公开(公告)号：US20230238769A1

公开(公告)日：2023-07-27

申请号：US17999508

申请日：2021-05-27

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Tobias Gebuhr ,  Jan Seidenfaden

IPC: H01S5/02255 ,  H01S5/02234 ,  H01S5/02208 ,  H01S5/0232 ,  H01S5/068

CPC classification number: H01S5/02255 ,  H01S5/02234 ,  H01S5/02208 ,  H01S5/0232 ,  H01S5/06825

Abstract: In an embodiment an optoelectronic semiconductor component includes a lead frame having a first mounting surface, a semiconductor chip arranged on the first mounting surface and having an emission surface, an optical element and a molded body, wherein the optical element has an input-coupling surface oriented transverse to the first mounting surface, wherein the semiconductor chip is configured to emit electromagnetic radiation through the emission surface, a radiation axis of which is parallel to the first mounting surface, wherein the optical element is configured to deflect the electromagnetic radiation of the semiconductor chip coupled in via the input-coupling surface, wherein the molded body is attached to the lead frame and has an alignment surface transverse to the first mounting surface, and wherein the optical element and the alignment surface are in direct contact with each other.

公开(公告)号：US11705695B2

公开(公告)日：2023-07-18

申请号：US17528177

申请日：2021-11-16

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Kazuhiro Sakai ,  Daisuke Iguchi ,  Takeshi Minamiru ,  Yoshinori Shirakawa ,  Tomoaki Sakita ,  Tsutomu Otsuka

IPC: H01S5/02257 ,  H01S5/02345 ,  H01S5/42 ,  H01S5/183 ,  H01S5/068 ,  G02B5/02 ,  G06V20/64 ,  G06V10/145 ,  G06V40/16 ,  H01S5/0687 ,  G02B27/42 ,  H01S5/02255 ,  H01S5/02325 ,  H01S5/042 ,  H01S5/02 ,  H01S5/30 ,  H01S5/343 ,  H01S5/20

CPC classification number: H01S5/423 ,  G02B5/0278 ,  G02B27/4205 ,  G06V10/145 ,  G06V20/64 ,  G06V40/166 ,  H01S5/02255 ,  H01S5/02325 ,  H01S5/0687 ,  H01S5/06804 ,  H01S5/0206 ,  H01S5/04252 ,  H01S5/04254 ,  H01S5/18347 ,  H01S5/18361 ,  H01S5/2054 ,  H01S5/3054 ,  H01S5/34353

Abstract: A light emitting device includes a wiring substrate, a light emitting element array that includes a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface connecting the first side surface and the second side surface to each other and facing each other, the light emitting element array being provided on the wiring substrate, a driving element that is provided on the wiring substrate on the first side surface side and drives the light emitting element array, a first circuit element and a second circuit element that are provided on the wiring substrate on the second side surface side to be arranged in a direction along the second side surface, and a wiring member that is provided on the third side surface side and the fourth side surface side and extends from a top electrode of the light emitting element array toward an outside of the light emitting element array.

公开(公告)号：US20230216270A1

公开(公告)日：2023-07-06

申请号：US18183506

申请日：2023-03-14

Applicant: NICHIA CORPORATION

Inventor： Kiyoshi ENOMOTO

IPC: H01S5/02216 ,  H01S5/02315 ,  H01S5/02257 ,  H01S5/02345 ,  H01S5/02255 ,  H01S5/40

CPC classification number: H01S5/02216 ,  H01S5/02315 ,  H01S5/02257 ,  H01S5/02345 ,  H01S5/02255 ,  H01S5/4031 ,  H01S5/4093

Abstract: A light-emitting device includes: a base including: a mount surface, and a lateral wall located around the mount surface, the lateral wall including: a pair of first protrusions located opposite to each other in a first direction which is parallel to a side of the mount surface, and a pair of second protrusions located opposite to each other in a second direction which is perpendicular to the first direction, the second protrusions being provided lower than the first protrusions; one or more light-emitting elements mounted on the mount surface of the base; a first light-transmissive member sealing a space in which the one or more light-emitting elements are mounted; and one or more wires connecting to the one or more light-emitting elements, the one or more wires being bonded on conduction regions provided on at least one of upper surfaces of the second protrusions.

