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公开(公告)号：US20170278885A1
公开(公告)日：2017-09-28
申请号：US15619649
申请日：2017-06-12
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Jean-Michel GREBET , Wee Chin Judy LIM
IPC: H01L27/146 , H01L31/0203
CPC classification number: H01L27/14618 , H01L27/14636 , H01L27/14683 , H01L31/0203 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H01L2924/00014
Abstract: An image sensing device includes an interconnect layer and a number of grid array contacts arranged on a bottom side of the interconnect layer. An image sensor integrated circuit (IC) is carried by the interconnect layer and has an image sensing surface. A number of electrical connections are coupled between the image sensor IC and an upper side of the interconnect layer. A transparent plate overlies the image sensing surface of the image sensor IC. A cap is carried by the interconnect layer and has an opening overlying transparent plate and the image sensing surface. The cap has an upper wall spaced above the interconnect layer and the image sensor IC to define an internal cavity and the cap defines an air vent coupled to the internal cavity.
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公开(公告)号：US09754756B2
公开(公告)日：2017-09-05
申请号：US15150895
申请日：2016-05-10
Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS PTE LTD
Inventor： Davide Giuseppe Patti , Myung Sung Kim
CPC classification number: H01J19/02 , H01J9/025 , H01J9/18 , H01J21/04 , H01J21/105 , H01J21/20 , H01J2209/012 , H01J2209/02
Abstract: A vacuum integrated electronic device has an anode region of conductive material; an insulating region on top of the anode region; a cavity extending through the insulating region and having a sidewall; and a cathode region. The cathode region has a tip portion extending peripherally within the cavity, adjacent to the sidewall of the cavity. The cathode region is formed by tilted deposition, carried out at an angle of 30-60° with respect to a perpendicular to the surface of device.
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43.发明授权公开(公告)号：US09697896B2
公开(公告)日：2017-07-04
申请号：US14623300
申请日：2015-02-16
Applicant: STMICROELECTRONICS S.r.l. , STMICROELECTRONICS PTE LTD
Inventor： Antonino Conte , Alberto Jose′ Di Martino , Kailash Khairnar
CPC classification number: G11C13/0069 , G11C8/04 , G11C13/0004 , G11C13/0023 , G11C13/0026 , G11C13/0061 , G11C13/0097 , G11C2213/79
Abstract: A phase change non-volatile memory device has a memory array with a plurality of memory cells arranged in rows and columns, a column decoder and a row decoder designed to select columns, and, respectively, rows of the memory array during operations of programming of corresponding memory cells. A control logic, coupled to the column decoder and the row decoder, is designed to execute a sequential programming command, to control the column decoder and row decoder to select one column of the memory array and execute sequential programming operations on a desired block of memory cells belonging to contiguous selected rows of the selected column.
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公开(公告)号：US20170123101A1
公开(公告)日：2017-05-04
申请号：US14982518
申请日：2015-12-29
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Jing-En Luan
CPC classification number: G01V8/12 , H01L2224/73265
Abstract: The embodiments of the present disclosure provide a proximity sensor, an electronic apparatus and a method for manufacturing a proximity sensor. The proximity sensor comprises a sensor chip, a light-emitting device, a transparent molding material and a non-transparent molding material, wherein the sensor chip comprises a sensor region; the light-emitting device is located on the sensor chip and is electrically coupled to the sensor chip; the transparent molding material at least covers a light-emitting surface of the light-emitting device; and the non-transparent molding material isolates the transparent molding material from the sensor region.
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公开(公告)号：US09583666B2
公开(公告)日：2017-02-28
申请号：US14668309
申请日：2015-03-25
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Jing-En Luan
CPC classification number: H01L31/16 , G01S7/4813 , G01S17/026 , H01L25/167 , H01L31/02002 , H01L31/02325 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/92227 , H01L2224/97 , H01L2924/15192 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
Abstract: A proximity sensor includes a semiconductor die, a light emitting assembly, a redistribution layer, and an encapsulating layer. A surface of the semiconductor die includes a sensor area and contact pads. A lens is positioned over the sensor area of the semiconductor die. The light emitting assembly includes a light emitting device having a light emitting area, a lens positioned over the light emitting area, and contact pads that face the redistribution layer. A side of the redistribution layer includes contact pads. Electrical connectors place each of the contact pads of the semiconductor die in electrical communication with a respective one of the contact pads of the redistribution layer. The encapsulating layer is positioned on the redistribution layer and at least partially encapsulates the semiconductor die, the lens over the sensor area of the semiconductor die, and the light emitting assembly.
