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    Prismatic laminate and method for making the same
    41.
    发明授权
    Prismatic laminate and method for making the same 有权
    棱镜层压板及其制作方法

    公开(公告)号：US08089697B2

    公开(公告)日：2012-01-03

    申请号：US12652216

    申请日：2010-01-05

    Applicant: Whey-Bin Lor ,  Kuang-Lin Yuan ,  Ru-Ping Huang ,  Chia-Chu Lin ,  Tsung-Sung Tsai ,  Ming-Hsiang Lee ,  Ching-Hung Lin ,  Ming-Cheng Shih

    Inventor： Whey-Bin Lor ,  Kuang-Lin Yuan ,  Ru-Ping Huang ,  Chia-Chu Lin ,  Tsung-Sung Tsai ,  Ming-Hsiang Lee ,  Ching-Hung Lin ,  Ming-Cheng Shih

    IPC: G02B27/10 ,  F21V5/02 ,  B05D5/06

    CPC classification number: G02B5/0278 ,  G02B5/0231

    Abstract: A method for making a prismatic laminate includes the steps of: a) forming a back-coating roller having a roller surface with a plurality of recesses arranged in a predetermined pattern and produced by laser holography; b) preparing a prismatic structure including a plate body having a first surface and a second surface opposite to the first surface, and a plurality of prismatic strips formed on the first surface of the plate body; c) applying a coating containing a resin component and an antistatic agent on the second surface of the plate body; and d) embossing the coating with the back-coating roller to form an optical layer including a plurality of microstructures protruding in a direction away from the second surface of the plate body and having a pattern corresponding to that of the recesses in the roller surface.

    Abstract translation: 制造棱镜层压体的方法包括以下步骤：a）形成具有辊表面的背涂辊，所述辊表面具有以预定图案布置的多个凹槽，并通过激光全息术产生; b）制备棱柱结构，包括具有第一表面和与第一表面相对的第二表面的板体，以及形成在板体的第一表面上的多个棱柱条; c）在所述板体的第二表面上涂布含有树脂组分和抗静电剂的涂层; 以及d）用所述背涂辊对所述涂层进行压花以形成包括多个微结构的光学层，所述多个微结构在远离所述板体的第二表面的方向上突出并且具有与所述辊表面中的所述凹部相对应的图案。

    Built-in module for inverter and having tension control with integrated tension and velocity closed loops
    42.
    发明授权
    Built-in module for inverter and having tension control with integrated tension and velocity closed loops 有权
    内置逆变器模块，具有集成张力和速度闭环的张力控制

    公开(公告)号：US08079539B2

    公开(公告)日：2011-12-20

    申请号：US12693848

    申请日：2010-01-26

    Applicant: Chien-Ping Huang ,  Cheng-Hsiang Kuo

    Inventor： Chien-Ping Huang ,  Cheng-Hsiang Kuo

    IPC: B65H23/18

    CPC classification number: B65H59/385 ,  B65H23/1955 ,  B65H59/387 ,  B65H2553/51 ,  B65H2555/20 ,  B65H2557/264

    Abstract: A built-in module for an inverter and having tension control with integrated tension and velocity closed loops, where required tension feedbacks can be obtained by internal calculations of the inverter or feedback signals of a tension sensor. The tension control module is applied to provide a tension control for a winding mechanism which is operated by driving at least one motor. The tension control module firstly builds a tension control to provide a balanced tension to the winding mechanism. Afterward, the tension control module builds a velocity control to provide an accelerated or decelerated adjustment for the winding mechanism. Accordingly, the winding mechanism can stably maintain a tension-balanced operation.

