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公开(公告)号：US20190221541A1
公开(公告)日：2019-07-18
申请号：US16365007
申请日：2019-03-26
Applicant: NICHIA CORPORATION
Inventor： Hiroto TAMAKI , Takuya NAKABAYASHI
CPC classification number: H01L24/97 , H01L33/486 , H01L33/505 , H01L33/56 , H01L2224/16225 , H01L2224/48091 , H01L2933/0041 , H01L2924/00014
Abstract: A light emitting device includes first and second light emitting elements, first and second color conversion material layers, a support member and a light reflective member. The first color conversion material layer has a first color conversion surface facing a first light extraction surface of the first light emitting element. The second color conversion material layer has a second color conversion surface facing a second light extraction surface of the second light emitting element. The support member supports the first and second color conversion material layers. The light reflective member covers a first side surface of the first light emitting element and a second side surface of the second light emitting element. At least a part of an upper surface of the light reflective member is positioned closer to the support member than the first color conversion material layer and the second color conversion material layer.
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公开(公告)号：US20180151786A1
公开(公告)日：2018-05-31
申请号：US15879812
申请日：2018-01-25
Applicant: NICHIA CORPORATION
Inventor： Suguru BEPPU , Yoichi BANDO , Hiroto TAMAKI , Takuya NAKABAYASHI
CPC classification number: H01L33/60 , H01L33/50 , H01L2224/73253 , H01L2933/0033 , H01L2933/0041 , H01L2933/0058
Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.
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公开(公告)号：US20170287883A1
公开(公告)日：2017-10-05
申请号：US15623211
申请日：2017-06-14
Applicant: NICHIA CORPORATION
Inventor： Yukitoshi MARUTANI , Hiroto TAMAKI , Tadaaki MIYATA
IPC: H01L25/075
CPC classification number: H01L25/0753 , F21K9/27 , F21Y2103/10 , F21Y2115/10 , H01L33/50 , H01L33/60 , H01L33/62 , H01L2224/16
Abstract: A method of manufacturing a light-emitting device includes steps of: preparing at least one substrate having a plurality of through holes; providing an electric wire on a rear surface side of the substrate so that a plurality of portions of the electric wire communicates with a front surface side of the substrate at the plurality of through holes of the substrate; and respectively mounting a plurality of light-emitting diodes to the respective portions of the electric wire that communicate with the front surface side of the substrate.
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公开(公告)号：US20170229627A1
公开(公告)日：2017-08-10
申请号：US15494801
申请日：2017-04-24
Applicant: NICHIA CORPORATION
Inventor： Takuya NAKABAYASHI , Yoshitaka BANDO , Hiroto TAMAKI
IPC: H01L33/62 , H01L21/48 , H01L23/495
CPC classification number: H01L23/49537 , H01L21/4828 , H01L23/49503 , H01L23/49544 , H01L23/49551 , H01L23/49562 , H01L23/49582 , H01L33/486 , H01L33/62 , H01L2924/0002 , H01L2933/0066 , H01L2924/00
Abstract: A lead frame includes a plurality of units connected together. Each unit includes a pair of lead portions spaced apart from and opposite to each other. The lead portions are configured to mount a semiconductor element and to be electrically connected to a pair of electrodes of the semiconductor element. Each lead portion includes two hook-shaped portions respectively extending from the lead portion. The hook-shaped portions of one lead portion are arranged to surround tip portions of the hook-shaped portions of the other lead portion respectively, at both sides respective to a center line of the unit.
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公开(公告)号：US20170200868A1
公开(公告)日：2017-07-13
申请号：US15468540
申请日：2017-03-24
Applicant: NICHIA CORPORATION
Inventor： Takuya NAKABAYASHI , Takeshi IKEGAMI , Tadaaki IKEDA , Tadao HAYASHI , Hiroto TAMAKI
CPC classification number: H01L33/486 , H01L24/97 , H01L25/13 , H01L33/387 , H01L33/502 , H01L33/54 , H01L33/62 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/00
Abstract: A light emitting device includes a base body, a light emitting element and a sealing member. The base body includes a base material and a pair of connection terminals on at least a first main surface of the base material. The light emitting element is connected to the connection terminals. The sealing member seals the light emitting element. The sealing member includes a light transmissive member disposed on an upper surface of the light emitting element, and a light shielding member sealing an end surface of the light emitting element and an end surface of the light transmissive member. The base material has a linear expansion coefficient within ±10 ppm/° C. of a linear expansion coefficient of the light emitting element.
