公开(公告)号：US20060267184A1

公开(公告)日：2006-11-30

申请号：US11482668

申请日：2006-07-06

申请人： Larry Kinsman ,  Jerry Brooks

发明人： Larry Kinsman ,  Jerry Brooks

IPC分类号： H01L23/34

CPC分类号： H01L23/4334 ,  H01L24/48 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/05599 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An inventive integrated circuit package includes a package body, such as a transfer molded plastic or preformed ceramic package body, having an integrated circuit die positioned therein. A lead frame, such as a peripheral lead, Leads-Over-Chip (LOC), or Leads-Under-Chip (LUC) lead frame, includes a plurality of leads with portions enclosed within the package body that electrically connect to the integrated circuit die. A heat sink is positioned at least partially within the package body so a surface of a first portion of the heat sink faces the lead frame in close proximity to a substantial part, such as at least eighty percent, of the area of the enclosed portion of the lead frame to thereby substantially reduce an inductance associated with each of the leads.

摘要翻译： 本发明的集成电路封装包括封装体，例如传输模制塑料或预成型陶瓷封装主体，其中集成有电路管芯。 引线框架，例如外围引线，芯片引线（LOC）或引线片下（LUC）引线框架，包括多个引线，其中封装在封装体内的部分电连接到集成电路 死。 散热器至少部分地定位在封装主体内，使得散热器的第一部分的表面面对引线框架，紧邻主要部件的大部分，例如至少百分之八十的区域的封闭部分的面积 引线框架，从而基本上减少与每个引线相关联的电感。

公开(公告)号：US20050255628A1

公开(公告)日：2005-11-17

申请号：US11187105

申请日：2005-07-22

申请人： Larry Kinsman

发明人： Larry Kinsman

IPC分类号： G02F1/03 ,  G02F1/07 ,  H01J5/02 ,  H01L21/44 ,  H01L21/58 ,  H01L23/02 ,  H01L31/00

CPC分类号： H01L27/14683 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14634 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00

摘要： Microelectronic devices and methods of packaging microelectronic devices are disclosed herein. In one embodiment, a method includes placing a plurality of singulated radiation responsive dies on a support member, electrically connecting circuitry of the radiation responsive dies to contacts of the support member, and forming a barrier on the support member between adjacent radiation responsive dies without an adhesive attaching the barrier to the support member. The barrier is formed on the support member after electrically connecting the circuitry of the dies to the contacts of the support member. The barrier can encapsulate at least a portion of the wire-bonds.

摘要翻译： 本文公开了微电子器件和封装微电子器件的方法。 在一个实施例中，一种方法包括将多个单独的辐射响应模具放置在支撑构件上，将辐射响应模具的电路电连接到支撑构件的触点，以及在相邻的辐射响应模具之间的支撑构件上形成屏障， 粘合剂将阻挡件附接到支撑构件。 在将模具的电路电连接到支撑构件的触点之后，在支撑构件上形成屏障。 阻挡层可以封装至少一部分引线键合。

公开(公告)号：US20050233502A1

公开(公告)日：2005-10-20

申请号：US11152519

申请日：2005-06-14

申请人： Larry Kinsman

发明人： Larry Kinsman

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L23/02 ,  H01L23/04 ,  H01L23/22 ,  H01L23/24 ,  H01L23/28 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L31/00 ,  H01L31/0203

CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/1469 ,  H01L31/02005 ,  H01L31/0203 ,  H01L2224/73204

摘要： The present invention provides flip-chip packaging for optically interactive devices such as image sensors and methods of assembly. In a first embodiment of the invention, conductive traces are formed directly on the second surface of a transparent substrate and an image sensor chip is bonded to the conductive traces. Discrete conductive elements are attached to the conductive traces and extend below a back surface of the image sensor chip. In a second embodiment, a secondary substrate having conductive traces formed thereon is secured to the transparent substrate. In a third embodiment, a backing cap having a full array of attachment pads is attached to the transparent substrate of the first embodiment or the secondary substrate of the second embodiment. In a fourth embodiment, the secondary substrate is a flex circuit having a mounting portion secured to the second surface of the transparent substrate and a backing portion bent over adjacent to the back surface of the image sensor chip.

