摘要:
In an optical pickup apparatus which can be commonly used for a plurality of optical disks having different thickness values, thickness t of a optical transparent plane plate for thickness compensation is set by means of skew ray formula so that the amount of spherical aberration caused by the optical system is lowered, thus allowing accurate focusing for each of a plurality of optical disks having different thickness values. Spherical aberration S.A. is given by expression of S.A..ident.S'.sub.k -S'.sub.k0, wherein S'.sub.k is computed by expression of S'.sub.k =Ax.sub.k -(X'.sub.k /Y'.sub.k)Ay.sub.k. Here, by setting S'.sub.k -S'.sub.k0 =minimal value, the geometric thickness of the plane plate 8 can be determined.
摘要:
In an apparatus for displaying a three-dimensional image, an image display and a polarizing filter having an axis of easy transmission in a predetermined direction or an optically-active film having an optically-active portion at a predetermined position are combined together in a predetermined positional relationship, thereby easily displaying an image on the image display when a flat original image is prepared for forming the three-dimensional image and simplifying the structure of the apparatus with a reduced manufacturing cost. The apparatus for three-dimensionally displaying a planar image recorded on a polarizing film comprises a monochrome liquid crystal television screen which functions as a backlight source, a convex Fresnel lens for magnifying an image of the backlight source, an infrared illumination light source for illuminating a half of the face of an observer with infrared radiation, an infrared camera for capturing the illuminated image of the observer, and an interlaced-image synthesizing circuit which forms a binary-coded image obtained by the infrared television camera and its reversed image and interlaces the binary-coded image and reversed image to synthesize a signal.
摘要:
Ultrapure water is formed by a process employing a simple system for safely and easily removing oxygen from water containing dissolved oxygen; which process comprises dissolving a reducing agent in water containing dissolved oxygen and irradiating the resulting water with ultraviolet rays. The ultrapure water is particularly utilized as a rinsing water in the electronics industry.
摘要:
A light-emitting apparatus is provided with: a light-emitting module; a control circuit unit configured to control the lighting of the light-emitting module; a heat-radiating substrate configured to support the light-emitting module and the control circuit unit in such a manner as to recover the heat produced by the light-emitting module and the control circuit unit; and a connection support unit mounted on the heat-radiating substrate in such a state as to support an electrically conductive member by which to electrically connect the light-emitting module and the control circuit unit.
摘要:
Provided is a highly reliable semiconductor device by giving stable electric characteristics to a transistor in which a semiconductor film whose threshold voltage is difficult to control is used as an active layer. By using a silicon oxide film having a negative fixed charge as a film in contact with the active layer of the transistor or a film in the vicinity of the active layer, a negative electric field is always applied to the active layer due to the negative fixed charge and the threshold voltage of the transistor can be shifted in the positive direction. Thus, the highly reliable semiconductor device can be manufactured by giving stable electric characteristics to the transistor.
摘要:
An epoxy resin composition having excellent connection reliability and transparency, a method for manufacturing a composite unit using the epoxy resin composition, and the composite unit, are disclosed. The manufacturing method includes an attaching step of attaching an epoxy resin composition (2) containing a novolak phenolic curing agent, an acrylic elastomer composed of a copolymer containing dimethylacrylamide and hydroxylethyl methacrylate, an epoxy resin and not less than 5 parts by weight to not more than 20 parts by weight of an inorganic filler to 100 parts by weight of the epoxy resin, to a printed circuit board (1) in the form of a sheet. The manufacturing method also includes a temporary loading step of temporarily loading a semiconductor chip (3) and capacitors (4a) to (4d) on the epoxy resin composition (2) and an ultimate pressure bonding step of pressuring the semiconductor chip (3) and capacitors (4a) to (4d) by a thermal bonding head (20) in situ to ultimately pressure bond the semiconductor chip (3) and capacitors (4a) to (4d).
摘要:
A thermally conductive adhesive having: a thermosetting adhesive containing a curable component and a curing agent for the curable component, and a metal filler dispersed in the thermosetting adhesive uses a silver powder and a solder powder as the metal filler. The solder powder to be used has a melting temperature lower than the thermal curing temperature of the thermally conductive adhesive and produces a high-melting-point solder alloy having a melting point higher than the melting temperature of the solder powder when the solder powder is reacted with the silver powder under thermal curing conditions of the thermally conductive adhesive. A curing agent having flux activity to the metal filler is used as the curing agent.
摘要:
The present invention utilizes self-heating of electronic components to improve a humidity sensing part with low environment resistance, such as a condensation problem and the like, and also to enhance the heat radiation efficiency of electronic components. The humidity sensing part is used in an intake tube of an automobile by integrating, for example, with a heating resister type mass air flow measurement device. A humidity sensing element is mounted on an electronic circuit board in a mass air flow measurement device with the temperature thereof starting to increase immediately after a sensor has been actuated. This urges the temperature of the humidity sensing element to start increasing (being heated) immediately after the sensor has been actuated. To urge the humidity sensing element to be further heated, a base plate is composed of two types of materials, resin and metal. A part of the base plate holding an area of the electronic circuit board generating a large quantity of heat is composed of the metal. A part of the base plate corresponding to the periphery of the humidity sensing part which is to be heated is composed of the resin.