公开(公告)号：US20100187700A1

公开(公告)日：2010-07-29

申请号：US12310539

申请日：2007-08-29

申请人： Karl Weidner

发明人： Karl Weidner

IPC分类号： H01L23/28 ,  H01L21/31 ,  B32B37/00

CPC分类号： H01L23/3121 ,  H01L21/56 ,  H01L23/3164 ,  H01L24/24 ,  H01L24/76 ,  H01L24/82 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24998 ,  H01L2224/82007 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19041 ,  H05K3/284 ,  H05K2201/10674 ,  H05K2203/0537 ,  H05K2203/063 ,  H05K2203/074 ,  H05K2203/1311

摘要： A substrate which has at least one component, such as a semiconductor chip, arranged on it is manufactured from a film made of plastic material laminated onto a surface of the substrate and of the at least one component, where the surface has at least one contact area. First, the film to be laminated onto the surface of the substrate and the at least one component, or a film composite including the film, is arranged in a chamber such that the chamber is split by the film or film composite into a first chamber section and a second chamber section, which is isolated from the first chamber section so as to be gastight. A higher atmospheric pressure is provided or produced in the first chamber section than in the second chamber section; and contact is made between the surface of the substrate arranged in the second chamber section and the at least one component and the film or the film composite, which contact brings about the lamination of the film onto the surface.

摘要翻译： 具有布置在其上的至少一个组件（例如半导体芯片）的衬底由层压到衬底的表面上的塑料材料制成的薄膜和至少一个组件制成，其中表面具有至少一个触点 区。 首先，将要层压在基材表面上的薄膜和至少一种组分或包含该薄膜的薄膜复合材料布置在室中，使得该腔室被薄膜或薄膜复合材料分裂成第一腔室部分 以及第二室部分，其与第一室部分隔离以便气密。 在第一室部分中提供或产生比在第二室部分中更高的大气压力; 并且在布置在第二室部分中的基板的表面与至少一个部件以及膜或膜复合物之间形成接触，该接触引起膜在表面上的层压。

公开(公告)号：US20090278157A1

公开(公告)日：2009-11-12

申请号：US11991197

申请日：2006-08-30

申请人： Karl Weidner

发明人： Karl Weidner

IPC分类号： H01L33/00 ,  H01L21/56

CPC分类号： H01L23/482 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0655 ,  H01L33/44 ,  H01L33/62 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/82007 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/12044 ,  H01L2924/351 ,  H01L2924/00

摘要： In a method for producing a semiconductor component, in particular a semiconductor structure having a surface structure or topography which is produced by means of electronic components (2) on a substrate (1), at least one electronic component (2) is applied to a substrate (1), and an isolation layer (3) is applied to the topography which is produced by means of the at least one component (2) on the substrate (1). Contact-making openings (5) are then produced in the isolation layer (3) at contact points (8, 9) for the at least one electronic component, the isolation layer (3) and the contact points (8, 9) in the contact-making openings (5) are planar-metallized, and the metallization is structured in order to produce electrical connections (4), with the isolation layer (3) having a glass coating.

摘要翻译： 在用于制造半导体部件的方法中，特别是具有通过基板（1）上的电子部件（2）制造的表面结构或形貌的半导体结构，至少一个电子部件（2）被施加到 衬底（1）和隔离层（3）施加到通过衬底（1）上的至少一个部件（2）产生的形貌。 然后在用于至少一个电子部件的接触点（8,9）的隔离层（3）中产生接触制作开口（5），隔离层（3）和接触点（8,9） 接触开口（5）是平面金属化的，并且金属化被构造为产生电连接（4），隔离层（3）具有玻璃涂层。

公开(公告)号：US20070036944A1

公开(公告)日：2007-02-15

申请号：US10571668

申请日：2004-09-01

申请人： Franz Auerbach ,  Reinhold Bayerer ,  Thomas Licht ,  Karl Weidner

发明人： Franz Auerbach ,  Reinhold Bayerer ,  Thomas Licht ,  Karl Weidner

IPC分类号： D04G1/00 ,  G11B5/64

CPC分类号： H01L23/3737 ,  H01L23/3735 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/3025 ,  Y10T428/24355 ,  Y10T428/24777 ,  Y10T442/10 ,  H01L2924/00

摘要： An electrical component is mounted on a substrate. At least one electrical insulation film is provided to electrically insulate the component and at least section of the insulation film is connected to the component and the substrate, in such a way that the surface contours of said section of the insulation film are moulded to the surface contours formed by the component and the substrate. The insulation film has dielectric strength in relation to an electric field strength of more than 10 kV/mm and preferably more than 50 kV/mm. To produce the assembly, the insulation film is laminated onto the substrate, preferably by means of a vacuum. The component is in particular a power semiconductor component.

