公开(公告)号：US07281931B2

公开(公告)日：2007-10-16

申请号：US10897465

申请日：2004-07-23

Applicant: Nagao Miyazaki ,  Yoshihiko Suzuki

Inventor： Nagao Miyazaki ,  Yoshihiko Suzuki

IPC: H01R4/58

CPC classification number: H05K1/14 ,  H01R4/04 ,  H01R12/52 ,  H01R13/6683 ,  H05K1/0284 ,  H05K1/142 ,  H05K1/144 ,  H05K3/321 ,  H05K2201/0224 ,  H05K2201/09963 ,  H05K2203/0278

Abstract: In a construction for electrically connecting electrical unit with joint surfaces thereof opposed to each other, wiring patterns electrically connected with distortion gauges are formed on function-element forming surfaces of each electrical three-dimensional unit and are extended to edge portions formed between the function-element forming surfaces and adjacent wiring surfaces as the joint surfaces to form first lands; second lands extending from the edge portions by a specified distance are formed at positions of the wiring surfaces corresponding to the first lands; and electrical connectors displaying a joining performance upon being pressed together are formed to bridge the first and second lands while being held in close contact with the first and second lands. A plurality of three-dimensional electrical unit can be securely and easily electrically connected with each other with high precision.

Abstract translation: 在将电气单元与其相对的接合面电连接的结构中，在每个电三维单元的功能元件形成表面上形成与变形量规电连接的布线图案，并延伸到形成在功能元件之间的边缘部分， 元件形成表面和相邻布线表面作为接合表面以形成第一焊盘; 在与第一焊盘对应的布线面的位置处形成从边缘部延伸规定距离的第二焊盘; 并且形成在被压在一起时显示接合性能的电连接器，以在与第一和第二焊盘保持紧密接触的同时桥接第一和第二焊盘。 多个三维电气单元可以以高精度牢固且容易地彼此电连接。

公开(公告)号：US20070159157A1

公开(公告)日：2007-07-12

申请号：US11529263

申请日：2006-09-29

Applicant: Yuichiro Sano ,  Toru Miyasaka

Inventor： Yuichiro Sano ,  Toru Miyasaka

IPC: G01N27/00

CPC classification number: H05K3/1266 ,  H05K2201/0224 ,  H05K2203/0143 ,  H05K2203/0285 ,  H05K2203/0517 ,  Y10T428/26

Abstract: Microscopic particle decentralized solution having microscopic particles with different diameters are decentralized, wherein: the microscopic particle decentralized solution has two peaks in a granularity distribution, at a large diameter and a small diameter; and microscopic particle mixtures satisfying the following relationships are decentralized in the solution; R>r and n>3.84×(R/r)3×N, where R is a large particle diameter, r is a small particle diameter, N is the number of large particles, and n is the number of small particle.

Abstract translation: 具有不同直径的微观粒子的微观粒子分散溶液是分散的，其中：微观粒子分散溶液在粒径分布中具有两个峰，大直径和小直径; 满足以下关系的微观粒子混合物在溶液中分散; R“r和n> 3.84x（R / r），内联公式描述=”在线公式“end =”lead“ -formulae description =“在线公式”end =“tail”？>其中R是大粒径，r是小粒径，N是大颗粒的数量，n是小颗粒的数量。

公开(公告)号：US20070154634A1

公开(公告)日：2007-07-05

申请号：US11611010

申请日：2006-12-14

Applicant: Michael Renn

Inventor： Michael Renn

IPC: B05D1/12 ,  B05D7/00 ,  B05D3/00

CPC classification number: B22F1/0062 ,  A61F2002/30968 ,  B22F1/0022 ,  B22F3/105 ,  B41M7/009 ,  B82Y30/00 ,  C03C17/006 ,  C03C2217/42 ,  C03C2218/32 ,  C23C4/134 ,  C23C4/18 ,  C23C8/02 ,  C23C8/10 ,  C23C8/80 ,  C23C24/04 ,  C23C26/00 ,  H01C17/06506 ,  H05K3/102 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2203/095 ,  H05K2203/1131

Abstract: Method and apparatus for low temperature sintering of sintering of printable conductive inks, preferably using a plasma. The inks can be deposited on a substrate using any number of deposition techniques, and can be applied to processing on materials including, but not limited to, electronic, biologic, and low-temperature substrates. The inks preferably comprise metallic nanoparticles coated with an organic non-conductive material. The plasma removes the organic material and facilitates the sintering of the metallic particles into a continuous deposit, without exposing the substrate to high temperatures.

