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    Apparatus and method of manufacturing laser diode unit utilizing submount bar
    41.
    发明授权
    Apparatus and method of manufacturing laser diode unit utilizing submount bar 有权
    使用底座杆制造激光二极管单元的装置和方法

    公开(公告)号：US08866041B2

    公开(公告)日：2014-10-21

    申请号：US13445054

    申请日：2012-04-12

    申请人： Koji Shimazawa ,  Osamu Shindo ,  Yoshihiro Tsuchiya ,  Yasuhiro Ito ,  Kenji Sakai

    发明人： Koji Shimazawa ,  Osamu Shindo ,  Yoshihiro Tsuchiya ,  Yasuhiro Ito ,  Kenji Sakai

    IPC分类号： B23K26/00 ,  B23K9/16 ,  B23K9/00 ,  B23K35/38 ,  B23K1/002 ,  B23K1/00 ,  B23K26/02 ,  B23K26/08 ,  H01S3/04 ,  H01S5/00

    CPC分类号： H05K3/3421 ,  B23K1/0016 ,  H01S5/02236 ,  H01S5/02272 ,  Y10T29/49144

    摘要： A manufacturing method of laser diode unit of the present invention includes steps: placing a laser diode on top of a solder member formed on a mounting surface of a submount, applying a pressing load to the laser diode and pressing the laser diode against the solder member, next, melting the solder member by heating the solder member at a temperature higher than a melting point of the solder member while the pressing load is being applied, and thereafter, bonding the laser diode to the submount by cooling and solidifying the solder member, thereafter, removing the pressing load, and softening the solidified solder member by heating the solder member at a temperature lower than the melting point of the solder member after the pressing load has been removed, and thereafter cooling and re-solidifying the solder member.

    摘要翻译： 本发明的激光二极管单元的制造方法包括以下步骤：将激光二极管放置在形成在基座的安装表面上的焊料构件的顶部上，向激光二极管施加按压负载并将激光二极管按压在焊料构件上 接下来，在施加加压负荷的同时，通过在高于焊料构件的熔点的温度下加热焊料部件来熔化焊料部件，之后，通过冷却固化焊料部件将激光二极管接合到副安装台， 然后，除去加压负荷，通过在除去加压负荷后，在低于焊料构件的熔点的温度下加热焊料，软化固化的焊料，然后冷却并重新固化焊料。

    APPARATUS AND METHOD OF MANUFACTURING LAZER DIODE UNIT UTILIZING SUBMOUNT BAR
    43.
    发明申请
    APPARATUS AND METHOD OF MANUFACTURING LAZER DIODE UNIT UTILIZING SUBMOUNT BAR 有权
    制造使用子母棒的LAZER二极管单元的装置和方法

    公开(公告)号：US20130270232A1

    公开(公告)日：2013-10-17

    申请号：US13445054

    申请日：2012-04-12

    申请人： Koji SHIMAZAWA ,  Osamu Shindo ,  Yoshihiro Tsuchiya ,  Yasuhiro Ito ,  Kenji Sakai

    发明人： Koji SHIMAZAWA ,  Osamu Shindo ,  Yoshihiro Tsuchiya ,  Yasuhiro Ito ,  Kenji Sakai

    IPC分类号： B23K26/00 ,  B23K31/02 ,  B23K37/04

    CPC分类号： H05K3/3421 ,  B23K1/0016 ,  H01S5/02236 ,  H01S5/02272 ,  Y10T29/49144

    摘要： A manufacturing method of laser diode unit of the present invention includes steps: placing a laser diode on top of a solder member formed on a mounting surface of a submount, applying a pressing load to the laser diode and pressing the laser diode against the solder member, next, melting the solder member by heating the solder member at a temperature higher than a melting point of the solder member while the pressing load is being applied, and thereafter, bonding the laser diode to the submount by cooling and solidifying the solder member, thereafter, removing the pressing load, and softening the solidified solder member by heating the solder member at a temperature lower than the melting point of the solder member after the pressing load has been removed, and thereafter cooling and re-solidifying the solder member.

    摘要翻译： 本发明的激光二极管单元的制造方法包括以下步骤：将激光二极管放置在形成在基座的安装表面上的焊料构件的顶部上，向激光二极管施加按压负载并将激光二极管按压在焊料构件上 接下来，在施加加压负荷的同时，通过在高于焊料构件的熔点的温度下加热焊料部件来熔化焊料部件，之后，通过冷却固化焊料部件将激光二极管接合到副安装台， 然后，除去加压负荷，通过在除去加压负荷后，在低于焊料构件的熔点的温度下加热焊料，软化固化的焊料，然后冷却并重新固化焊料。

    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
    44.
    发明申请
    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 有权
    印刷线路板和制造印刷线路板的方法

    公开(公告)号：US20130168134A1

    公开(公告)日：2013-07-04

    申请号：US13665473

    申请日：2012-10-31

    申请人： Ryojiro TOMINAGA ,  Kenji Sakai ,  Naoaki Fujii

    发明人： Ryojiro TOMINAGA ,  Kenji Sakai ,  Naoaki Fujii

    IPC分类号： H05K1/02 ,  H05K3/10 ,  H05K1/11

    CPC分类号： H01L23/15 ,  H01L23/49827 ,  H01L2224/16 ,  H05K3/4602 ,  H05K3/4673 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/029 ,  Y10T29/49155