公开(公告)号：US11658453B2

公开(公告)日：2023-05-23

申请号：US17103470

申请日：2020-11-24

Applicant: Ronald LaComb ,  Kevin LaComb

Inventor： Ronald LaComb ,  Kevin LaComb

IPC: H01S3/083 ,  H01S3/06 ,  H01S3/067 ,  H01S3/0941 ,  H01S5/40 ,  H01S5/10 ,  H01S5/02255 ,  H01S5/042 ,  H01S5/22 ,  H01S5/12 ,  H01S5/20 ,  H01S5/42 ,  H01S5/185

CPC classification number: H01S3/083 ,  H01S3/0627 ,  H01S3/0675 ,  H01S3/0941 ,  H01S5/1075 ,  H01S5/4056 ,  H01S5/02255 ,  H01S5/04254 ,  H01S5/04256 ,  H01S5/12 ,  H01S5/185 ,  H01S5/204 ,  H01S5/2219 ,  H01S5/4075 ,  H01S5/42

Abstract: The present disclosure relates to a three-dimensional cylindrical cavity-type laser system capable of supporting circumferential radial emission. A cylindrical ring waveguide provides optical confinement in the radial and axial dimensions thereby supporting a plurality of radial modes, one of a plurality of axial modes and a plurality of degenerate azimuthal modes. These modes constitute a set of traveling wave modes which propagate around the cylindrical ring waveguide possessing various degrees of optical confinement as quantified by their respective Q-factors. Index tailoring is used to tailor the radial refractive index profile and geometry of the waveguide to support radial modes possessing Q-factors capable of producing efficient radial emission, while gain tailoring is used to define a gain confining region which offsets modal gain factors of the modal constituency to favor a preferred set of modes supporting efficient radial emission out of the total modal constituency supported by the resonator. Under appropriate pump actuation the selected modes produce circumferential laser radiation with the output surface comprising of the entire outer perimeter of the cylindrical ring waveguide. The design is applicable toward both micro-resonators and resonators much larger than the optical wavelength, enabling high output powers and scalability. The circumferential radial laser emission can be concentrated by positioning the cylindrical ring laser inside a three-dimensional conical mirror thereby forming a laser ring of light propagating in the axial dimension away from the surface of the laser, which can be subsequently collimated for focused using conventional optics.

公开(公告)号：US20240297478A1

公开(公告)日：2024-09-05

申请号：US18415663

申请日：2024-01-18

Applicant: Qisda Corporation

Inventor： Wen-Chung Ho ,  Tsung-Hsun Wu ,  Cheng-Hsun Wu

IPC: H01S5/02255 ,  H01S5/02218

CPC classification number: H01S5/02255 ,  H01S5/02218

Abstract: An optical engine module including a plastic housing, a first light source, and a light path turning unit is disclosed. The plastic housing has a first light incident side and a light emerging side. The light emerging side is adjacent to the light incident side. The first light source is disposed on the first light incident side, and configured to emit a first beam. The light path turning unit is disposed in the plastic housing, and configured to turn and transmit the first beam to the light emerging side. A material of the light path turning unit includes metal.

公开(公告)号：US12057676B2

公开(公告)日：2024-08-06

申请号：US17294816

申请日：2019-11-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Andreas Plößl ,  Jörg Erich Sorg ,  Frank Singer

IPC: H01S5/02255 ,  H01S5/02 ,  H01S5/02208 ,  H01S5/02234 ,  H01S5/028 ,  H01S5/40

CPC classification number: H01S5/02208 ,  H01S5/0201 ,  H01S5/0213 ,  H01S5/0217 ,  H01S5/02234 ,  H01S5/02255 ,  H01S5/028 ,  H01S5/4031

Abstract: In one embodiment, the method serves for producing semiconductor lasers and includes the following steps in the order indicated: A) applying a multiplicity of edge emitting laser diodes on a mounting substrate, B) applying an encapsulation element, such that the laser diodes are applied in each case in a cavity between the mounting substrate and the associated encapsulation element, C) operating the laser diodes and determining emission directions of the laser diodes, D) producing material damage in partial regions of the encapsulation element, wherein the partial regions are uniquely assigned to the laser diodes, E) collectively removing material of the encapsulation element, said material being affected by the material damage, with the result that individual optical surfaces for beam shaping arise for the laser diodes in the partial regions, and F) singulating to form the semiconductor lasers.

公开(公告)号：US12044956B2

公开(公告)日：2024-07-23

申请号：US17268288

申请日：2019-07-26

Applicant: Sony Corporation

Inventor： Hisayoshi Motobayashi ,  Hidekazu Kawanishi ,  Yoshiro Takiguchi ,  Masahiro Murayama ,  Hiroyuki Miyahara ,  Hitoshi Domon

IPC: G03B21/20 ,  H01S5/02218 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/02315 ,  H01S5/02325 ,  H01S5/0239 ,  H01S5/024 ,  H01S5/323 ,  H01S5/40

CPC classification number: G03B21/2033 ,  G03B21/208 ,  H01S5/02218 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/02315 ,  H01S5/02325 ,  H01S5/0239 ,  H01S5/02469 ,  H01S5/32341 ,  H01S5/4031 ,  H01S5/4087

Abstract: A light-emitting device including: a package including a light-emitting element, a reflection member that reflects light outputted from the light-emitting element, and a sealed space that accommodates the light-emitting element and the reflection member; a base plate on which a plurality of the packages is mounted; and lenses opposed to the base plate with the plurality of packages interposed therebetween, the lenses being opposed to the respective packages.

