公开(公告)号：US08203068B2

公开(公告)日：2012-06-19

申请号：US12320232

申请日：2009-01-22

Applicant: Ming-Si Wu ,  Wei-Cheng Tang

Inventor： Ming-Si Wu ,  Wei-Cheng Tang

IPC: H01L31/04 ,  C07D333/06 ,  C09B67/10 ,  C07C229/40

CPC classification number: C07C255/42 ,  C07C2603/18 ,  C07D333/06 ,  C09B57/008 ,  H01G9/2031 ,  H01G9/2059 ,  H01L51/006 ,  H01L51/0068 ,  Y02E10/542 ,  Y02E10/549

Abstract: The present invention relates to a dye compound represented by the following formula (I), or a salt thereof: wherein R1, R2, R3, R4, D1, D2, B, and n are defined the same as the specification, and also relates to a photoelectric component using the same. The dye compound of the present invention is suitable for Dye-Sensitized Solar Cell (DSSC). Hence, the photoelectric characteristics of the DSSC can be improved by using the dye compound of the present invention.

Abstract translation: 本发明涉及由下式（I）表示的染料化合物或其盐：其中R1，R2，R3，R4，D1，D2，B和n定义与说明书相同，并且还涉及 涉及使用其的光电部件。 本发明的染料化合物适用于染料敏化太阳能电池（DSSC）。 因此，通过使用本发明的染料化合物可以提高DSSC的光电特性。

公开(公告)号：US20110291273A1

公开(公告)日：2011-12-01

申请号：US13104597

申请日：2011-05-10

Applicant: CHENG TANG HUANG

Inventor： CHENG TANG HUANG

IPC: H01L23/488 ,  H01L21/283

CPC classification number: H01L24/13 ,  H01L24/11 ,  H01L2224/0239 ,  H01L2224/03462 ,  H01L2224/03916 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/05655 ,  H01L2224/10125 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11622 ,  H01L2224/11849 ,  H01L2224/11903 ,  H01L2224/13005 ,  H01L2224/13007 ,  H01L2224/13008 ,  H01L2224/13017 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13155 ,  H01L2224/1319 ,  H01L2224/13566 ,  H01L2924/0002 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/206 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2224/05552

Abstract: A chip bump structure is formed on a substrate. The substrate includes at least one contact pad and a dielectric layer. The dielectric layer has at least one opening. The at least one opening exposes the at least one contact pad. The chip bump structure includes at least one elastic bump, at least one first metal layer, at least one second metal layer, and at least one solder ball. The at least one elastic bump covers a central portion of the at least one contact pad. The at least one first metal layer covers the at least one elastic bump. The at least one first metal layer has a portion of the at least one contact pad. The portion of the at least one contact pad is not overlaid by the at least one elastic bump. The at least one second metal layer is formed on a portion of the at least one first metal layer. The portion of the at least one first metal layer is located on the top of the at least one elastic bump. The at least one solder ball is formed on the at least one second metal layer. The at least one solder ball is also on the top of the at least one elastic bump.

Abstract translation: 在基板上形成芯片凸块结构。 衬底包括至少一个接触焊盘和介电层。 电介质层具有至少一个开口。 所述至少一个开口暴露所述至少一个接触垫。 芯片凸块结构包括至少一个弹性凸块，至少一个第一金属层，至少一个第二金属层和至少一个焊球。 所述至少一个弹性凸块覆盖所述至少一个接触垫的中心部分。 所述至少一个第一金属层覆盖所述至少一个弹性凸块。 所述至少一个第一金属层具有所述至少一个接触垫的一部分。 至少一个接触垫的部分不被至少一个弹性凸块覆盖。 所述至少一个第二金属层形成在所述至少一个第一金属层的一部分上。 所述至少一个第一金属层的所述部分位于所述至少一个弹性凸块的顶部上。 所述至少一个焊球形成在所述至少一个第二金属层上。 所述至少一个焊球也位于所述至少一个弹性凸块的顶部。

公开(公告)号：US20110212615A1

公开(公告)日：2011-09-01

申请号：US13104980

申请日：2011-05-11

Applicant: Cheng-Tang Huang

Inventor： Cheng-Tang Huang

IPC: H01L21/283

CPC classification number: H01L24/11 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/10126 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/1191 ,  H01L2224/13007 ,  H01L2224/13012 ,  H01L2224/13013 ,  H01L2224/13021 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/05552