    Abstract translation: 内置的逆变器模块，具有集成张力和速度闭环的张力控制，可通过变频器的内部计算或张力传感器的反馈信号获得所需的张力反馈。 张力控制模块用于为通过驱动至少一个电动机而操作的卷绕机构提供张力控制。 张力控制模块首先建立张力控制以向卷绕机构提供平衡的张力。 之后，张力控制模块建立一个速度控制，为卷绕机构提供加速或减速调节。 因此，卷绕机构能够稳定地保持张力平衡动作。

    Air purifier
    43.
    外观设计
    Air purifier 有权

    公开(公告)号：USD650474S1

    公开(公告)日：2011-12-13

    申请号：US29391419

    申请日：2011-05-09

    Applicant: Ping Huang

    Designer： Ping Huang

    Junction profile engineering using staged thermal annealing
    45.
    发明授权
    Junction profile engineering using staged thermal annealing 有权
    接头型材工程采用分段热退火

    公开(公告)号：US08058134B2

    公开(公告)日：2011-11-15

    申请号：US12618052

    申请日：2009-11-13

    Applicant: Li-Ting Wang ,  Keh-Chiang Ku ,  Yu-Chang Lin ,  Nai-Han Cheng ,  Li-Ping Huang

    Inventor： Li-Ting Wang ,  Keh-Chiang Ku ,  Yu-Chang Lin ,  Nai-Han Cheng ,  Li-Ping Huang

    IPC: H01L21/336

    CPC classification number: H01L21/324 ,  H01L21/26506 ,  H01L21/26513 ,  H01L21/26586 ,  H01L29/1083 ,  H01L29/6659 ,  H01L29/7833

    Abstract: An annealing method includes performing an activation annealing on a wafer with a peak temperature of greater than about 1200° C., wherein the activation annealing has a first duration; and performing a defect-recovery annealing on the wafer at a defect-recovery temperature lower than the peak temperature for a second duration. The second duration is longer than the first duration. The annealing method includes no additional annealing steps at temperatures greater than about 1200° C., and no room-temperature cooling step exists between the activation annealing and the defect-recovery annealing.

    Abstract translation: 退火方法包括在峰值温度大于约1200℃的晶片上进行激活退火，其中活化退火具有第一持续时间; 以及在低于所述峰值温度的缺陷恢复温度下对所述晶片进行缺陷恢复退火，持续第二持续时间。 第二个持续时间比第一个持续时间长。 退火方法在大于约1200℃的温度下不包括额外的退火步骤，并且在活化退火和缺陷恢复退火之间不存在室温冷却步骤。

    Manufacturing method and structure of a surface-mounting type diode co-constructed from a silicon wafer and a base plate
    47.
    发明申请
    Manufacturing method and structure of a surface-mounting type diode co-constructed from a silicon wafer and a base plate 有权
    由硅晶片和基板共构造的表面安装型二极管的制造方法和结构

    公开(公告)号：US20110272777A1

    公开(公告)日：2011-11-10

    申请号：US12662792

    申请日：2010-05-04

    Applicant: Wen-Ping Huang ,  Paul Wu

    Inventor： Wen-Ping Huang ,  Paul Wu

    IPC: H01L29/861 ,  H01L21/78 ,  H01L21/761

    CPC classification number: H01L29/861 ,  H01L21/2007 ,  H01L21/78 ,  H01L29/66136 ,  H01L2224/32245 ,  H01L2224/33 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00012

    Abstract: A manufacturing method and a structure of a surface-mounting type diode co-constructed from a silicon wafer and a base plate, in the method, a diffused wafer is stacked with a high temperature durable high strength base plate to have them sintered and molten together for connecting with each other to form a co-constructure; then the diffused wafer is processed by etching and ditching for filling with insulation material, electrodes of the diffused wafer are metalized and all on an identical plane, then production of all functional lines is completed; and then the co-constructure is cut to form a plurality of separated individuals which each forms a surface-mounting type diode to be applied straight. In comparison with the conventional techniques, manufacturing of the present invention is simplified and economic in reducing working hours, size and cost of production and the wafer is not subjected to breaking during manufacturing.

