公开(公告)号：US08344558B2

公开(公告)日：2013-01-01

申请号：US13390813

申请日：2011-03-23

申请人： Tomotaka Nishimoto ,  Kouichi Yabuki ,  Ikuo Yoshida ,  Hiroyuki Kondo

发明人： Tomotaka Nishimoto ,  Kouichi Yabuki ,  Ikuo Yoshida ,  Hiroyuki Kondo

IPC分类号： H01H9/54

CPC分类号： H05K13/08 ,  Y10T307/25 ,  Y10T307/944

摘要： A power supply control method of a production system including a first unit and a second unit includes: starting power supply for operation of the second unit in accordance with a signal acquired according to an operation status of the first unit (S41); starting the operation by the second unit after the start of the power supply (S44); acquiring stop time information indicating time from when the operation ends to when a next operation of the second unit starts (S22); determining, based on the acquired stop time information, whether or not to stop the power supply after the started operation ends (S24); and stopping the power supply when it is determined to stop the power supply (S48).

摘要翻译： 包括第一单元和第二单元的生产系统的电源控制方法包括：根据根据第一单元的操作状态获取的信号来启动第二单元的操作电源（S41）; 在电源开始之后由第二单元开始操作（S44）; 获取指示从操作结束到第二单元的下一操作开始的时间的停止时间信息（S22）; 基于获取的停止时间信息确定在开始操作结束后是否停止电源（S24）; 并且当确定停止电源时停止电源（S48）。

公开(公告)号：US20100210774A1

公开(公告)日：2010-08-19

申请号：US12666936

申请日：2008-05-19

申请人： Hajime Kondo ,  Ikuo Yoshida

发明人： Hajime Kondo ,  Ikuo Yoshida

IPC分类号： C09D5/08 ,  C09C1/02 ,  C09C1/40

CPC分类号： C09C1/40 ,  C01P2006/22 ,  C09D5/084

摘要： An anticorrosive pigment composition containing neither any heavy metal harmful to the environment nor zinc, which may be harmful to the environment. The composition is a product of the reaction of (a) aluminum dihydrogen tripolyphosphate, (b) a calcium compound selected among oxides, hydroxides, and carbonates, and (c) a magnesium compound selected among oxides, hydroxides, and carbonates. The composition exerts no adverse influence on the storage stability of water-based anticorrosive coating materials.

摘要翻译： 防腐颜料组合物既不含有对环境有害的重金属，也不含有对环境有害的锌。 组合物是（a）三聚磷酸铝，（b）选自氧化物，氢氧化物和碳酸盐的钙化合物的反应的产物，和（c）选自氧化物，氢氧化物和碳酸盐的镁化合物。 该组合物对水性防腐涂料的储存稳定性没有不利影响。

公开(公告)号：US07493491B2

公开(公告)日：2009-02-17

申请号：US10743466

申请日：2003-12-23

申请人： Takeshi Ootsuka ,  Ikuo Yoshida ,  Koichi Nagoshi ,  Kiyohiko Honda ,  Takayuki Fukushima

发明人： Takeshi Ootsuka ,  Ikuo Yoshida ,  Koichi Nagoshi ,  Kiyohiko Honda ,  Takayuki Fukushima

IPC分类号： H04L9/00 ,  G06F7/00 ,  G06F17/30 ,  B42D15/00 ,  G06K9/34

CPC分类号： G06F21/606 ,  G06F21/608 ,  G06F21/6209 ,  G06F21/64 ,  G06F2221/0737 ,  H04N2201/3276 ,  Y10S707/99939

摘要： A server stores original data without a water-mark. When a user at a terminal apparatus connected with the server requests the server to display the original data on a display of the terminal apparatus, the server transforms the original data into an image data. Then the server adds a water-mark to the image data and transmits the image data with the water-mark to the terminal apparatus.