摘要翻译： 电气部件安装在基板上。 提供至少一个电绝缘膜以使部件电绝缘，并且绝缘膜的至少一部分连接到部件和基板，使得绝缘膜的所述部分的表面轮廓模制到表面 由部件和基板形成的轮廓。 绝缘膜的电场强度相对于10kV / mm以上，优选为50kV / mm以上的电场强度。 为了制造组件，绝缘膜优选地通过真空层压到衬底上。 该部件特别是功率半导体部件。

公开(公告)号：US5438523A

公开(公告)日：1995-08-01

申请号：US259242

申请日：1994-06-13

申请人： Siegfried Humm ,  Gabor Palosi ,  Karl Weidner

发明人： Siegfried Humm ,  Gabor Palosi ,  Karl Weidner

IPC分类号： B65G1/137 ,  B65G61/00 ,  G06Q50/00 ,  G07F5/18 ,  G07F5/26 ,  G07F11/16 ,  G07F11/58 ,  G07F11/62 ,  G06F19/00

CPC分类号： G07F5/18 ,  G07F11/002 ,  G07F11/16 ,  G07F11/58 ,  G07F11/62 ,  G07F5/26

摘要： An apparatus is provided for delivering assembly and machining expendable materials or tools. The apparatus has an internal continuous mechanism with different compartment rows arranged in rotary manner and to move past a removal door row. An embodiment having relatively stationary compartments and movable doors to align with a selected compartment is also disclosed. An inputting keyboard for the positioning of the particular compartment row in front of the removal door row also controls the unlocking of a door in the door row associated with the selected compartment. The delivery unit is connected by means of a long-range transmission means to a data processing unit, which records the removal of the materials and optionally initiates reloading, billing, etc.

摘要翻译： 提供了一种用于传送组件和加工消耗性材料或工具的装置。 该装置具有内部连续机构，其具有以旋转方式布置的不同的隔间列，并移动经过拆卸门排。 还公开了一种具有相对固定隔间和与所选隔间对准的活动门的实施例。 用于将特定隔室排定位在拆卸门排前面的输入键盘还控制与所选隔间相关联的门排中的门的解锁。 传送单元通过远程传输装置连接到数据处理单元，该数据处理单元记录材料的移除并可选地启动重新加载，计费等。

公开(公告)号：US09159889B2

公开(公告)日：2015-10-13

申请号：US13811846

申请日：2011-07-15

申请人： Karl Weidner ,  Johann Ramchen ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann ,  Stefan Gruber ,  Georg Bogner

发明人： Karl Weidner ,  Johann Ramchen ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann ,  Stefan Gruber ,  Georg Bogner

IPC分类号： H01L33/60 ,  H01L33/20 ,  H01L33/38 ,  H01L33/58 ,  G02F1/1335 ,  H01L25/075 ,  H01L33/40 ,  H01L33/46

CPC分类号： H01L33/60 ,  G02F1/133603 ,  H01L25/0753 ,  H01L25/0756 ,  H01L33/20 ,  H01L33/38 ,  H01L33/405 ,  H01L33/46 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

摘要： A radiation-emitting component includes a semiconductor chip which has a first main surface, a second main surface on an opposite side from the first main surface and an active region that generates radiation; a carrier on which the semiconductor chip is fixed on the side of the second main surface; an output layer arranged on the first main surface of the semiconductor chip and forming a lateral output surface spaced apart from the semiconductor chip in a lateral direction, a recess tapering in a direction of the semiconductor chip being, formed in the output layer and deflecting radiation emerging from the first main surface during operation into the direction of the lateral output surface.