    Abstract translation: 在该方法中，将散射晶片与硅晶片和基板共构成的表面安装型二极管的制造方法和结构与高温耐用的高强度基板层叠，使其烧结并熔融在一起 用于连接以形成共同结构; 然后通过蚀刻和沟槽处理扩散晶片以填充绝缘材料，扩散晶片的电极被金属化并且都在相同的平面上，然后完成所有功能线的生产; 然后切割共同结构以形成多个分离的个体，每个个体形成要被直线施加的表面安装型二极管。 与传统技术相比，简化了本发明的制造，并且在减少工作时间，生产的尺寸和成本以及制造过程中不会损坏晶片的经济性。

    Automatic core-alignment for fusion splicing double-clad fibers
    49.
    发明申请
    Automatic core-alignment for fusion splicing double-clad fibers 失效
    熔接双包层纤维的自动芯线对准

    公开(公告)号：US20110226019A1

    公开(公告)日：2011-09-22

    申请号：US12159738

    申请日：2006-12-29

    Applicant: Wei-Ping Huang ,  Kjell Ahlstedt

    Inventor： Wei-Ping Huang ,  Kjell Ahlstedt

    IPC: G02B6/255 ,  G06K9/00 ,  G06K9/36 ,  C03B37/15

    CPC classification number: G02B6/2551 ,  G02B6/2555

    Abstract: In aligning ends of optical fibers, e.g. ends of large mode area double-clad fibers (LMA-DCFs), in a fiber optic fusion splicer the best position of the object plane of the optical system for observing images of the cores of the fiber ends are first determined by maximizing the contrast of the core image, in particular the core image peak in intensity profiles. The alignment process may be performed by adjusting the offset distance between the observed cores in some suitable way, e.g. by using a cascade technique. In e.g. a process for prealigning the fiber ends the self-focusing effect of optical fibers can be used to first determine the best object plane position for observing the self-focusing effect and then the very pre-alignment operation can be performed. This may extend the range of image analysis allowing e.g. that alignment, in particular core alignment, can be performed without requiring direct information showing the position of sides or edges of the claddings in captured pictures.

    Abstract translation: 在对准光纤的端部，例如 在光纤熔接机中的大模式区域双包层光纤（LMA-DCF）的端部，首先通过最大化对比度来确定用于观察光纤端部的核心的光学系统的光学系统的物体平面的最佳位置 核心图像，特别是核心图像在强度分布峰值。 可以通过以某种合适的方式调整观察到的核之间的偏移距离来执行对准过程，例如， 通过使用级联技术。 在例如 可以使用用于预先对准光纤的自对准效果的方法来终止光纤的自聚焦效果，以首先确定用于观察自聚焦效果的最佳物平面位置，然后可以进行非常的预对准操作。 这可以扩展图像分析的范围，例如允许。 可以执行该对准，特别是核心对准，而不需要直接显示捕获的图像中包层的侧面或边缘的位置的信息。

    Semiconductor package with heat dissipating structure
    50.
    再颁专利
    Semiconductor package with heat dissipating structure 有权
    具有散热结构的半导体封装

    公开(公告)号：USRE42653E1

    公开(公告)日：2011-08-30

    申请号：US12722009

    申请日：2010-03-11

    Applicant: Chien-Ping Huang

    Inventor： Chien-Ping Huang

    IPC: H01L23/10 ,  H01L23/34

    CPC classification number: H01L23/4334 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

    Abstract: A semiconductor package with a heat dissipating structure is provided. The heat dissipating structure includes a flat portion, and a plurality of support portions formed at edge corners of the flat portion for supporting the flat portion above a chip mounted on a substrate. The support portions are mounted at predetermined area on the substrate without interfering with arrangement of the chip and bonding wires that electrically connect the chip to the substrate. The support portions are arranged to form a space embraced by adjacent supports and the flat portion, so as to allow the bonding wires to pass through the space to reach area on the substrate outside coverage of the heat dissipating structure; besides, passive components or other electronic components can be mounted on the substrate at area within or outside the coverage of the heat dissipating structure, thereby improving flexibility in component arrangement in the semiconductor package.

    Abstract translation: 提供具有散热结构的半导体封装。 散热结构包括平坦部分和形成在平坦部分的边缘角部处的多个支撑部分，用于将平坦部分支撑在安装在基板上的芯片上。 支撑部分安装在基板上的预定区域上，而不干扰将芯片与基板电连接的芯片和接合线的布置。 支撑部分被布置成形成由相邻支撑件和平坦部分包围的空间，以便使接合线通过该空间以到达散热结构外部覆盖层上的基板上的区域; 此外，无源部件或其他电子部件可以在散热结构的覆盖范围内或外部的区域处安装在基板上，从而提高半导体封装中的部件布置的灵活性。

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