    摘要： A printed wiring board includes a core substrate, a first conductive pattern formed on the substrate, an insulation structure having a first insulation layer and formed on the substrate such that the first insulation layer covers the first pattern, a second conductive pattern formed on the structure, and a second insulation layer formed on the structure such that the second insulation layer covers the second pattern. The structure has a via conductor connecting the first and second patterns through the first insulation layer, the first insulation layer includes a first layer containing a reinforcing fiber material and a second layer formed on the first layer such that the first layer is on the substrate side and a second layer is on the second insulation layer side, and the second layer is made of an insulating material which is the same material as an insulating material forming the second insulation layer.

    摘要翻译： 印刷布线板包括芯基板，形成在基板上的第一导电图案，具有第一绝缘层并形成在基板上的绝缘结构，使得第一绝缘层覆盖第一图案，形成在该结构上的第二导电图案 以及形成在所述结构上的第二绝缘层，使得所述第二绝缘层覆盖所述第二图案。 该结构具有通过第一绝缘层连接第一和第二图案的通孔导体，第一绝缘层包括含有增强纤维材料的第一层和形成在第一层上的第二层，使得第一层位于衬底侧 并且第二层位于第二绝缘层侧，第二层由与形成第二绝缘层的绝缘材料相同的材料的绝缘材料制成。

    Method for manufacturing a printed wiring board
    45.
    发明授权
    Method for manufacturing a printed wiring board 有权
    印刷电路板的制造方法

    公开(公告)号：US08418360B2

    公开(公告)日：2013-04-16

    申请号：US13273335

    申请日：2011-10-14

    申请人： Satoru Kawai ,  Kenji Sakai ,  Liyi Chen

    发明人： Satoru Kawai ,  Kenji Sakai ,  Liyi Chen

    IPC分类号： H05K3/02

    CPC分类号： H05K3/4007 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/113 ,  H05K3/205 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/09436 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T29/49213 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

    摘要： A method for manufacturing a printed wiring board including preparing a carrier, forming a metal layer on the carrier, forming an etching resist on the metal layer, forming a metal film from the metal layer underneath the resist by removing portion of the metal layer exposed through the resist and part of the metal layer contiguous to the portion of the metal layer and underneath the resist, forming a coating layer on side surface of the film and the carrier, forming a pad on the coating layer, removing the resist, forming a resin insulation layer on the film and surface of the pad, forming an opening reaching the surface of the pad in the insulation layer, forming a conductive circuit on the insulation layer, forming a via conductor connecting the circuit and the pad in the opening, removing the carrier from the film and coating layer, and removing the film.

    摘要翻译： 一种制造印刷电路板的方法，包括制备载体，在载体上形成金属层，在金属层上形成抗蚀剂，在抗蚀剂下面的金属层形成金属膜，除去暴露于金属层的部分 所述抗蚀剂和所述金属层的与所述金属层的所述部分相邻并且在所述抗蚀剂下方的部分，在所述膜和载体的侧表面上形成涂层，在所述涂层上形成焊盘，除去所述抗蚀剂，形成树脂 在所述膜的表面和所述垫的表面上形成绝缘层，形成在所述绝缘层中到达所述焊盘表面的开口，在所述绝缘层上形成导电电路，形成在所述开口中连接所述电路和所述焊盘的通孔导体， 载体从膜和涂层，并去除膜。

    SEMICONDUCTOR CIRCUIT AND SEMICONDUCTOR DEVICE
    46.
    发明申请
    SEMICONDUCTOR CIRCUIT AND SEMICONDUCTOR DEVICE 有权
    半导体电路和半导体器件

    公开(公告)号：US20120154007A1

    公开(公告)日：2012-06-21

    申请号：US13228903

    申请日：2011-09-09

    申请人： Motoki IMANISHI ,  Kenji Sakai ,  Yoshikazu Tanaka ,  Kyouko Oyama

    发明人： Motoki IMANISHI ,  Kenji Sakai ,  Yoshikazu Tanaka ,  Kyouko Oyama

    IPC分类号： H03K3/356

    CPC分类号： H03K17/162 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor circuit of the present invention comprises a capacitor for charging ON driven electric charges in response to an ON driving signal, a capacitor for charging OFF driven electric charges in response to an OFF driving signal, a signal generating circuit for generating a first trigger signal in response to the ON driving signal, a signal generating circuit for generating a second trigger signal in response to the OFF driving signal, a discharging circuit for discharging the ON driven electric charges in response to the second trigger signal, and a discharging circuit for discharging the OFF driven electric charges in response to the first trigger signal. With this configuration, it is possible to provide a semiconductor circuit and a semiconductor device both of which have a general-purpose malfunction prevention function by which a malfunction due to dV/dt can be prevented without being affected by any external factor.