Abstract: A manufacturing method of a bump structure having a reinforcement member is disclosed. First, a substrate including pads and a passivation layer is provided. The passivation layer has first openings, and each first opening exposes a portion of the corresponding pad respectively. Next, an under ball metal (UBM) material layer is formed on the substrate to cover the passivation layer and the pads exposed by the passivation layer. Bumps are formed on the UBM material layer and the lower surface of each bump is smaller than that of the opening. Each reinforcement member formed on the UBM material layer around each bump contacts with each bump, and the material of the reinforcement member is a polymer. The UBM material layer is patterned to form UBM layers and the lower surface of each UBM layer is larger than that of each corresponding opening. Hence, the bump has a planar upper surface.

Abstract translation: 公开了一种具有加强件的凸块结构的制造方法。 首先，提供包括焊盘和钝化层的衬底。 钝化层具有第一开口，并且每个第一开口分别暴露相应衬垫的一部分。 接下来，在衬底上形成底部球金属（UBM）材料层以覆盖钝化层和由钝化层暴露的焊盘。 在UBM材料层上形成凸起，并且每个凸起的下表面小于开口的下表面。 形成在每个凸块周围的UBM材料层上的每个加强构件与每个凸块接触，并且加强构件的材料是聚合物。 将UBM材料层图案化以形成UBM层，并且每个UBM层的下表面大于每个相应开口的下表面。 因此，凸块具有平坦的上表面。

公开(公告)号：US20110003431A1

公开(公告)日：2011-01-06

申请号：US12882324

申请日：2010-09-15

Applicant: Cheng-Tang HUANG

Inventor： Cheng-Tang HUANG

IPC: H01L21/50

CPC classification number: H01L23/5389 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/83 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/83191 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01094 ,  H01L2924/014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/82 ,  H01L2924/00

Abstract: A die rearrangement package structure is provided and includes a die; an encapsulated structure is covered around the four sides of the die to expose the active surface and the reverse side of the die; a patterned protective layer is formed on the encapsulated structure and the active surface of the die, and the pads is to be exposed; one end of fan-out patterned metal layer is electrically connected the pads and other end is extended to cover the patterned protective layer; patterned second protective layer is provided to cover the patterned metal layer to expose the portions surface of the patterned metal layer; patterned UBM layer is formed on the exposed surface of the patterned metal layer; and a conductive component is formed on the patterned UBM layer, and electrically connected the patterned metal layer.

Abstract translation: 提供了一种管芯重排封装结构，包括一个管芯; 封装结构围绕模具的四个侧面被覆盖以暴露模具的活性表面和反面; 在封装结构和芯片的有源表面上形成图案化保护层，并且焊盘被暴露; 扇出图案化金属层的一端电连接焊盘，另一端延伸以覆盖图案化的保护层; 图案化的第二保护层被提供以覆盖图案化的金属层以暴露图案化金属层的部分表面; 图案化的UBM层形成在图案化金属层的暴露表面上; 并且在图案化的UBM层上形成导电部件，并且电连接图案化的金属层。

公开(公告)号：US20100256475A1

公开(公告)日：2010-10-07

申请号：US12419414

申请日：2009-04-07

Applicant: Cheng-Tang CHIANG

Inventor： Cheng-Tang CHIANG

IPC: A61B5/04 ,  A61B5/103

CPC classification number: A61B5/04 ,  A61B5/02438 ,  A61B5/11 ,  A61B5/6804 ,  A61B5/6805 ,  A61B5/681 ,  A61B5/6824

Abstract: The present invention proposes a physiological-measurement health-care sport suit, which comprises two sensing members, an electric conduction coat, and a measurement device. Two pieces of electric conduction cloth are arranged on appropriate positions of the electric conduction coat and function as signal transmission media. The two sensing members respectively have a sensing electrode, and the sensing electrodes are respectively electrically connected to a piece of electric conduction cloth. The measurement device is arranged on the electric conduction coat and electrically connected to the two pieces of electric conduction cloth. When a user wears the suit having the two sensing members, the sensing electrodes respectively contact two test points on the user's body to obtain physiological potential signals. Then, the signals are transferred through the electric conduction cloth to the measurement device.

