公开(公告)号：US08782882B2

公开(公告)日：2014-07-22

申请号：US13169736

申请日：2011-06-27

申请人： Motoo Asai ,  Dongdong Wang ,  Takahiro Mori

发明人： Motoo Asai ,  Dongdong Wang ,  Takahiro Mori

IPC分类号： H01K3/10

CPC分类号： H05K3/423 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K1/036 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/381 ,  H05K3/385 ,  H05K3/387 ,  H05K3/388 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/0315 ,  H05K2203/0733 ,  H05K2203/0773 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599

摘要： A method of manufacturing a printed circuit board includes the following steps (A) to (D). (A) Laminating a resin insulating layer on each of two sides of a core member to form a core substrate, (B) forming penetrating openings in the core substrate by applying laser beams, (C) forming a rough surface on the core substrate, and (D) providing a metal film for each penetrating opening to form through holes.

摘要翻译： 制造印刷电路板的方法包括以下步骤（A）至（D）。 （A）在芯部件的两侧各自层叠树脂绝缘层，形成芯基板，（B）通过施加激光而在芯基板上形成贯通孔，（C）在芯基板上形成粗糙面， 和（D）为每个穿透孔提供金属膜以形成通孔。

公开(公告)号：US08288665B2

公开(公告)日：2012-10-16

申请号：US12913258

申请日：2010-10-27

申请人： Motoo Asai ,  Dongdong Wang ,  Takahiro Mori

发明人： Motoo Asai ,  Dongdong Wang ,  Takahiro Mori

IPC分类号： H05K1/11

CPC分类号： H05K3/423 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K1/036 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/381 ,  H05K3/385 ,  H05K3/387 ,  H05K3/388 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/0315 ,  H05K2203/0733 ,  H05K2203/0773 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599

摘要： A multi-layer printed circuit board including a first insulating layer, a first conductor layer having conductor circuits on one surface of the first insulating layer, a second conductor layer having conductor circuits on the opposite surface of the first insulating layer, a second insulating layer on the second conductor and first insulating layers, and a third conductor layer having conductor circuits on the second insulating layer on the opposite side of the second conductor layer. The first and second insulating layers have first and second via holes which are formed in openings of the first and second insulating layers and made of conductive materials filled to the top of the openings such that conductor circuits in the first and third conductor layers are connected to one or more conductor circuits in the second conductor layer, and the first and second via holes are tapering toward the second conductor layer.

摘要翻译： 一种多层印刷电路板，包括第一绝缘层，在第一绝缘层的一个表面上具有导体电路的第一导体层，在第一绝缘层的相对表面上具有导体电路的第二导体层，第二绝缘层 在第二导体和第一绝缘层上的第二绝缘层和在第二导体层的相对侧的第二绝缘层上具有导体电路的第三导体层。 第一绝缘层和第二绝缘层具有第一和第二通孔，其形成在第一和第二绝缘层的开口中，并由填充到开口顶部的导电材料制成，使得第一和第三导体层中的导体电路连接到 第二导体层中的一个或多个导体电路，以及第一和第二通孔朝向第二导体层逐渐变细。

公开(公告)号：US08107253B2

公开(公告)日：2012-01-31

申请号：US12034517

申请日：2008-02-20

申请人： Yasushi Inagaki ,  Motoo Asai ,  Dongdong Wang ,  Hideo Yabashi ,  Seiji Shirai

发明人： Yasushi Inagaki ,  Motoo Asai ,  Dongdong Wang ,  Hideo Yabashi ,  Seiji Shirai

IPC分类号： H05K1/18

CPC分类号： H05K1/115 ,  H01G2/06 ,  H01G4/12 ,  H01G4/224 ,  H01G4/228 ,  H01G4/248 ,  H01G4/40 ,  H01L21/4857 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L23/645 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05027 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01046 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/0231 ,  H05K1/112 ,  H05K1/181 ,  H05K1/183 ,  H05K1/185 ,  H05K1/186 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/09545 ,  H05K2201/096 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611

摘要： A printed circuit board includes a chip capacitor having electrodes and a metal film formed on one or more of the electrodes, an accommodating layer accommodating the chip capacitor inside the accommodating layer, a connection layer formed over the accommodating layer and having a via hole opening extending to the metal film, and a first via hole structure formed in the via hole opening of the connection layer and connected to the metal film on the one or more of the electrodes of the chip capacitor.