摘要翻译： 服务器存储没有水印的原始数据。 当与服务器连接的终端装置的用户请求服务器在终端装置的显示器上显示原始数据时，服务器将原始数据变换为图像数据。 然后，服务器向图像数据添加水印，并将具有水印的图像数据发送到终端装置。

公开(公告)号：US20080030800A1

公开(公告)日：2008-02-07

申请号：US11730138

申请日：2007-03-29

申请人： Shigeru Matsukawa ,  Ikuo Yoshida ,  Koichi Nagoshi

发明人： Shigeru Matsukawa ,  Ikuo Yoshida ,  Koichi Nagoshi

IPC分类号： H04N1/04

CPC分类号： H04N1/2179 ,  H04N1/00244 ,  H04N1/2191 ,  H04N1/4413 ,  H04N1/4433 ,  H04N2201/0039 ,  H04N2201/0094 ,  H04N2201/3205 ,  H04N2201/3214 ,  H04N2201/3229 ,  H04N2201/3233 ,  H04N2201/3242 ,  H04N2201/3243

摘要： Provided is an electronic document management system which sorts out and stores electronic documents automatically. The electronic document management system displays the management names on a console panel of an image scanner, which are associated with document management information and pre-stored in an electronic document management server. When a user selects a given management name, an electronic document is processed in accordance with the management method associated with the selected management name. This allows electronic documents to be sorted out and stored automatically in accordance with the management method desired by a user, without the necessity of using any identification document.

摘要翻译： 提供了一种电子文档管理系统，其自动分类和存储电子文档。 电子文档管理系统在图像扫描器的控制面板上显示与文件管理信息相关联并预先存储在电子文档管理服务器中的管理名称。 当用户选择给定的管理名称时，根据与所选择的管理名称相关联的管理方法处理电子文档。 这允许电子文档根据用户期望的管理方法被自动分类和存储，而不需要使用任何识别文档。

公开(公告)号：US07226336B2

公开(公告)日：2007-06-05

申请号：US10626524

申请日：2003-07-25

申请人： Junichi Hikita ,  Ikuo Yoshida ,  Kazuhide Ino

发明人： Junichi Hikita ,  Ikuo Yoshida ,  Kazuhide Ino

IPC分类号： B24B49/08

CPC分类号： B24B37/013 ,  B24B49/10 ,  B24B49/12 ,  H01L21/304 ,  H01L21/78

摘要： A method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips. This method includes forming a groove with a pattern according to an outer contour of a desired semiconductor chip, holding the semiconductor wafer by a wafer holding mechanism, grinding a back surface of the semiconductor wafer held by the wafer holding mechanism, detecting opening of a bottom face of the groove during the back surface grinding process to determine timing for finishing the back surface grinding. The opening of the groove can be detected by means of a light sensor for detecting light passing through the groove or a microwave sensor for detecting a microwave passing through the groove. In addition, it is possible to suck air inside the groove so as to detect the opening of the groove by a pressure rise in the air inside the groove.

摘要翻译： 一种通过将半导体晶片分成单独的半导体芯片片来制造半导体器件的方法。 该方法包括根据期望的半导体芯片的外轮廓形成具有图案的凹槽，通过晶片保持机构保持半导体晶片，研磨由晶片保持机构保持的半导体晶片的背面，检测底部的开口 在后表面磨削过程中的槽面，以确定后表面研磨的精加工时机。 可以通过用于检测通过凹槽的光的光传感器或用于检测通过凹槽的微波的微波传感器来检测凹槽的开口。 此外，可以吸收槽内的空气，以便通过槽内的空气的压力上升来检测槽的开口。

公开(公告)号：US06737741B2

公开(公告)日：2004-05-18

申请号：US10224504

申请日：2002-08-21

申请人： Satoshi Imasu ,  Ikuo Yoshida ,  Tetsuya Hayashida ,  Akira Yamagiwa ,  Shinobu Takeura

发明人： Satoshi Imasu ,  Ikuo Yoshida ,  Tetsuya Hayashida ,  Akira Yamagiwa ,  Shinobu Takeura