摘要翻译： 辐射发射部件包括半导体芯片，其具有第一主表面，与第一主表面相对的第二主表面和产生辐射的有源区域; 半导体芯片固定在第二主表面侧的载体; 输出层，布置在半导体芯片的第一主表面上，并在横向上形成与半导体芯片间隔开的横向输出表面，在输出层中形成在半导体芯片的方向上渐缩的凹部和偏转辐射 在运行过程中从第一主表面向侧向输出表面的方向出现。

公开(公告)号：US08901592B2

公开(公告)日：2014-12-02

申请号：US13822367

申请日：2011-08-22

申请人： Karl Weidner ,  Johann Ramchen ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann

发明人： Karl Weidner ,  Johann Ramchen ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann

IPC分类号： H01L33/62 ,  H01L33/60 ,  H01L23/00 ,  H01L23/055 ,  H01L33/50 ,  H01L33/54

CPC分类号： H01L33/60 ,  H01L23/055 ,  H01L24/18 ,  H01L24/24 ,  H01L24/82 ,  H01L33/505 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/24 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244

摘要： An optoelectronic component includes a carrier having a first connection region and a second connection region, a radiation-emitting semiconductor chip having a base surface and a radiation exit surface opposite the base surface, wherein the semiconductor chip is arranged by the base surface on the carrier, a housing having a lower housing part arranged on the carrier and adjoining side flanks of the semiconductor chip, and an upper housing part arranged on the lower housing part and shaped as a reflector for radiation emitted by the semiconductor chip, and an electrical connection layer which leads from the radiation exit surface of the semiconductor chip via a part of the interface between the lower and the upper housing part and through the lower housing part to the first connection region on the carrier.

摘要翻译： 光电子部件包括具有第一连接区域和第二连接区域的载体，具有基底表面和与基底表面相对的辐射出射表面的辐射发射半导体芯片，其中半导体芯片由载体上的基底表面布置 ，具有布置在所述载体上的下壳体部分和所述半导体芯片的相邻侧面的壳体，以及布置在所述下壳体部分上并形成为由所述半导体芯片发射的辐射的反射器的上壳体部分，以及电连接层 其从半导体芯片的辐射出射表面经由下壳体部分和上壳体部分之间的界面的一部分穿过下壳体部分到达载体上的第一连接区域。

公开(公告)号：US08591689B2

公开(公告)日：2013-11-26

申请号：US12224175

申请日：2006-12-20

申请人： Jörg Naundorf ,  Karl Weidner ,  Hans Wulkesch

发明人： Jörg Naundorf ,  Karl Weidner ,  Hans Wulkesch

IPC分类号： B29C65/00 ,  B32B37/00 ,  B32B38/04

CPC分类号： H01L23/3164 ,  B29C63/02 ,  B29C2793/00 ,  B29L2031/3061 ,  H01L21/56 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19041 ,  Y10T156/1054 ,  Y10T156/1092 ,  Y10T156/1093 ,  H01L2924/00

摘要： A method for selectively producing film laminates for packaging and for insulating unpackaged electronic components and functional patterns and corresponding device. The method coat surface regions of functional patterns arranged on a substrate and/or of surface regions of semiconductor chips arranged on the substrate. An insulation is to be effectively adapted in its properties to different requirements of functional patterns and/or electronic components. Film regions are laminated on surface regions in such a way that the properties of the plastics material of the film regions are adapted to the function of the film. This adaptation is individual and selective. Various films are used. The method is suitable in particular for coating or packaging electronic components or active and passive devices.

摘要翻译： 一种用于选择性地生产用于包装和用于绝缘未封装的电子部件和功能图案以及相应的装置的薄膜层压板的方法。 布置在衬底和/或布置在衬底上的半导体芯片的表面区域上的功能图案的方法涂层表面区域。 绝缘材料的特性要适应功能图案和/或电子部件的不同要求。 膜区域以这样的方式层压在表面区域上，使得膜区域的塑料材料的性质适合于膜的功能。 这种适应是个人和选择性的。 使用各种胶片。 该方法特别适用于涂覆或包装电子部件或主动和被动装置。

公开(公告)号：US20120228663A1

公开(公告)日：2012-09-13

申请号：US13394058

申请日：2010-08-05

申请人： Karl Weidner ,  Ralph Wirth ,  Axel Kaltenbacher ,  Walter Wegleiter

发明人： Karl Weidner ,  Ralph Wirth ,  Axel Kaltenbacher ,  Walter Wegleiter

IPC分类号： H01L33/62

CPC分类号： H01L33/44 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/62 ,  H01L2224/24101 ,  H01L2224/24105 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00