摘要翻译： 本发明提供了用于诸如图像传感器和组装方法的光学交互设备的倒装芯片封装。 在本发明的第一实施例中，导电迹线直接形成在透明基板的第二表面上，并且图像传感器芯片被接合到导电迹线上。 离散导电元件附着到导电迹线并延伸到图像传感器芯片的背面下方。 在第二实施例中，其上形成有导电迹线的二次基板固定到透明基板。 在第三实施例中，具有完整阵列附接垫的背盖附接到第二实施例的第一实施例的透明基板或第二基板。 在第四实施例中，第二基板是具有固定到透明基板的第二表面的安装部分和在图像传感器芯片的背面附近弯曲的背衬部分的柔性电路。

公开(公告)号：US20050164429A1

公开(公告)日：2005-07-28

申请号：US11057921

申请日：2005-02-15

申请人： Larry Kinsman ,  Salman Akram

发明人： Larry Kinsman ,  Salman Akram

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L29/06 ,  H01L21/48 ,  H01L21/44 ,  H01L21/50 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/12 ,  H01L21/561 ,  H01L21/563 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/32 ,  H01L24/11 ,  H01L24/28 ,  H01L24/72 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L29/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13116 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/73203 ,  H01L2224/8121 ,  H01L2224/8122 ,  H01L2224/81815 ,  H01L2224/83851 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10157 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1579 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/11 ,  H01L2224/05624

摘要： Channels are formed that pass through an active surface of a semiconductor substrate to provide isolation between adjacent active surface regions defining individual die locations. Bond pads on the substrate are bumped with intermediate conductive elements, after which a material used to encapsulate the active surface is applied, filling the channels and covering exposed peripheral edges of the active surface integrated circuitry. The encapsulant is then planarized to expose the ends of the bumps. External conductive elements such as solder balls are then formed on the exposed bump ends. The semiconductor wafer is diced in alignment with the channels to singulate the semiconductor devices, the encapsulant in the channels keeping the edges of the integrated circuitry substantially hermetically sealed.

公开(公告)号：US20050056598A1

公开(公告)日：2005-03-17

申请号：US10859803

申请日：2004-06-03

申请人： Ajit Chowdhury ,  Larry Kinsman ,  Sarah Wilk

发明人： Ajit Chowdhury ,  Larry Kinsman ,  Sarah Wilk

IPC分类号： C02F1/70 ,  C02F1/72 ,  C02F9/00

CPC分类号： C02F1/722 ,  C02F1/28 ,  C02F1/70 ,  C02F1/705 ,  C02F1/72 ,  C02F9/00 ,  C02F2101/306 ,  C02F2101/36 ,  C02F2101/38 ,  C02F2305/026

摘要： A method for decontaminating a recalcitrant organic compound (ROC)-contaminated matrix is disclosed. The method involves pre-treating the matrix with an oxidizing agent to release the ROC from the matrix and then exposing the released ROC to a reducing agent to convert the ROC to a non-toxic substance.

摘要翻译： 公开了一种用于去除顽固有机化合物（ROC）污染基质的方法。 该方法包括用氧化剂预处理基质以从基质中释放ROC，然后将释放的ROC暴露于还原剂中以将ROC转化为无毒物质。

公开(公告)号：US06493229B2

公开(公告)日：2002-12-10

申请号：US10132043

申请日：2002-04-25

申请人： Salman Akram ,  Larry Kinsman

发明人： Salman Akram ,  Larry Kinsman

IPC分类号： H05K720

CPC分类号： H01L24/97 ,  H01L23/3121 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： The present invention relates to enhanced thermal management of a microelectronic device package on a printed circuit board (PCB) having a solder ring or dam that encompasses a ball array. The ring or dam bears stress from disparate coefficients of mechanical expansion between the PCB and the ball array.