    摘要翻译： 本发明的半导体电路包括：用于响应于ON驱动信号对接通驱动电荷进行充电的电容器;响应于OFF驱动信号而对驱动电荷进行充电的电容器;产生第一触发信号的信号产生电路 响应于ON驱动信号，产生响应于OFF驱动信号产生第二触发信号的信号发生电路，用于响应于第二触发信号对ON驱动电荷进行放电的放电电路，以及用于放电的放电电路 OFF驱动电荷响应于第一触发信号。 利用这种结构，可以提供一种具有通用故障防止功能的半导体电路和半导体器件，通过该功能可以防止由于dV / dt引起的故障，而不受任何外部因素的影响。

    POWER SEMICONDUCTOR DEVICE
    49.
    发明申请
    POWER SEMICONDUCTOR DEVICE 有权
    功率半导体器件

    公开(公告)号：US20110260707A1

    公开(公告)日：2011-10-27

    申请号：US13010178

    申请日：2011-01-20

    申请人： Motoki IMANISHI ,  Kenji Sakai ,  Yoshikazu Tanaka

    发明人： Motoki IMANISHI ,  Kenji Sakai ,  Yoshikazu Tanaka

    IPC分类号： G05F3/02

    CPC分类号： H02M1/08 ,  H03K17/063

    摘要： A power semiconductor device comprises: high side and low side switching elements; high side and low side drive circuits; a bootstrap capacitor supplying a drive voltage to the high side drive circuit and having a first terminal connected to a connection point between the high side switching element and the low side switching element and a second terminal connected to a power supply terminal of the high side drive circuit; a bootstrap diode having an anode connected to a power supply and a cathode connected to the second terminal and supplying a current from the power supply to the second terminal; a floating power supply; and a bootstrap compensation circuit supplying a current from the floating power supply to the second terminal, when the high side drive circuit turns ON the high side switching element and the low side drive circuit turns OFF the low side switching element.

    摘要翻译： 功率半导体器件包括：高侧和低侧开关元件; 高侧和低侧驱动电路; 向高侧驱动电路供给驱动电压并具有与高侧开关元件和低侧开关元件之间的连接点连接的第一端子的自举电容器和连接到高侧驱动器的电源端子的第二端子 电路 引导二极管，其具有连接到电源的阳极和连接到第二端子的阴极，并且将电流从电源提供给第二端子; 浮动电源; 以及当所述高侧驱动电路导通所述高侧开关元件并且所述低侧驱动电路使所述低侧开关元件断开时，从所述浮动电源向所述第二端子供给电流的自举补偿电路。

    REACTOR
    50.
    发明申请
    REACTOR 有权
    反应堆

    公开(公告)号：US20110250102A1

    公开(公告)日：2011-10-13

    申请号：US13074912

    申请日：2011-03-29

    申请人： Kenji Sakai

    发明人： Kenji Sakai

    IPC分类号： B01J8/06

    CPC分类号： B01J8/0214 ,  B01J8/003 ,  B01J8/0292 ,  B01J2208/00132 ,  B01J2208/00752 ,  B01J2208/00761 ,  B01J2208/0084

    摘要： There is provided a radial flow reactor having a multi-pass structure in which loading and unloading of granular packing are easy and which does not impair the reaction performance. The reactor includes, in an upright tubular reactor vessel: a packing region for housing a continuous packed bed of granular packing; and an outer and an inner passages disposed outside and inside the packing region, respectively, allowing a fluid to flow in the axial direction. The reactor is configured so that the fluid can pass between the packing region and the outer passage and between the packing region and the inner passage. The reactor further includes at least one of an outer partition structure and an inner partition structure. The outer partition structure includes: an outer partition plate partitioning the packing region in the axial direction with a gap allowing the granular packing to pass therethrough between the inner border of the packing region and the outer partition plate; and a blocking section for preventing the fluid from flowing through the outer passage in the axial direction. The inner partition structure includes: an inner partition plate partitioning the packing region in the axial direction with a gap allowing the granular packing to pass therethrough between the outer border of the packing region and the inner partition plate; and a blocking section for preventing the fluid from flowing through the inner passage in the axial direction.

    摘要翻译： 提供了一种具有多通道结构的径向流动反应器，其中颗粒填料的装载和卸载容易并且不损害反应性能。 反应器包括在直立的管式反应器容器中：用于容纳颗粒状填料的连续填充床的填充区域; 以及分别设置在填充区域的外部和内部的外部和内部通道，允许流体沿轴向流动。 反应器构造成使得流体可以在填充区域和外部通道之间以及填充区域和内部通道之间通过。 反应器还包括外分隔结构和内分隔结构中的至少一个。 外分隔结构包括：外隔板，其在轴向方向上分隔填料区域，间隙允许颗粒填料在填料区域的内边界与外隔板之间通过; 以及用于防止流体在轴向上流过外部通道的阻挡部。 内分隔结构包括：内隔板，其在轴向方向上分隔填料区域，间隙允许颗粒填料在填料区域的外边界与内隔板之间通过; 以及用于防止流体在轴向上流过内部通道的阻挡部。