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Patent Agency Ranking
公开(公告)号：US20160329475A1
公开(公告)日：2016-11-10
申请号：US15214934
申请日：2016-07-20
Applicant: NICHIA CORPORATION
Inventor： Ryoma SUENAGA , Hiroto TAMAKI
CPC classification number: H01L33/62 , H01L24/96 , H01L25/167 , H01L33/005 , H01L33/007 , H01L33/0079 , H01L33/0095 , H01L33/36 , H01L33/486 , H01L33/52 , H01L33/56 , H01L2924/01322 , H01L2924/12035 , H01L2924/12042 , H01L2924/15788 , H01L2933/0016 , H01L2933/0066 , H01L2924/00
Abstract: A light emitting device includes a light emitting element, a terminal substrate and a fixing member. The light emitting element is a semiconductor laminate having a first semiconductor layer, a light emitting layer, and a second semiconductor layer that are laminated in that order, a first electrode connected to the first semiconductor layer, and a second electrode connected to the second semiconductor layer. The terminal substrate includes a pair of terminals connected to the first electrode and the second electrode, and an insulator layer that fixes the terminals. At least a part of the outer edges of the terminal substrate is disposed more to a center of the light emitting device than the outer edges of the semiconductor laminate. The fixing member fixes the light emitting element and the terminal substrate.
Abstract translation: 发光器件包括发光元件，端子基板和固定元件。 发光元件是具有第一半导体层，发光层和第二半导体层的半导体层叠体，其顺序层叠，与第一半导体层连接的第一电极和与第二半导体连接的第二电极 层。 端子基板包括连接到第一电极和第二电极的一对端子和固定端子的绝缘体层。 端子衬底的外边缘的至少一部分比半导体层叠体的外边缘更靠近发光器件的中心。 固定构件固定发光元件和端子基板。
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公开(公告)号：US20160079506A1
公开(公告)日：2016-03-17
申请号：US14950136
申请日：2015-11-24
Applicant: NICHIA CORPORATION
Inventor： Takuya NAKABAYASHI , Hiroto TAMAKI
CPC classification number: H01L33/62 , H01L25/167 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/486 , H01L33/502 , H01L33/56 , H01L33/60 , H01L33/647 , H01L2224/16225 , H01L2224/48091 , H01L2924/0002 , H01L2924/181 , H05K1/0274 , H05K1/0298 , H05K1/0306 , H05K1/09 , H05K1/115 , H05K1/181 , H05K1/185 , H05K3/282 , H05K2201/0209 , H05K2201/0326 , H05K2201/10106 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A wiring substrate includes ceramic layers and a conductive member. The ceramic layers have an uppermost ceramic layer and a lowermost ceramic layer. The conductive member includes an upper conductive layer disposed on an upper surface of the uppermost ceramic layer, an internal conductive layer interposed between the ceramic layers, and a lower conductive layer disposed on a lower surface of the lowermost ceramic layer. The conductive member defines vias electrically connecting the upper conductive layer, the internal conductive layer, and the lower conductive layer. A total number of a first vias connected to the lower conductive layer is larger than a total number of a second vias connected to the upper conductive layer.
Abstract translation: 布线基板包括陶瓷层和导电构件。 陶瓷层具有最上层的陶瓷层和最下层的陶瓷层。 导电构件包括设置在最上层陶瓷层的上表面上的上导电层，介于陶瓷层之间的内导电层和设置在最下陶瓷层下表面的下导电层。 导电构件限定了将上导电层，内导电层和下导电层电连接的通孔。 连接到下导电层的第一通孔的总数大于连接到上导电层的第二通孔的总数。
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公开(公告)号：US20150181711A1
公开(公告)日：2015-06-25
申请号：US14582282
申请日：2014-12-24
Applicant: NICHIA CORPORATION
Inventor： Takuya NAKABAYASHI , Hiroto TAMAKI
CPC classification number: H01L33/62 , H01L25/167 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/486 , H01L33/502 , H01L33/56 , H01L33/60 , H01L33/647 , H01L2224/16225 , H01L2224/48091 , H01L2924/0002 , H01L2924/181 , H05K1/0274 , H05K1/0298 , H05K1/0306 , H05K1/09 , H05K1/115 , H05K1/181 , H05K1/185 , H05K3/282 , H05K2201/0209 , H05K2201/0326 , H05K2201/10106 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: Discoloration is suppressed in a wiring substrate including a conductive member including silver. A wiring substrate includes a ceramic layer and a conductive member including a conductive layer disposed on an upper surface of the ceramic layer. The conductive member includes silver and at least a portion of an upper surface of the conductive layer is covered with a covering layer. The covering layer includes an inorganic reflecting layer and a glass layer stacked on the inorganic reflecting layer.