Abstract translation: 优选使用等离子体的可印刷导电油墨的烧结低温烧结的方法和装置。 油墨可以使用任何数量的沉积技术沉积在基材上，并且可以应用于包括但不限于电子，生物和低温基材的材料的加工。 油墨优选包含用有机非导电材料涂覆的金属纳米颗粒。 等离子体去除有机材料，并且有助于将金属颗粒烧结成连续沉积物，而不将基底暴露于高温。

公开(公告)号：US20070131141A1

公开(公告)日：2007-06-14

申请号：US10556516

申请日：2004-05-17

Applicant: Tamiharu Masatoki ,  Arata Tsurusaki ,  Masashi Kumagai ,  Takashi Ouchi ,  Takashi Kinase ,  Masataka Sugioka ,  Takeshi Nakano

Inventor： Tamiharu Masatoki ,  Arata Tsurusaki ,  Masashi Kumagai ,  Takashi Ouchi ,  Takashi Kinase ,  Masataka Sugioka ,  Takeshi Nakano

IPC: B32B15/08 ,  C09D183/04 ,  B05D3/02 ,  B05D1/36

CPC classification number: C23C28/00 ,  B23K35/0244 ,  C23C2/08 ,  C23C2/26 ,  C23C22/03 ,  C23C28/021 ,  C23C2222/20 ,  H01L23/49816 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/0224 ,  H05K2201/10234 ,  Y02P70/613 ,  Y10T428/12569 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: There is disclosed is a method comprising surface-processing a Sn based, Sn alloy based or Sn—Zn alloy based solder particle (1), applied as a coating, such as by electrical plating or melt plating, to the surface of a metal material, such as iron, a steel plate or copper, with a phosphate and a silicium containing compound, to form a protective film (2). There are also disclosed a solder material (6) in which a protective film (2) formed of a phosphate and a silicium containing compound is formed on the surface of the Sn—Zn based solder particle (1), and a solder paste formed of this solder material (6) and the flux.

Abstract translation: 公开了一种方法，其特征在于，将基于Sn，Sn合金或Sn-Zn合金的焊料粒子（1）进行表面处理，作为涂层，例如通过电镀或熔融镀敷，涂敷到金属材料的表面 ，例如铁，钢板或铜，与磷酸盐和含硅化合物形成保护膜（2）。 还公开了一种焊料（6），其中在Sn-Zn基焊料颗粒（1）的表面上形成由磷酸盐和含硅化合物形成的保护膜（2）和由 这种焊料（6）和焊剂。

公开(公告)号：US20070085126A1

公开(公告)日：2007-04-19

申请号：US11544211

申请日：2006-10-05

Applicant: Shih Hsu

Inventor： Shih Hsu

IPC: H01L29/94

CPC classification number: H05K3/381 ,  H05K1/0373 ,  H05K3/4661 ,  H05K2201/0215 ,  H05K2201/0224 ,  H05K2203/0315

Abstract: A circuit board structure and a dielectric layer structure thereof are proposed. The dielectric layer structure has a dielectric layer and a plurality of bonding particles dispersed in the dielectric layer. The bonding particle is a metal powder particle coated with an insulating film. There is an additional circuit structure formed on the dielectric layer. The dielectric layer structure can be applied to any circuit board, such that the circuit board can be formed with a dielectric layer having bonding particles. The circuit board may form a circuit structure on the dielectric layer, so that the connection between the circuit structure and the dielectric layer can be reinforced by the bonding particles. Therefore, the structures of the present invention can ease the fabrication of forming fine pitch wiring in the circuit board structure, so as to form a circuit structure with finer pitch.