Abstract translation: 本发明提出一种生理测量保健运动服，其包括两个感测构件，导电涂层和测量装置。 两根导电布布置在导电涂层的适当位置上，作为信号传输介质。 两个检测元件分别具有感测电极，并且感测电极分别电连接到一块导电布。 测量装置布置在导电涂层上并电连接到两片导电布上。 当用户穿着具有两个感测构件的衣服时，感测电极分别接触用户身体上的两个测试点以获得生理电位信号。 然后，信号通过导电布转移到测量装置。

公开(公告)号：US07656020B2

公开(公告)日：2010-02-02

申请号：US11822113

申请日：2007-07-02

Applicant: Cheng Tang Huang

Inventor： Cheng Tang Huang

IPC: H01L23/488 ,  H01L23/495

CPC classification number: H01L24/11 ,  H01L23/525 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/013

Abstract: A packaging conductive structure for a semiconductor substrate and a method for forming the structure are provided. The dielectric layer of the packaging conductive structure partially overlays the metallic layer of the semiconductor substrate and has a receiving space. The lifting layer and conductive layer are formed in the receiving space, wherein the conductive layer extends for connection to a bump. The lifting layer is partially connected to the dielectric layer. As a result, the conductive layer can be stably deposited on the edge of the dielectric layer for enhancing the reliability of the packaging conductive structure.

Abstract translation: 提供了一种用于半导体衬底的封装导电结构以及用于形成该结构的方法。 包装导电结构的电介质层部分覆盖半导体衬底的金属层并具有接收空间。 提升层和导电层形成在接收空间中，其中导电层延伸以连接到凸块。 提升层部分连接到电介质层。 结果，导电层可以稳定地沉积在电介质层的边缘上，以提高封装导电结构的可靠性。

公开(公告)号：US20090302448A1

公开(公告)日：2009-12-10

申请号：US12330790

申请日：2008-12-09

Applicant: Cheng-Tang Huang

Inventor： Cheng-Tang Huang

IPC: H01L23/488 ,  H01L21/56

CPC classification number: H01L24/19 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3114 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01094 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18162 ,  Y10S438/977 ,  H01L2224/82 ,  H01L2224/83

Abstract: A chip package structure is provided, includes a chip that having a plurality of pads and an adhesive layer on the back side; an encapsulated structure is covered around the four sides of the chip to expose the pads, and the through holes is formed within the encapsulated structure; a patterned first protective layer is formed on the portion surface of encapsulated structure, the portion of active surface of the chips, and the pads of the chip and the through holes are to be exposed; a metal layer is formed on the portion surface of the patterned first protective layer and formed to electrically connect the pads and to fill with the through holes; the patterned second protective layer is formed on the patterned first protective layer and the portion of metal layer, and the portion surface of metal layer is to be exposed; a patterned UBM layer is formed on the exposed surface of the metal layer and the portion surface of the patterned second protective layer; and the conductive elements is formed on the patterned UBM layer and electrically connect to the metal layer.

Abstract translation: 提供一种芯片封装结构，包括：具有多个焊盘的芯片和在背面上的粘合剂层; 封装结构被覆盖在芯片的四边周围以露出焊盘，并且在封装结构内形成通孔; 图案化的第一保护层形成在封装结构的部分表面上，芯片的有源表面的部分以及芯片的焊盘和通孔的露出; 在图案化的第一保护层的部分表面上形成金属层，以形成电连接焊盘并填充通孔; 图案化的第二保护层形成在图案化的第一保护层和金属层的一部分上，并且金属层的部分表面将被暴露; 图案化的UBM层形成在金属层的暴露表面和图案化的第二保护层的部分表面上; 并且导电元件形成在图案化的UBM层上并电连接到金属层。

公开(公告)号：US07408976B1

公开(公告)日：2008-08-05

申请号：US10912829

申请日：2004-08-05

Applicant: Ravi Narasimhan ,  Hemanth Sampath ,  Hsiao-Cheng Tang

Inventor： Ravi Narasimhan ,  Hemanth Sampath ,  Hsiao-Cheng Tang

IPC: H04B1/69 ,  H04B1/04

CPC classification number: H04L27/2663 ,  H04B7/0413 ,  H04B17/21 ,  H04L1/0054 ,  H04L5/0007 ,  H04L5/0023 ,  H04L5/0026 ,  H04L25/0204 ,  H04L25/03159 ,  H04L27/2602 ,  H04L27/266

Abstract: A receiver in a MIMO-OFDM system may process OFDM symbols received on a number (MR) of receive antennas. The system may utilize a MIMO-OFDM frame format that includes additional long training OFDM symbols, for training additional antennas and for link adaptation, and a header with an additional SIGNAL symbol to indicate MIMO-OFDM-specific information.