摘要翻译： 印刷电路板包括具有电极的片状电容器和形成在一个或多个电极上的金属膜，在容纳层内容纳片状电容器的容纳层，形成在容纳层上的连接层，并且具有通孔开口延伸 以及形成在连接层的通孔开口中并连接到片式电容器的一个或多个电极上的金属膜的第一通孔结构。

公开(公告)号：US07995352B2

公开(公告)日：2011-08-09

申请号：US12691154

申请日：2010-01-21

申请人： Yasushi Inagaki ,  Motoo Asai ,  Dongdong Wang ,  Hideo Yabashi ,  Seiji Shirai

发明人： Yasushi Inagaki ,  Motoo Asai ,  Dongdong Wang ,  Hideo Yabashi ,  Seiji Shirai

IPC分类号： H05K1/18

CPC分类号： H05K1/115 ,  H01G2/06 ,  H01G4/12 ,  H01G4/224 ,  H01G4/228 ,  H01G4/248 ,  H01G4/40 ,  H01L21/4857 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L23/645 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05027 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01046 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/0231 ,  H05K1/112 ,  H05K1/181 ,  H05K1/183 ,  H05K1/185 ,  H05K1/186 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/09545 ,  H05K2201/096 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611

摘要： Chip capacitors are provided in a printed circuit board. In this manner, the distance between an IC chip and each chip capacitor is shortened, and the loop inductance is reduced. In addition, the chip capacitors are accommodated in a core substrate having a large thickness. Therefore, the thickness of the printed circuit board does not become large.

摘要翻译： 片状电容器设置在印刷电路板中。 以这种方式，IC芯片和每个芯片电容器之间的距离缩短，并且环路电感减小。 此外，芯片电容器容纳在具有大厚​​度的芯基板中。 因此，印刷电路板的厚度不会变大。

公开(公告)号：US20080169120A1

公开(公告)日：2008-07-17

申请号：US11778139

申请日：2007-07-16

申请人： Yasushi Inagaki ,  Motoo Asai ,  Dongdong Wang ,  Hideo Yabashi ,  Seiji Shirai

发明人： Yasushi Inagaki ,  Motoo Asai ,  Dongdong Wang ,  Hideo Yabashi ,  Seiji Shirai

IPC分类号： H05K1/03

CPC分类号： H05K1/181 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L23/645 ,  H01L24/16 ,  H01L24/17 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/0231 ,  H05K1/185 ,  H05K1/186 ,  H05K1/187 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0187 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/435 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599

摘要： A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substrate 30 id constituted by provided a first resin substrate 30a, a second resin substrate 30b and a third resin substrate 30c in a multilayer manner, the core substrate 30 can obtain sufficient strength.

摘要翻译： 片状电容器20设置在印刷电路板10的芯基板30中。 这使得可以缩短IC芯片90和芯片电容器20之间的距离并减小环路电感。 由于通过以多层方式设置第一树脂基板30a，第二树脂基板30b和第三树脂基板30c构成的芯基板30d，因此芯基板30可以获得足够的强度。

公开(公告)号：US20080158841A1

公开(公告)日：2008-07-03

申请号：US12034504

申请日：2008-02-20

申请人： Yasushi INAGAKI ,  Motoo Asai ,  Dongdong Wang ,  Hideo Yabashi ,  Seiji Shirai

发明人： Yasushi INAGAKI ,  Motoo Asai ,  Dongdong Wang ,  Hideo Yabashi ,  Seiji Shirai

IPC分类号： H05K7/02

CPC分类号： H05K1/115 ,  H01G2/06 ,  H01G4/12 ,  H01G4/224 ,  H01G4/228 ,  H01G4/248 ,  H01G4/40 ,  H01L21/4857 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L23/645 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05027 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01046 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/0231 ,  H05K1/112 ,  H05K1/181 ,  H05K1/183 ,  H05K1/185 ,  H05K1/186 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/09545 ,  H05K2201/096 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611

摘要： Chip capacitors 20 are provided in a printed circuit board 10. In this manner, the distance between an IC chip 90 and each chip capacitor 20 is shortened, and the loop inductance is reduced. In addition, the chip capacitors 20 are accommodated in a core substrate 30 having a large thickness. Therefore, the thickness of the printed circuit board does not become large.

摘要翻译： 片状电容器20设置在印刷电路板10中。 以这种方式，IC芯片90和每个片状电容器20之间的距离缩短，并且环路电感减小。 此外，芯片电容器20被容纳在具有大厚​​度的芯基板30中。 因此，印刷电路板的厚度不会变大。

公开(公告)号：US20080158838A1

公开(公告)日：2008-07-03

申请号：US12034517

申请日：2008-02-20

申请人： Yasushi INAGAKI ,  Motoo Asai ,  Dongdong Wang ,  Hideo Yabashi ,  Seiji Shirai

发明人： Yasushi INAGAKI ,  Motoo Asai ,  Dongdong Wang ,  Hideo Yabashi ,  Seiji Shirai

IPC分类号： H05K1/18

CPC分类号： H05K1/115 ,  H01G2/06 ,  H01G4/12 ,  H01G4/224 ,  H01G4/228 ,  H01G4/248 ,  H01G4/40 ,  H01L21/4857 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L23/645 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05027 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01046 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/0231 ,  H05K1/112 ,  H05K1/181 ,  H05K1/183 ,  H05K1/185 ,  H05K1/186 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/09545 ,  H05K2201/096 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611

摘要： Chip capacitors 20 are provided in a printed circuit board 10. In this manner, the distance between an IC chip 90 and each chip capacitor 20 is shortened, and the loop inductance is reduced. In addition, the chip capacitors 20 are accommodated in a core substrate 30 having a large thickness. Therefore, the thickness of the printed circuit board does not become large.