Abstract translation: 在包括含有银的导电构件的布线基板中抑制了变色。 布线基板包括陶瓷层和包括设置在陶瓷层的上表面上的导电层的导电构件。 导电构件包括银，并且导电层的上表面的至少一部分被覆盖层覆盖。 覆盖层包括层叠在无机反射层上的无机反射层和玻璃层。
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公开(公告)号：US20150171281A1
公开(公告)日：2015-06-18
申请号：US14568256
申请日：2014-12-12
Applicant: NICHIA CORPORATION
Inventor： Takuya NAKABAYASHI , Takeshi IKEGAMI , Tadaaki IKEDA , Tadao HAYASHI , Hiroto TAMAKI
CPC classification number: H01L33/486 , H01L24/97 , H01L25/13 , H01L33/387 , H01L33/502 , H01L33/54 , H01L33/62 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/00
Abstract: Provided is a small and thin light emitting device which has no connection failure, a high life, high performance and good light extraction efficiency. The light emitting device includes a base body comprising a base material having a pair of connection terminals on at least a first main surface, a light emitting element connected to the connection terminals, and a sealing member that seals the light emitting element, wherein the base material has a linear expansion coefficient within ±10 ppm/° C. of the linear expansion coefficient of the light emitting element.
Abstract translation: 提供了一种小而薄的发光装置，其没有连接故障，高寿命，高性能和良好的光提取效率。 发光器件包括：基体，其包括在至少第一主表面上具有一对连接端子的基底材料，连接到连接端子的发光元件和密封发光元件的密封构件，其中基底 材料的线性膨胀系数在发光元件的线性膨胀系数的±10ppm /℃以内。
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40.发明申请公开(公告)号：US20150159836A1
公开(公告)日：2015-06-11
申请号：US14590520
申请日：2015-01-06
Applicant: NICHIA CORPORATION
Inventor： Hiroto TAMAKI , Takayoshi WAKAKI , Tadao HAYASHI , Yoshiki SATO , Daisuke OYAMATSU , Takafumi SUGIYAMA , Takao KOSUGI
IPC: F21V9/16 , F21K99/00 , C23C16/455 , F21V13/08
CPC classification number: F21V9/30 , B05D5/06 , C23C16/45525 , F21K9/60 , F21V7/00 , F21V13/08 , F21Y2115/10 , F21Y2115/30 , H01L31/055 , H01L33/502 , H01L33/505 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H05B33/12 , Y02E10/52 , Y10T428/24364 , Y10T428/24372 , Y10T428/24413 , Y10T428/24421 , H01L2924/00014
Abstract: A wave-length conversion inorganic member can includes a base body and an inorganic particle layer on the base body. The inorganic particle layer can include particles of an inorganic wave-length conversion substance which is configured to absorb light of a first wave-length and to emit light of a second wave-length different from the first wave-length. The inorganic particle layer can include an agglomerate of a plurality of the particles. Each of the plurality of the particles are in contact with at least one of the other particles or the base body. A cover layer comprises an inorganic material, and the cover layer continuously covers a surface of the base body and surfaces of the particles. The inorganic particle layer has an interstice enclosed by the particles, or by the particles and one of the base body and the cover layer.
Abstract translation: 波长转换无机部件可以在基体上包括基体和无机粒子层。 无机粒子层可以包括被配置为吸收第一波长的光并发射与第一波长不同的第二波长的光的无机波长转换物质的粒子。 无机颗粒层可以包括多个颗粒的附聚物。 多个颗粒中的每一个与至少一个其它颗粒或基体接触。 覆盖层包括无机材料，并且覆盖层连续地覆盖基体的表面和颗粒的表面。 无机颗粒层具有由颗粒包围的空隙，或由颗粒和基体和覆盖层之一组成的间隙。
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