公开(公告)号：US20240213739A1

公开(公告)日：2024-06-27

申请号：US18600738

申请日：2024-03-10

Applicant: NICHIA CORPORATION

Inventor： Soichiro MIURA ,  Ryota OKUNO

IPC: H01S5/02345 ,  H01S5/00 ,  H01S5/02255 ,  H01S5/023 ,  H01S5/02315 ,  H01S5/0233 ,  H01S5/042 ,  H01S5/40

CPC classification number: H01S5/02345 ,  H01S5/0071 ,  H01S5/02255 ,  H01S5/023 ,  H01S5/02315 ,  H01S5/0233 ,  H01S5/0425 ,  H01S5/4025

Abstract: A light emitting device includes a base, a frame, first and second semiconductor laser elements, one or more light-reflective members, and wires. The frame part has first inner lateral surfaces, second inner lateral surfaces, a first and second step-parts respectively formed along the second inner lateral surfaces. The wires are bonded to an upper surface of the first step-part or an upper surface of the second step-part. The first semiconductor laser element is disposed closer to the first step-part.
The second semiconductor laser element is disposed closer to the second step-part. All of the wires that electrically connect the first semiconductor laser element to the frame part are not bonded to the upper surface of the second step-part. All of the wires that electrically connect the second semiconductor laser element to the frame part are not bonded to the upper surface of the first step-part.

公开(公告)号：US12018805B2

公开(公告)日：2024-06-25

申请号：US17315226

申请日：2021-05-07

Applicant: NUVOTON TECHNOLOGY CORPORATION JAPAN

Inventor： Kazuhiko Yamanaka ,  Hideki Kasugai

IPC: F21S41/16 ,  F21S41/176 ,  F21S41/19 ,  F21S41/20 ,  F21S41/32 ,  F21S41/365 ,  F21S41/39 ,  F21S45/70 ,  F21V7/24 ,  F21V9/32 ,  F21V9/38 ,  F21V9/45 ,  F21V13/14 ,  F21Y115/30 ,  G02B5/02 ,  G02B27/10 ,  H01L33/50 ,  H01S5/00 ,  H01S5/02326 ,  H01S5/0683 ,  H01S5/02251 ,  H01S5/02255 ,  H01S5/068 ,  H01S5/323

CPC classification number: F21S41/16 ,  F21S41/176 ,  F21S41/192 ,  F21S41/285 ,  F21S41/321 ,  F21S41/365 ,  F21S41/39 ,  F21S45/70 ,  F21V7/24 ,  F21V9/32 ,  F21V9/38 ,  F21V9/45 ,  F21V13/14 ,  G02B5/0205 ,  G02B27/1006 ,  H01L33/502 ,  H01S5/005 ,  H01S5/0087 ,  H01S5/02326 ,  F21Y2115/30 ,  H01S5/02251 ,  H01S5/02255 ,  H01S5/06825 ,  H01S5/0683 ,  H01S5/32341

Abstract: A light source device includes a semiconductor light-emitting device which emits coherent excitation light, and a wavelength conversion element which is spaced from the semiconductor light-emitting device, generates fluorescence by converting the wavelength of the excitation light emitted from semiconductor light-emitting device, and generates scattered light by scattering the excitation light. The wavelength conversion element includes a support member, and a wavelength converter disposed on the support member. The wavelength converter includes a first wavelength converter, and a second wavelength converter which is disposed around the first wavelength converter to surround the first wavelength converter in a top view of the surface of the support member on which the wavelength converter is disposed. The ratio of the intensity of fluorescence to that of scattered light is lower in the second wavelength converter than in the first wavelength converter.

公开(公告)号：US20240178638A1

公开(公告)日：2024-05-30

申请号：US18282804

申请日：2022-03-21

Applicant: Topgan Sp. z o.o. ,  Instytut Wysokich Cisnien Polskiej Akademii Nauk

Inventor： Anna KAFAR ,  Krzysztof GIBASIEWICZ ,  Jacek KACPERSKI ,  Kiran SABA ,  Szymon STANCZYK ,  Piotr PERLIN

IPC: H01S5/42 ,  H01S5/02 ,  H01S5/02255 ,  H01S5/20 ,  H01S5/34 ,  H01S5/343 ,  H01S5/40

CPC classification number: H01S5/42 ,  H01S5/0206 ,  H01S5/02255 ,  H01S5/2009 ,  H01S5/2081 ,  H01S5/3408 ,  H01S5/34333 ,  H01S5/4075

Abstract: The invention relates to a method for manufacturing a two-dimensional laser diode array comprising preparing a structured gallium nitride bulk substrate, a lower cladding layer, a lower light guide layer, a light-emitting layer, electron blocking layers, an upper light guide layer, an upper cladding layer, a subcontact layer, and includes forming, in GaN substrate (1) with thickness of at least 200 μm, light beam deflectors (15) by applying photoresist on the GaN substrate (1), irradiating it, developing it, and subsequently etching the applied layer in order to obtain the light beam deflectors (15). The invention relates also to a two-dimensional laser diode array manufactured using the method according to the invention.