Abstract translation: 提出了一种电路板结构及其介电层结构。 电介质层结构具有介电层和分散在电介质层中的多个结合粒子。 粘结颗粒是涂覆有绝缘膜的金属粉末颗粒。 在电介质层上形成一个额外的电路结构。 电介质层结构可以应用于任何电路板，使得电路板可以形成有具有结合颗粒的电介质层。 电路板可以在电介质层上形成电路结构，使得电路结构和电介质层之间的连接可以通过粘结颗粒来加强。 因此，本发明的结构可以简化在电路板结构中形成精细间距布线的制造，从而形成具有更细间距的电路结构。

公开(公告)号：US20060210815A1

公开(公告)日：2006-09-21

申请号：US11373909

申请日：2006-03-14

Applicant: Masahiro Furusawa ,  Rumi Shinagawa ,  Toshimi Fukui ,  Junko Nakamoto ,  Kuninori Obata

Inventor： Masahiro Furusawa ,  Rumi Shinagawa ,  Toshimi Fukui ,  Junko Nakamoto ,  Kuninori Obata

IPC: B32B15/04 ,  B01F3/12 ,  C09K3/00

CPC classification number: H01B1/22 ,  C09D5/24 ,  C23C24/08 ,  C23C26/00 ,  H05K1/097 ,  H05K2201/0224 ,  H05K2203/122 ,  H05K2203/124 ,  Y10T428/31678

Abstract: A metal particle dispersion liquid compries: a compound including a sulfur atom; metal particles whose diameter ranges from 1 to 100 nm and made of a material including a precious metal material; and a dispersion medium. The metal particles is covered by the compound.

Abstract translation: 金属颗粒分散液包括：含硫原子的化合物; 直径范围为1〜100nm的金属颗粒，由含有贵金属材料的材料构成; 和分散介质。 金属颗粒被化合物覆盖。

公开(公告)号：US20060054277A1

公开(公告)日：2006-03-16

申请号：US10538801

申请日：2003-07-29

Applicant: Jung_Il Byun ,  Kyung-Jun Lee ,  Jae-Yong Jung

Inventor： Jung_Il Byun ,  Kyung-Jun Lee ,  Jae-Yong Jung

IPC: B32B7/12

CPC classification number: C09J9/02 ,  C08L33/00 ,  H01B1/22 ,  H01B3/004 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29318 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29371 ,  H01L2224/29399 ,  H01L2224/2949 ,  H01L2224/83101 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H05K3/323 ,  H05K2201/0129 ,  H05K2201/0224 ,  Y10T428/25 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00

Abstract: Disclosed is an anisotropic-electroconductive adhesive, which includes an insulating adhesive component containing a radical polymerizable compound and a polymerization initiator; and a plurality of insulating coated electroconductive particles dispersed in the insulating adhesive component, the insulating coated electroconductive particle having a coating layer made of insulating thermoplastic resin on a surface of an electroconductive particle, wherein a softening point of the insulating thermoplastic resin is lower than an exothermic peak temperature of the insulating adhesive component. The anisotropic-electroconductive adhesive enables rapid curing of the insulating adhesive component at a low temperature and is very useful for making a circuit connection structure since it may prevent a short of circuit without connection failure even when the electroconductive particles are condensed.

Abstract translation: 公开了一种各向异性导电粘合剂，其包括含有自由基聚合性化合物和聚合引发剂的绝缘粘合剂成分; 以及分散在所述绝缘粘合剂组分中的多个绝缘涂覆的导电颗粒，所述绝缘涂覆的导电颗粒在导电颗粒的表面上具有由绝缘热塑性树脂制成的涂层，其中所述绝缘热塑性树脂的软化点低于 绝缘胶组件的放热峰值温度。 各向异性导电粘合剂能够在低温下快速固化绝缘粘合剂组分，并且对于制造电路连接结构非常有用，因为即使当导电颗粒被冷凝时，它也可以防止短路而没有连接故障。

公开(公告)号：US20050110406A1

公开(公告)日：2005-05-26

申请号：US10969845

申请日：2004-10-22

Applicant: Young-Chul Jeong ,  Eun-Gon Kim ,  Ki-Jung Kim

Inventor： Young-Chul Jeong ,  Eun-Gon Kim ,  Ki-Jung Kim

IPC: C09J11/00 ,  C09J201/00 ,  G09F9/00 ,  H01J17/16 ,  H01J17/49 ,  H01R4/04 ,  H01R11/01 ,  H01R43/00 ,  H05K1/14 ,  H05K3/30 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01R12/62 ,  H01J2211/46 ,  H01R4/04 ,  H05K1/147 ,  H05K3/305 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/0367 ,  H05K2201/10977 ,  H05K2203/1189

Abstract: A plasma display device may include a plasma display panel, a driving circuit portion for driving the plasma display panel, a connecter for electrically connecting electrodes of the plasma display panel with the driving circuit portion, and an interconnecter for electrically connecting the connecter with the plasma display panel. The interconnecter may include an adhesive layer, a plurality of conductive pellets, and a plurality of non-conductive pellets dispersed in the adhesive layer. The conductive pellets may be positioned substantially within a first region where the wiring of the connecter overlaps the electrodes of the plasma display panel. The non-conductive pellets may be positioned substantially at least at a second region other than the first region in the adhesive layer.

