consisting of Gallium, Germanium, Indium, Selenium, Tin, Sulfur, Silver, Phosphorus, and Bismuth. The alloy has a composition that varies with distance in at least one direction across the conductive element. A concentration of the additive is less than or equal to 5% of the total atomic mass of the conductive element, and a resistivity of the conductive element is between 2.5 and 30 micro-ohm-centimeter.

公开(公告)号：US20130049179A1

公开(公告)日：2013-02-28

申请号：US13216918

申请日：2011-08-24

申请人： Kishor Desai ,  Qwai H. Low ,  Chok J. Chia ,  Charles G. Woychik ,  Huailiang Wei

发明人： Kishor Desai ,  Qwai H. Low ,  Chok J. Chia ,  Charles G. Woychik ,  Huailiang Wei

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49575 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49531 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic assembly includes a substrate, a first and second microelectronic elements, a lead finger, electrical connections extending between contacts of the second microelectronic element and the lead fingers, and an encapsulant overlying at least portions of the first and second microelectronic elements, lead finger and electrical connections. The substrate has contacts at a first surface and terminals at an opposed second surface that are electrically connected with the substrate contacts. The first microelectronic element has contacts exposed at its front face. The front face of the first microelectronic element is joined to the substrate contacts. The second microelectronic element overlies the first microelectronic element and has contacts at a front face facing away from the substrate. The lead frame has lead fingers, wherein the second surface of the substrate and the lead fingers define a common interface for electrical interconnection to a component external to the microelectronic assembly.

公开(公告)号：US20100317972A1

公开(公告)日：2010-12-16

申请号：US12485226

申请日：2009-06-16

申请人： Charles Edward Baumgartner ,  Jean-Francois Gelly ,  Lowell Smith ,  Charles G. Woychik ,  Frederic Lanteri ,  Stephen Edwardsen ,  Robert S. Lewandowski

发明人： Charles Edward Baumgartner ,  Jean-Francois Gelly ,  Lowell Smith ,  Charles G. Woychik ,  Frederic Lanteri ,  Stephen Edwardsen ,  Robert S. Lewandowski

IPC分类号： A61B8/14

CPC分类号： G10K11/002 ,  A61B8/4483 ,  A61B8/483

摘要： A system for improving the acoustic performance of an ultrasound transducer by reducing artifacts within the acoustic spectrum is disclosed. The system includes an acoustic layer having an array of acoustic elements, a dematching layer coupled to the acoustic layer and having an acoustic impedance greater than an acoustic impedance of the acoustic layer, and an interposer layer coupled to the dematching layer and comprising a substrate and a plurality of conductive element. The interposer layer is formed to have an acoustic impedance lower than the acoustic impedance of the dematching layer. The ultrasound transducer also includes an integrated circuit coupled to the interposer layer and electrically connected to the array of acoustic elements through the dematching layer and the interposer layer.

摘要翻译： 公开了一种通过减少声谱内的伪像来改善超声换能器的声学性能的系统。 该系统包括具有声学元件阵列的声学层，耦合到声学层并且具有大于声学层的声学阻抗的声阻抗的解映射层，以及耦合到分离层的中介层，并且包括衬底和 多个导电元件。 内插层形成为具有低于分配层的声阻抗的声阻抗。 超声波换能器还包括耦合到插入层的集成电路，并通过分配层和插入层电连接到声学元件阵列。

公开(公告)号：US20080165921A1

公开(公告)日：2008-07-10

申请号：US11619990

申请日：2007-01-04

申请人： John Eric Tkaczyk ,  Jonathan D. Short ,  Yanfeng Du ,  James wilson Rose ,  Charles G. Woychik

发明人： John Eric Tkaczyk ,  Jonathan D. Short ,  Yanfeng Du ,  James wilson Rose ,  Charles G. Woychik

IPC分类号： G01N23/083 ,  G01T1/20

CPC分类号： A61B6/032 ,  A61B6/4291 ,  A61B6/482

摘要： A detector module for a CT imaging system is provided. The detector module includes a sensor element to convert x-rays to electrical signals. The sensor element is coupled to a data acquisition system (DAS) via an interconnect system, the DAS comprised of an electronic substrate and an integrated circuit. The interconnect system couples the sensor element, electronic substrate, and integrated circuit by way of a contact pad interconnect together with a wire bond interconnect or an additional contact pad interconnect.