Abstract translation: MIMO-OFDM系统中的接收机可以处理在数个（M SUB R）个接收天线上接收的OFDM符号。 该系统可以利用包括附加的长训练OFDM符号的MIMO-OFDM帧格式，用于训练附加天线和链路适配，以及具有附加信号符号的报头以指示MIMO-OFDM特定信息。

公开(公告)号：US07382367B1

公开(公告)日：2008-06-03

申请号：US11383135

申请日：2006-05-12

Applicant: Hongsheng Lu ,  Cheng-Tang Wu

Inventor： Hongsheng Lu ,  Cheng-Tang Wu

IPC: G06T17/20

CPC classification number: G06T17/20

Abstract: A method and system for transferring state variables between an old and new model in an adaptive mesh-free analysis is described. The old and the new model are associated with a set of old and new integration points, respectively. A third set of nodes is formed to include old boundary nodes and the set of old integration points. For each of the new integration points, a sub-set of the third set is defined. The support of each node of the sub-set covers the new integration point to be evaluated. A local interpolant with a desirable consistency condition and interpolation properties is constructed to interpolate state variables at the new integration points. All of the non-interpolated approximation can be transformed into the interpolated approximation with the desired consistency condition and smoothness using this procedure.

Abstract translation: 描述了一种在自适应网格分析中在旧模型和新模型之间传递状态变量的方法和系统。 旧的和新的模型分别与一组新的和新的集成点相关联。 形成第三组节点以包括旧边界节点和一组旧的积分点。 对于每个新的集成点，定义第三组的子集。 子集的每个节点的支持覆盖了要评估的新集成点。 构建具有期望的一致性条件和内插特性的局部内插器来在新的积分点处插值状态变量。 使用该过程，所有的非内插近似可以被转换成具有期望的一致性条件和平滑度的内插近似。

公开(公告)号：US20080000760A1

公开(公告)日：2008-01-03

申请号：US11428483

申请日：2006-07-03

Applicant: Say Hwee NG ,  Tian Cheng Tang

Inventor： Say Hwee NG ,  Tian Cheng Tang

IPC: H01H9/30

CPC classification number: H01H13/186 ,  H01H13/503 ,  H01H13/506

Abstract: A switch for switching between two electrical circuits is disclosed. The switch has a first connector that is electrically couplable to a first electrical circuit and a second connector that is electrically couplable to a second electrical circuit. The switch also has a first contact point adapted for electrically coupling the first connector to the first electrical circuit and a second contact point for electrically coupling the second connector to the second electrical circuit. The switch further includes an actuator for actuating the first and second connectors, wherein when the actuator is actuated to a first position, the first connector is electrically coupled to the first contact point while the second connector is electrically decoupled from the second contact point to thereby electrically close the first electrical circuit and electrically open the second electrical circuit, and when the actuator is actuated to a second position, the second connector is electrically coupled to the second contact point while the first connector is decoupled from the first contact point to thereby electrically close the second electrical circuit and electrically open the first electrical circuit.

Abstract translation: 公开了用于在两个电路之间切换的开关。 开关具有可电连接到第一电路的第一连接器和可与第二电路电耦合的第二连接器。 开关还具有适于将第一连接器电耦合到第一电路的第一接触点和用于将第二连接器电耦合到第二电路的第二接触点。 开关还包括用于致动第一和第二连接器的致动器，其中当致动器被致动到第一位置时，第一连接器电耦合到第一接触点，同时第二连接器与第二接触点电分离，从而 电闭合第一电路并电气打开第二电路，并且当致动器被致动到第二位置时，第二连接器电耦合到第二接触点，同时第一连接器与第一接触点分离，从而电 关闭第二个电路并电开第一个电路。