Abstract translation: 等离子体显示装置可以包括等离子体显示面板，用于驱动等离子体显示面板的驱动电路部分，用于将等离子体显示面板的电极与驱动电路部分电连接的连接器和用于将连接器与等离子体电连接的互连器 显示面板。 互连器可以包括粘合剂层，多个导电颗粒和分散在粘合剂层中的多个非导电颗粒。 导电颗粒可以位于第一区域中，其中连接器的布线与等离子体显示面板的电极重叠。 非导电性颗粒可以基本上至少位于粘合剂层中除了第一区域之外的第二区域。

公开(公告)号：US20040162365A1

公开(公告)日：2004-08-19

申请号：US10777082

申请日：2004-02-13

Inventor： Takahiro Matsumoto ,  Toshiaki Yamada ,  Hirotaka Tsuruya

IPC: C08K009/00 ,  C08K003/28 ,  C08K003/18 ,  C09C001/44

CPC classification number: H05K1/162 ,  B82Y30/00 ,  C01P2004/64 ,  C01P2006/12 ,  C01P2006/40 ,  C04B35/628 ,  C04B35/62821 ,  C04B2235/3293 ,  C09C1/00 ,  H01B1/08 ,  H01B3/006 ,  H01B3/02 ,  H01B3/10 ,  H01G4/206 ,  H05K2201/0215 ,  H05K2201/0224 ,  H05K2201/0257 ,  Y10T428/268 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2998

Abstract: There are disclosed insulated ultrafine powder comprising electroconductive ultrafine powder which is in the form of sphere, spheroid or acicular each having a minor axis in the range of 1 to 100 nm and an insulating film applied thereto; a process for producing the same which is capable of covering the surfaces of the insulated ultrafine powder with the insulating film having a thickness in the range of 0.3 to 100 nm without causing any clearance or vacancy; and a resin composite material which uses the same. A high dielectric constant of the material is assured by adding a small amount of insulated ultrafine powder wherein an insulating film is applied to the electroconductive ultrafine powder, while maintaining the processability and moldability that are the characteristics inherent in a resin material.

Abstract translation: 公开了包含导电性超细粉末的绝缘超细粉末，其为球状，球状或针状，各具有1〜100nm的短轴和施加于其上的绝缘膜; 其制造方法能够利用厚度在0.3〜100nm范围内的绝缘膜覆盖绝缘超细粉末的表面，而不会产生任何间隙或空位; 和使用该树脂复合材料的树脂复合材料。 通过在保持作为树脂材料中固有的特性的加工性和成型性的同时，通过添加少量绝缘超细粉末来确保材料的高介电常数，其中绝缘膜被施加到导电超细粉末。

公开(公告)号：US06777071B2

公开(公告)日：2004-08-17

申请号：US10132835

申请日：2002-04-25

Applicant: Chad A. Cobbley ,  Steve W. Heppler

Inventor： Chad A. Cobbley ,  Steve W. Heppler

IPC: B32B516

CPC classification number: H05K3/323 ,  C08K7/16 ,  C08K9/00 ,  C09J5/00 ,  C09J9/02 ,  C09J11/08 ,  C09J2205/11 ,  H01R4/04 ,  H05K3/321 ,  H05K2201/0224 ,  H05K2203/0278 ,  H05K2203/1163 ,  Y10T428/25 ,  Y10T428/263 ,  Y10T428/2982 ,  Y10T428/2989 ,  Y10T428/2991 ,  Y10T428/2998

Abstract: An anisotropic electrically conducting interconnect is disclosed in which an adhesive comprising particles having a breakable coating of at least one electrically nonconductive material is compressed between a first contact and a second contact. Compression to two contacts breaks the breakable coating exposing an electrically conducting material which makes contact with the first and second contacts. The electrically conducting material may be a metal conductor or a two-part reactive conductive resin/catalyst system. Also disclosed are processes for making such electrical interconnects and adhesives for use in making electrical interconnect.