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114 条记录 (耗时 0.023 秒)

    Electric plating method, electric plating apparatus, program for plating, recording medium, and manufacturing method and manufacturing apparatus for semiconductor device
    45.
    发明授权
    Electric plating method, electric plating apparatus, program for plating, recording medium, and manufacturing method and manufacturing apparatus for semiconductor device 有权
    电镀方法，电镀装置，电镀程序，记录介质，以及半导体装置的制造方法和制造装置

    公开(公告)号：US07579275B2

    公开(公告)日：2009-08-25

    申请号：US10253480

    申请日：2002-09-25

    申请人： Hiroshi Nakano ,  Takeyuki Itabashi ,  Haruo Akahoshi

    发明人： Hiroshi Nakano ,  Takeyuki Itabashi ,  Haruo Akahoshi

    IPC分类号： H01L21/44 ,  B01J19/12 ,  G01N27/26 ,  B05C3/00

    CPC分类号： H01L21/76877 ,  C25D7/12 ,  C25D17/001 ,  H01L21/2885

    摘要： In electric plating of supplying a current between an anode electrode and a cathode electrode as a plated body immersed in a plating solution thereby forming a plated film comprising a conductor on a surface of the cathode electrode, a preliminary electrolytic electrode that comes in contact with the plating solution before the cathode electrode comes in contact with the plating solution is disposed, and the cathode electrode is brought into contact with the plating solution while supplying a preliminary electrolytic current between the preliminary electrolytic electrode and the anode electrode, whereby a uniform plated film with no voids can be formed while suppressing dissolution of the underlying conductive film in the electric plating treatment.

    摘要翻译： 在将阳极电极和阴极电极之间的电流供给到浸渍在电镀液中的电镀体的电镀中，由此在阴极电极的表面形成包含导体的电镀膜，与该电解液接触的预备电解电极 配置阴极与镀液接触之前的镀液，并且在预备电解电极和阳极电极之间提供预备的电解电流的同时使阴极与镀液接触，由此形成均匀的镀膜 在电镀处理中，在抑制下面的导电膜的溶解的同时，不会形成空隙。

    Electroless copper plating solution, electroless copper plating process and production process of circuit board
    48.
    发明申请
    Electroless copper plating solution, electroless copper plating process and production process of circuit board 审中-公开
    化学镀铜液，化学镀铜工艺及电路板生产工艺

    公开(公告)号：US20070079727A1

    公开(公告)日：2007-04-12

    申请号：US11634071

    申请日：2006-12-06

    申请人： Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

    发明人： Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

    IPC分类号： C23C18/40 ,  B05D1/40

    CPC分类号： C23C18/1803 ,  C23C18/1653 ,  C23C18/40

    摘要： This invention provides an electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time. The electroless copper plating solution comprises copper ion, a complexing agent for copper ion, a reducing agent for copper ion and a pH adjusting agent, wherein said reducing agent for copper ion is glyoxylic acid or a salt thereof, said pH adjusting agent is potassium hydroxide and said electroless copper plating solution contains at least one member selected from metasilicic acid, metasilicic acid salt, germanium dioxide, germanic acid salt, phosphoric acid, phosphoric acid salt, vanadic acid, vanadic acid salt, stannic acid and stannic acid salt in an amount of 0.0001 mol/L or more.

    摘要翻译： 本发明提供一种使用乙醛酸作为还原剂的化学镀铜溶液，其在坎尼扎罗反应的反应量较小时，不会通过电镀反应和坎尼扎罗反应在很大程度上导致积存在化学镀铜溶液中的盐沉淀， 并可长期稳定使用。 所述无电镀铜溶液包括铜离子，铜离子络合剂，铜离子还原剂和pH调节剂，其中所述铜离子还原剂是乙醛酸或其盐，所述pH调节剂是氢氧化钾 所述化学镀铜溶液含有选自硅酸，偏硅酸盐，二氧化锗，锗酸盐，磷酸，磷酸盐，钒酸，钒酸盐，锡酸和锡酸盐中的至少一种， 为0.0001mol / L以上。