摘要翻译： 提供了用于CT成像系统的检测器模块。 检测器模块包括用于将x射线转换成电信号的传感器元件。 传感器元件经由互连系统耦合到数据采集系统（DAS），DAS由电子基板和集成电路组成。 互连系统通过接触焊盘互连与引线接合互连或附加接触焊盘互连将传感器元件，电子基板和集成电路耦合。

公开(公告)号：US06639302B2

公开(公告)日：2003-10-28

申请号：US10103602

申请日：2002-03-20

申请人： Krishna Darbha ,  Miguel A. Jimarez ,  Matthew M. Reiss ,  Sanjeev B. Sathe ,  Charles G. Woychik

发明人： Krishna Darbha ,  Miguel A. Jimarez ,  Matthew M. Reiss ,  Sanjeev B. Sathe ,  Charles G. Woychik

IPC分类号： H01L2906

CPC分类号： H01L23/49833 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15151 ,  H01L2924/00012

摘要： A method and structure to electrically couple a semiconductor device to a substrate that is divided into a plurality of segments. Alternatively, a semiconductor device may be divided into a plurality of segments and the plurality of segments are electrically coupled to a single substrate.

摘要翻译： 将半导体器件电耦合到被分成多个段的衬底的方法和结构。 或者，半导体器件可以被分成多个段，并且多个段电耦合到单个衬底。

公开(公告)号：US06570259B2

公开(公告)日：2003-05-27

申请号：US09814789

申请日：2001-03-22

申请人： David J. Alcoe ,  Eric A. Johnson ,  Matthew M. Reiss ,  Charles G. Woychik

发明人： David J. Alcoe ,  Eric A. Johnson ,  Matthew M. Reiss ,  Charles G. Woychik

IPC分类号： H01L2348

CPC分类号： H01L21/563 ,  H01L23/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01004 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2224/05639 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655

摘要： The present invention provides a package for a semiconductor chip that minimizes stresses and strains that arise from differential thermal expansion on chip-to-substrate or chip-to-card interconnections. A collar element of one or more elements is provided. Adhesive material connects the collar element to the electric device and to the substrate that supports it, forming a unitary electrical package.

公开(公告)号：US6087021A

公开(公告)日：2000-07-11

申请号：US86399

申请日：1998-05-28

申请人： Michael A. Gaynes ,  Kostas I. Papathomas ,  Giana M. Phelan ,  Charles G. Woychik

发明人： Michael A. Gaynes ,  Kostas I. Papathomas ,  Giana M. Phelan ,  Charles G. Woychik

IPC分类号： B23K35/02 ,  B23K35/14 ,  B23K35/26 ,  H01L21/60 ,  H05K3/32 ,  B22F7/00

CPC分类号： H01L24/31 ,  B23K35/0244 ,  H01L24/29 ,  H01L24/83 ,  H05K3/321 ,  B23K35/26 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29409 ,  H01L2224/29411 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K2201/0218 ,  H05K2203/0425 ,  Y10T428/12014 ,  Y10T428/12181 ,  Y10T428/12569 ,  Y10T428/12646 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12903

摘要： A technique of forming a metallurgical bond between pads on two surfaces is provided. A metal coating placed on each surface includes a first metal base layer and a second metal surface layer. The first and second metals include a low melting point constituent. A first ratio of the two metals forms a liquid phase with a second ratio of the two metals forming a solid phase. The volume of the base layer metal exceeds the volume necessary to form the solid phase between the base metal and the surface metal. Conductive metal particles are provided having a core metal and a coating metal dispersed in an uncured polymer material, at a volume fraction above the percolation threshold. The core metal and the coating metal together include a low melting point constituent. At a first ratio the components form a liquid phase and at a second ratio the two components form a solid phase. The polymer containing particles is placed between the two metal surfaces with the particles interfacing with each other and the surface layer of metal. The structure is heated to a temperature higher than the low melting liquid constituent to form a liquid phase which extends to include the surface of the pads and the surface of the particles, and thereafter form a solid phase by diffusion of the core material into the surface material and the base metal into the coating material.

摘要翻译： 提供了在两个表面上的焊盘之间形成冶金结合的技术。 放置在每个表面上的金属涂层包括第一金属基底层和第二金属表面层。 第一和第二种金属包括低熔点成分。 两种金属的第一比率形成液相，其中第二比例的两种金属形成固相。 基底层金属的体积超过在母材和表面金属之间形成固相所需的体积。 提供导电金属颗粒，其具有分散在未固化的聚合物材料中的芯金属和涂覆金属，其体积分数高于渗滤阈值。 核心金属和涂覆金属一起包括低熔点成分。 以第一比例，组分形成液相，并且以第二比例，两种组分形成固相。 含有聚合物的颗粒被放置在两个金属表面之间，其中颗粒彼此接合并且金属的表面层。 将该结构加热到比低熔点液体成分高的温度，形成液相，其延伸以包括焊盘的表面和颗粒的表面，然后通过将芯材扩散到表面中而形成固相 材料和贱金属进入涂料。