Abstract translation: 接近传感器包括半导体管芯，发光组件，再分配层和封装层。 半导体管芯的表面包括传感器区域和接触焊盘。 透镜位于半导体管芯的传感器区域上方。 发光组件包括具有发光区域的发光器件，位于发光区域上方的透镜以及面向再分布层的接触焊盘。 再分布层的一侧包括接触垫。 电连接器使得半导体管芯的每个接触焊盘与再分配层的接触焊盘中的相应一个电连通。 封装层位于再分配层上，并且至少部分地封装半导体管芯，半导体管芯的传感器区域上的透镜以及发光组件。
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Patent Agency Ranking
46.发明申请SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开半导体器件，半导体封装和制造半导体器件的方法公开(公告)号：US20170040286A1
公开(公告)日：2017-02-09
申请号：US15297948
申请日：2016-10-19
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Jing-En LUAN
IPC: H01L23/00 , H01L23/498 , H01L23/31 , H01L21/78 , H01L23/495 , H01L23/29
CPC classification number: H01L24/92 , H01L21/4853 , H01L21/561 , H01L21/565 , H01L21/78 , H01L23/29 , H01L23/293 , H01L23/3107 , H01L23/3114 , H01L23/3121 , H01L23/3171 , H01L23/49513 , H01L23/49575 , H01L23/49838 , H01L23/49861 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/94 , H01L24/96 , H01L25/0655 , H01L25/50 , H01L2224/04026 , H01L2224/04042 , H01L2224/0569 , H01L2224/2741 , H01L2224/27416 , H01L2224/29082 , H01L2224/2919 , H01L2224/32013 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/8385 , H01L2224/85207 , H01L2224/92247 , H01L2224/94 , H01L2924/00014 , H01L2924/07802 , H01L2924/0781 , H01L2924/181 , H01L2224/27 , H01L2224/03 , H01L2924/00012 , H01L2224/43 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/05599 , H01L2924/00 , H01L2224/85399
Abstract: Embodiments of the present disclosure provide a semiconductor device, a semiconductor package, and a method for manufacturing a semiconductor device. The semiconductor device comprises: a semiconductor die; an electrical isolation layer formed on a surface of the semiconductor die; a substrate; and a non-conductive adhesive layer disposed between the electrical isolation layer and the substrate, so as to adhere the electrical isolation layer to the substrate.
Abstract translation: 本公开的实施例提供半导体器件，半导体封装以及半导体器件的制造方法。 半导体器件包括：半导体管芯; 形成在所述半导体管芯的表面上的电隔离层; 底物; 以及设置在电隔离层和基板之间的非导电粘合剂层，以将电隔离层粘附到基板上。
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公开(公告)号：US09529433B2
公开(公告)日：2016-12-27
申请号：US14586547
申请日：2014-12-30
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Ravi Shankar , Olivier Leneel
CPC classification number: G06F3/014 , G09G5/18 , G09G2370/16
Abstract: A flexible smart glove detects fine hand and finger motions while permitting the wearer to make hand gestures with dexterity. The flexible smart glove has a thickness of less than about 100 μm and incorporates capacitive micro-sensors positioned at finger joint locations. The micro-sensors are thin film devices built on substrates made of a pliable material such as polyimide. Interdigitated serpentine capacitors monitor strain in the back of the hand, while parallel plate capacitors monitor contact pressure on the palm. Thus the smart glove responds electrically to various types of hand motions. Thin film resistors responsive to changes in body temperature are also formed on the flexible substrate. Motion and temperature data is transmitted from the glove to a microprocessor via a passive RFID tag or an active wireless transmitter. An ASIC is embedded in the smart glove to relay real time sensor data to a remote processor.