公开(公告)号：US20070000599A1

公开(公告)日：2007-01-04

申请号：US11514789

申请日：2006-09-01

申请人： Larry Kinsman ,  Timothy Allen ,  Jerry Brooks

发明人： Larry Kinsman ,  Timothy Allen ,  Jerry Brooks

IPC分类号： B32B37/00

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10T29/49121 ,  Y10T29/49172 ,  Y10T156/1002 ,  Y10T156/1064 ,  H01L2924/00 ,  H01L2924/00012

摘要： A LOC die assembly and method is disclosed including a die dielectrically adhered to the underside of a lead frame. The lead frame has stress relief slots formed in the undersides of the lead elements proximate the adhesive to accommodate filler particles lodged between the leads and the active surface of the die during transfer molding of a plastic encapsulant. The increased space created by the slots and flexure in the leads about the slots reduces point stresses on the active surface of the die by the filler particles. The increased flexure in the leads about the slots further enhances the locking of the leads in position with respect to the die.

摘要翻译： 公开了一种LOC模头组件和方法，其包括介电粘附到引线框架的下侧的模具。 引线框架具有形成在接近粘合剂的引线元件的下侧中的应力消除槽，以容纳填充在颗粒之间的填料颗粒，并在塑料密封剂的传递模塑过程中模具的活性表面。 狭槽产生的增加的空间和引线周围的弯曲使得填料颗粒在模具的活性表面上的点应力减小。 引线围绕槽的增加的弯曲进一步增强了引线相对于管芯的位置锁定。

公开(公告)号：US07148083B2

公开(公告)日：2006-12-12

申请号：US10986424

申请日：2004-11-10

申请人： Larry Kinsman ,  Richard Wensel ,  Jeff Reeder

发明人： Larry Kinsman ,  Richard Wensel ,  Jeff Reeder

IPC分类号： H01L21/66 ,  H01L21/00

CPC分类号： H01L21/565 ,  H01L23/3128 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： In one implementation, a circuit substrate includes a substrate having opposing sides. At least one of the sides is configured for transfer mold packaging and has conductive traces formed thereon. A soldermask is received on the one side, and has a plurality of openings formed therethrough to locations on the conductive traces. The soldermask includes a peripheral elongated trench therein positioned on the one side to align with at least a portion of an elongated mold void perimeter of a transfer mold to be used for transfer mold packaging of the one side. In one implementation, the invention includes a transfer mold semiconductor packaging process. In one implementation, the invention includes a semiconductor package. In one implementation, the invention includes a ball grid array.

公开(公告)号：US20050040511A1

公开(公告)日：2005-02-24

申请号：US10933027

申请日：2004-09-01

申请人： Larry Kinsman

发明人： Larry Kinsman

IPC分类号： H01L25/065 ,  H01L23/02

CPC分类号： H01L25/0657 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2225/06593 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/49126 ,  H01L2924/00

摘要： A back-to-back semiconductor device assembly includes two vertically mountable semiconductor devices, the backs of which are secured to one another. The bond pads of both semiconductor devices are disposed adjacent a single, mutual edge of the assembly. The semiconductor devices may comprise semiconductor dice, or they may be devices that have yet to be separated from other devices carried by the same substrates.

摘要翻译： 背对背半导体器件组件包括两个可垂直安装的半导体器件，其背面彼此固定。 两个半导体器件的接合焊盘设置在组件的单​​个相互边缘附近。 半导体器件可以包括半导体管芯，或者它们可以是尚未与由相同衬底承载的其它器件分离的器件。

公开(公告)号：US06426875B1

公开(公告)日：2002-07-30

申请号：US09651330

申请日：2000-08-29

申请人： Salman Akram ,  Larry Kinsman

发明人： Salman Akram ,  Larry Kinsman

IPC分类号： H05K720

CPC分类号： H01L24/97 ,  H01L23/3121 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： The present invention relates to enhanced thermal management of a microelectronic device package on a printed circuit board (PCB) having a solder ring or dam that encompasses a ball array. The ring or dam bears stress from disparate coefficients of mechanical expansion between the PCB and the ball array.