IPC分类号： H01L2314

CPC分类号： H01L23/13 ,  H01L21/563 ,  H01L23/24 ,  H01L23/49811 ,  H01L23/5383 ,  H01L24/29 ,  H01L24/32 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45 ,  H01L2224/45144 ,  H01L2224/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48599 ,  H01L2224/49 ,  H01L2224/49109 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/111 ,  H05K1/112 ,  H05K3/4602 ,  H05K2201/0133 ,  H05K2201/091 ,  H05K2201/09472 ,  H05K2201/0949 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/10674 ,  H05K2203/1581 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/13111 ,  H01L2224/05552

摘要： An electronic device comprising a semiconductor chip which is fixed to the mounting face of a wiring board through an adhesive and in which external terminals are electrically connected with electrode pads of the wiring board through bump electrodes. Recesses are formed in the electrode pads, and in the recesses the electrode pads and the bump electrodes are connected. The electrode pads are formed over the surface of a soft layer, and the recesses are formed by elastic deformation of the electrode pads and the soft layer.

摘要翻译： 一种电子设备，包括通过粘合剂固定到布线板的安装面的半导体芯片，其中外部端子通过凸块电极与布线板的电极焊盘电连接。 在电极焊盘上形成凹部，在凹部中连接有电极焊盘和凸块电极。 电极焊盘形成在软层的表面上，并且通过电极焊盘和软层的弹性变形形成凹部。

公开(公告)号：US06492737B1

公开(公告)日：2002-12-10

申请号：US09921919

申请日：2001-08-06

申请人： Satoshi Imasu ,  Ikuo Yoshida ,  Norio Kishikawa ,  Yoshiyuki Kado ,  Kazuyuki Taguchi ,  Takahiro Naito ,  Toshihiko Sato

发明人： Satoshi Imasu ,  Ikuo Yoshida ,  Norio Kishikawa ,  Yoshiyuki Kado ,  Kazuyuki Taguchi ,  Takahiro Naito ,  Toshihiko Sato

IPC分类号： H01L2312

CPC分类号： H01L21/563 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/06136 ,  H01L2224/1134 ,  H01L2224/13023 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/1517 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/13111 ,  H01L2924/05442 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05552

摘要： An electronic device comprising: a semiconductor chip having plural electrode pads on one main surface thereof; a wiring board having plural connection parts; and plural salient electrodes disposed respectively between the electrode pads of the semiconductor chip and the connection parts of the wiring board to provide electrical connections between the two, the salient electrodes being arranged in an array not providing balance of the semiconductor chip with respect to one main surface of the wiring board, the plural connection parts of the wiring board being arranged at a deeper position than one main surface of the wiring board in a depth direction from the one main surface.

摘要翻译： 一种电子设备，包括：在其一个主表面上具有多个电极焊盘的半导体芯片; 具有多个连接部的布线板; 以及分别设置在半导体芯片的电极焊盘和布线板的连接部分之间以提供两者之间的电连接的多个凸起电极，所述凸起电极被布置成不能提供半导体芯片相对于一个主体的平衡的阵列 布线板的多个连接部分布置在比一个主表面在深度方向上比布线板的一个主表面更深的位置。

公开(公告)号：US5885852A

公开(公告)日：1999-03-23

申请号：US848566

申请日：1997-04-28

申请人： Norio Kishikawa ,  Ikuo Yoshida ,  Tetsuya Hayashida

发明人： Norio Kishikawa ,  Ikuo Yoshida ,  Tetsuya Hayashida

IPC分类号： B29C45/26 ,  B29C45/02 ,  B29C45/14 ,  B29L31/34 ,  H01L21/56 ,  H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L21/60

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/49555 ,  H01L23/49558 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/1815

摘要： For manufacturing a packaged semiconductor device, a lead frame with an electrically insulating strip member and a semiconductor chip is placed in a molding unit having upper and lower dies. The upper and lower dies have recessed areas for determining a size of a cavity of the molding unit different from each other, the size of the cavity being measured in a direction perpendicular to a clamping motion direction of the dies. The lead frame is positioned so that a surface of each lead with the insulating strip member applied thereto is contacted with one of the upper and lower dies having a larger recessed area and a molding line of the molding unit intersects the insulating strip member. The molding unit is closed to clamp the lead frame to depress and thrust into spaces between adjacent leads that part of the strip member which is outside the molding line and to form the cavity of the molding unit. By injecting a molding material into the cavity, a molding package is provided encapsulating the semiconductor chip and a portion of each lead. The packaged semiconductor device has a flanged side surface with an insulating strip provided between a step of the flanged side surface and intermediate portions of the leads which are between first portions of the leads encapsulated in the molding package and second portions of the leads protruding from the flanged side surface.