公开(公告)号：US07307852B2

公开(公告)日：2007-12-11

申请号：US11062672

申请日：2005-02-23

申请人： Yasushi Inagaki ,  Motoo Asai ,  Dongdong Wang ,  Hideo Yabashi ,  Seiji Shirai

发明人： Yasushi Inagaki ,  Motoo Asai ,  Dongdong Wang ,  Hideo Yabashi ,  Seiji Shirai

IPC分类号： H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC分类号： H05K1/115 ,  H01G2/06 ,  H01G4/12 ,  H01G4/224 ,  H01G4/228 ,  H01G4/248 ,  H01G4/40 ,  H01L21/4857 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L23/645 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05027 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01046 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/0231 ,  H05K1/112 ,  H05K1/181 ,  H05K1/183 ,  H05K1/185 ,  H05K1/186 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/09545 ,  H05K2201/096 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611

摘要： Chip capacitors 20 are provided in a printed circuit board 10. In this manner, the distance between an IC chip 90 and each chip capacitor 20 is shortened, and the loop inductance is reduced. In addition, the chip capacitors 20 are accommodated in a core substrate 30 having a large thickness. Therefore, the thickness of the printed circuit board does not become large.

摘要翻译： 片状电容器20设置在印刷电路板10中。 以这种方式，IC芯片90和每个片状电容器20之间的距离缩短，并且环路电感减小。 此外，芯片电容器20被容纳在具有大厚​​度的芯基板30中。 因此，印刷电路板的厚度不会变大。

公开(公告)号：US06828510B1

公开(公告)日：2004-12-07

申请号：US09979388

申请日：2001-12-28

申请人： Motoo Asai ,  Dongdong Wang ,  Takahiro Mori

发明人： Motoo Asai ,  Dongdong Wang ,  Takahiro Mori

IPC分类号： H05K103

CPC分类号： H05K3/423 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K1/036 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/381 ,  H05K3/385 ,  H05K3/387 ,  H05K3/388 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/0315 ,  H05K2203/0733 ,  H05K2203/0773 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599

摘要： A metal layer 18 is sandwiched between insulating layers 14 and 20 so that required strength is maintained. Hence it follows that the thickness of a core substrate 30 can be reduced and, therefore, the thickness of a multi-layer printed circuit board can be reduced. Formation of non-penetrating openings 22 which reach the metal layer 18 in the insulating layers 14 and 20 is simply required. Therefore, small non-penetrating openings 22 can easily be formed by applying laser beams. Thus, through holes 36 each having a small diameter can be formed.

摘要翻译： 金属层18夹在绝缘层14和20之间，从而保持所需的强度。 因此，可以减小芯基板30的厚度，因此可以减小多层印刷电路板的厚度。 仅仅需要在绝缘层14和20中到达金属层18的非穿透开口22的形成。 因此，通过施加激光束可以容易地形成小的非穿透开口22。 因此，可以形成各自具有小直径的通孔36。

公开(公告)号：US08822828B2

公开(公告)日：2014-09-02

申请号：US13089378

申请日：2011-04-19

申请人： Motoo Asai ,  Dongdong Wang ,  Takahiro Mori

发明人： Motoo Asai ,  Dongdong Wang ,  Takahiro Mori

IPC分类号： H05K1/03

CPC分类号： H05K3/423 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K1/036 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/381 ,  H05K3/385 ,  H05K3/387 ,  H05K3/388 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/0315 ,  H05K2203/0733 ,  H05K2203/0773 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599

摘要： A multi-layer printed circuit board includes a core structure including resin layers and conductor circuits sandwiched by the resin layers, the core structure having first and second surfaces, a first conductor layer including conductor circuits on the first surface of the core structure, and a second conductor layer including conductor circuits on the second surface of the core structure. The core structure includes first and via holes, and the first and second via holes include a metal filling up to the respective top of openings in the resin layers, respectively, sandwich one or more conductor circuits in the core structure and are positioned vertically to form a through hole electrically connecting respective ones of the conductor circuits of the first and second conductor layers, and the first and second via holes are deviated from each other in a vertical direction.

摘要翻译： 多层印刷电路板包括：包括树脂层的芯结构和被树脂层夹持的导体电路，所述芯结构具有第一和第二表面，在芯结构的第一表面上包括导体电路的第一导体层，以及 第二导体层，包括在芯结构的第二表面上的导体电路。 芯结构包括第一和通孔，并且第一和第二通孔分别包括在树脂层中分别填充到各个开口顶部的金属，将一个或多个导体电路夹在芯结构中并垂直定位以形成 电连接第一和第二导体层的各个导体电路的通孔以及第一和第二通孔在垂直方向上彼此偏离。