摘要： An optoelectronic component comprising at least one semiconductor body having a radiation exit side, said semiconductor body being arranged by a side lying opposite the radiation exit side on a substrate, wherein at least one electrical connection region, on which a metallization bump is arranged, is arranged on the radiation exit side, the semiconductor body is at least partly provided with an insulating layer, wherein the metallization bump projects beyond the insulating layer, and at least one planar conductor structure is arranged on the insulating layer for the purpose of making contact with the semiconductor body in planar fashion, said conductor structure being electrically conductively connected to the electrical connection region by the metallization bump.

摘要翻译： 一种光电子部件，包括至少一个具有辐射出射侧的半导体本体，所述半导体本体由与衬底上的辐射出口侧相对的一侧设置，其中至少一个电连接区域上布置有金属化凸块， 布置在辐射出口侧，半导体本体至少部分地设置有绝缘层，其中金属化凸块突出超过绝缘层，并且至少一个平面导体结构布置在绝缘层上，用于与 所述半导体本体为平面形式，所述导体结构通过所述金属化凸块与所述电连接区域导电连接。

公开(公告)号：US20120223360A1

公开(公告)日：2012-09-06

申请号：US13505283

申请日：2010-10-05

申请人： Bernd Barchmann ,  Axel Kal Tenbacher ,  Norbert Stath ,  Walter Wegleiter ,  Karl Weidner ,  Ralph Wirth

发明人： Bernd Barchmann ,  Axel Kal Tenbacher ,  Norbert Stath ,  Walter Wegleiter ,  Karl Weidner ,  Ralph Wirth

IPC分类号： H01L33/48

CPC分类号： H01L33/62 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0753 ,  H01L2224/24998 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/00

摘要： An opto-electronic component has a carrier element (3) with a connection region (5). Arranged on the carrier element (3) is a semiconductor chip (7). A contact region (10) is mounted on the surface (8) of the semiconductor chip (7) remote from the carrier element (3). The connection region (5) is electrically conductively connected to the contact region (10) by way of an unsupported conductive structure (13). A method for manufacturing an opto-electronic component is described.

摘要翻译： 光电子部件具有带有连接区域（5）的载体元件（3）。 在载体元件（3）上排列的是半导体芯片（7）。 接触区域（10）安装在远离载体元件（3）的半导体芯片（7）的表面（8）上。 连接区域（5）通过未支撑的导电结构（13）导电地连接到接触区域（10）。 描述了一种用于制造光电子部件的方法。

公开(公告)号：US20120119233A1

公开(公告)日：2012-05-17

申请号：US13320304

申请日：2010-07-19

申请人： Karl Weidner ,  Ralph Wirth ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann ,  Oliver Wutz ,  Jan Marfeld

发明人： Karl Weidner ,  Ralph Wirth ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann ,  Oliver Wutz ,  Jan Marfeld

IPC分类号： H01L33/60 ,  H01L33/08 ,  H01L33/62

CPC分类号： H01L33/0079 ,  H01L23/3107 ,  H01L23/3185 ,  H01L25/042 ,  H01L25/0753 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/02322 ,  H01L31/02327 ,  H01L31/1892 ,  H01L33/483 ,  H01L33/486 ,  H01L33/502 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

摘要： A method for producing an optoelectronic semiconductor component includes providing a carrier; arranging at least one optoelectronic semiconductor chip at a top side of the carrier; shaping a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body covers all side areas of the at least one optoelectronic semiconductor chip, and wherein a surface facing away from the carrier at the top side and/or a surface facing the carrier at the underside of the at least one semiconductor chip remains substantially free of the shaped body or is exposed, and removing the carrier.

摘要翻译： 一种光电子半导体部件的制造方法，包括提供载体; 在载体的顶侧布置至少一个光电子半导体芯片; 在所述至少一个光电半导体芯片周围成形成形体，其中所述成形体覆盖所述至少一个光电半导体芯片的所有侧面区域，并且其中，在顶侧处背离所述载体的表面和/或面向所述至少一个光电半导体芯片的表面 在至少一个半导体芯片的下侧的载体保持基本上没有成形体或暴露，并且移除载体。