Abstract translation: 灵活的智能手套可以检测精细的手指和手指运动，同时允许佩戴者灵巧地进行手势。 柔性智能手套具有小于约100μm的厚度，并且包括位于手指接合位置处的电容式微传感器。 微传感器是由诸如聚酰亚胺等柔韧材料制成的基板上的薄膜装置。 交叉蛇形电容器用于监测手背的应变，而平行电容器则监测手掌上的接触压力。 因此，智能手套电动响应于各种类型的手动。 响应于体温变化的薄膜电阻也形成在柔性基板上。 运动和温度数据通过无源RFID标签或有源无线发射器从手套传送到微处理器。 ASIC嵌入智能手套中以将实时传感器数据中继到远程处理器。
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48.发明申请IMAGE SENSOR DEVICE WITH AN ELECTROMAGNETIC COMPATIBILITY SHIELD (EMC) AND ASSOCIATED METHODS 有权具有电磁兼容性屏蔽（EMC）和相关方法的图像传感器装置公开(公告)号：US20160373674A1
公开(公告)日：2016-12-22
申请号：US14740565
申请日：2015-06-16
Applicant: STMICROELECTRONICS PTE LTD
Inventor： DAVE ALEXIS DE LA CRUZ
CPC classification number: H04N5/2252 , G01D11/245 , H01L27/14618 , H01L31/02325 , H04N5/2253 , H04N5/2257
Abstract: An image sensor device includes a base having a rectangular shape and comprising first contacts and a reference voltage contact extending along a first side thereof, a housing carried by the base, and an image sensor integrated circuit (IC) carried by the base within the housing and having an image sensing surface. A focus cell is within the housing, aligned with the image sensing surface, and includes second contacts. An electromagnetic compatibility (EMC) shield is carried by the housing and includes a top panel having an opening therein aligned with the focus cell, and side panels extending downwardly from the top panel. Conductive leads extend between one of the first contacts and a corresponding one of the second contacts. A reference conductive lead extends between the reference voltage contact and the EMC shield.
Abstract translation: 一种图像传感器装置包括具有矩形形状的基部，包括第一触点和沿其第一侧延伸的参考电压触点，由基座承载的外壳以及由基座承载在壳体内的图像传感器集成电路（IC） 并具有图像感测表面。 聚焦单元位于壳体内，与图像感测表面对准，并且包括第二触点。 电磁兼容性（EMC）屏蔽由壳体承载，并且包括顶板，其具有与聚焦电池对准的开口，以及从顶板向下延伸的侧板。 导电引线在第一触点中的一个和第二触点之间相应的一个之间延伸。 参考导线在参考电压触点和EMC屏蔽之间延伸。
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公开(公告)号：US20160293512A1
公开(公告)日：2016-10-06
申请号：US14674156
申请日：2015-03-31
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Yiyi MA , Kim-Yong GOH , Xueren ZHANG
IPC: H01L23/367 , H01L23/00 , H01L25/00 , H01L27/18
CPC classification number: H01L23/367 , H01L23/36 , H01L23/3738 , H01L23/433 , H01L24/32 , H01L24/33 , H01L24/83 , H01L25/50 , H01L27/18 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/33183 , H01L2924/351
Abstract: An electronic device may include a substrate, an active IC die above the substrate, and a dummy IC die above the active IC die. The electronic device may include a first adhesive layer between the active IC die and the dummy IC die, and a heat sink layer above the dummy IC die and extending laterally outwardly to define a gap between the substrate and opposing portions of the heat sink layer.
Abstract translation: 电子器件可以包括衬底，衬底上方的有源IC裸片以及有源IC裸片上的虚设IC裸片。 电子设备可以包括在有源IC管芯和虚设IC管芯之间的第一粘合剂层和位于虚设IC管芯上方的散热层，并且横向向外延伸以限定衬底和散热层的相对部分之间的间隙。
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公开(公告)号：US20160187973A1
公开(公告)日：2016-06-30
申请号：US14586547
申请日：2014-12-30
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Ravi SHANKAR , Olivier LENEEL
CPC classification number: G06F3/014 , G09G5/18 , G09G2370/16
Abstract: A flexible smart glove detects fine hand and finger motions while permitting the wearer to make hand gestures with dexterity. The flexible smart glove has a thickness of less than about 100 μm and incorporates capacitive micro-sensors positioned at finger joint locations. The micro-sensors are thin film devices built on substrates made of a pliable material such as polyimide. Interdigitated serpentine capacitors monitor strain in the back of the hand, while parallel plate capacitors monitor contact pressure on the palm. Thus the smart glove responds electrically to various types of hand motions. Thin film resistors responsive to changes in body temperature are also formed on the flexible substrate. Motion and temperature data is transmitted from the glove to a microprocessor via a passive RFID tag or an active wireless transmitter. An ASIC is embedded in the smart glove to relay real time sensor data to a remote processor.
Abstract translation: 灵活的智能手套可以检测精细的手指和手指运动，同时允许佩戴者灵巧地进行手势。 柔性智能手套具有小于约100μm的厚度，并且包括位于手指接合位置处的电容式微传感器。 微传感器是由诸如聚酰亚胺等柔韧材料制成的基板上的薄膜装置。 交叉蛇形电容器用于监测手背的应变，而平行电容器则监测手掌上的接触压力。 因此，智能手套电动响应于各种类型的手动。 响应于体温变化的薄膜电阻也形成在柔性基板上。 运动和温度数据通过无源RFID标签或有源无线发射器从手套传送到微处理器。 ASIC嵌入智能手套中以将实时传感器数据中继到远程处理器。
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