摘要翻译： 为了制造封装的半导体器件，将具有电绝缘条形部件的引线框架和半导体芯片放置在具有上模具和下模具的模制单元中。 上模具和下模具具有用于确定模制单元的空腔的尺寸彼此不同的凹入区域，所述空腔的尺寸在垂直于模具的夹紧运动方向的方向上被测量。 引线框架被定位成使得施加到其上的绝缘条形构件的每个引线的表面与具有较大凹陷区域的上模具和下模具中的一个接触，并且模制单元的模制线与绝缘条构件相交。 闭合模制单元以夹紧引线框架以压下并推入相邻引线之间的位于模制线之外的条形部件的部分之间的空间并形成模制单元的空腔。 通过将成型材料注入到空腔中，提供封装半导体芯片和每个引线的一部分的模制封装。 封装的半导体器件具有带凸缘的侧表面，其具有设置在凸缘侧表面的台阶与引线的中间部分之间的绝缘条，该引线位于封装在模制封装中的引线的第一部分之间，引线的第二部分从 法兰侧面。

公开(公告)号：US08058338B2

公开(公告)日：2011-11-15

申请号：US12666936

申请日：2008-05-19

申请人： Hajime Kondo ,  Ikuo Yoshida

发明人： Hajime Kondo ,  Ikuo Yoshida

IPC分类号： C08K3/22

CPC分类号： C09C1/40 ,  C01P2006/22 ,  C09D5/084

摘要： An anticorrosive pigment composition containing neither any heavy metal harmful to the environment nor zinc, which may be harmful to the environment. The composition is a product of the reaction of (a) aluminum dihydrogen tripolyphosphate, (b) a calcium compound selected among oxides, hydroxides, and carbonates, and (c) a magnesium compound selected among oxides, hydroxides, and carbonates. The composition exerts no adverse influence on the storage stability of water-based anticorrosive coating materials.

摘要翻译： 防腐颜料组合物既不含有对环境有害的重金属，也不含有对环境有害的锌。 组合物是（a）三聚磷酸铝，（b）选自氧化物，氢氧化物和碳酸盐的钙化合物的反应的产物，和（c）选自氧化物，氢氧化物和碳酸盐的镁化合物。 该组合物对水性防腐涂料的储存稳定性没有不利影响。

公开(公告)号：US20070168881A1

公开(公告)日：2007-07-19

申请号：US11681427

申请日：2007-03-02

申请人： Koichi Nagoshi ,  Takayuki Fukushima ,  Ikuo Yoshida ,  Takeshi Ootsuka ,  Kiyohiko Honda

发明人： Koichi Nagoshi ,  Takayuki Fukushima ,  Ikuo Yoshida ,  Takeshi Ootsuka ,  Kiyohiko Honda

IPC分类号： G06F3/048

CPC分类号： G06F16/84

摘要： A distribution server and includes a communicator that communicates with multifunction apparatuses via a network a menu generator that generates menu information based on information obtained by the communicator, the information including display capability information and job capability information for each multifunction apparatus. The menu information includes information for execution of a job and a menu name assigned for the job. A data memory stores the generated menu information and a distributor retrieves, from the data memory, menu information requested by the multifunction apparatus and distributes, via the network, the menu information to the requesting multifunction apparatus.

摘要翻译： 一种分发服务器，包括通过网络与多功能设备通信的通信器，基于由通信器获得的信息生成菜单信息的菜单生成器，包括每个多功能设备的显示能力信息和作业能力信息的信息。 菜单信息包括用于执行作业的信息和为作业分配的菜单名称。 数据存储器存储生成的菜单信息，并且分发器从数据存储器检索由多功能设备请求的菜单信息，并经由网络将菜单信息分发给请求的多功能设备。