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74 条记录 (耗时 0.042 秒)

    Light emitting diode package with optical element
    42.
    发明申请
    Light emitting diode package with optical element 有权
    具有光学元件的发光二极管封装

    公开(公告)号：US20080023711A1

    公开(公告)日：2008-01-31

    申请号：US11496922

    申请日：2006-07-31

    申请人： Eric Tarsa ,  Michael Leung ,  Maryanne Becerra ,  Bernd Keller ,  James Ibbetson

    发明人： Eric Tarsa ,  Michael Leung ,  Maryanne Becerra ,  Bernd Keller ,  James Ibbetson

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2933/005 ,  H01L2924/00014

    摘要： A light emitting diode (LED) package comprising a substrate with an LED chip mounted to the substrate and in electrical contact with it. An inner material covers the LED chip, and a lens covers the inner material with the lens material being harder than the inner material. An adhesive is arranged between the substrate and the lens to hold the lens to the substrate and to compensate for different coefficients of thermal expansion (CTE) between the lens and the remainder of the package. A method for forming an LED package comprises providing a substrate with a first meniscus ring on a surface of the substrate. An LED chip is mounted to the substrate, within the meniscus ring. An inner material is deposited over the LED chip, and a lens material in liquid form is deposited over the inner material. The lens material held in a hemispheric shape by the first meniscus feature and the lens material is cured making it harder than the inner material.

    摘要翻译： 一种发光二极管（LED）封装，其包括具有安装到所述衬底并与其电接触的LED芯片的衬底。 内部材料覆盖LED芯片，透镜覆盖内部材料，透镜材料比内部材料硬。 在基板和透镜之间布置粘合剂以将透镜保持在基板上并且补偿透镜与封装的其余部分之间的不同的热膨胀系数（CTE）。 一种用于形成LED封装的方法，包括在基板的表面上提供具有第一弯液面环的基板。 LED芯片安装在弯液面环内的基板上。 内部材料沉积在LED芯片上，液体形式的透镜材料沉积在内部材料上。 通过第一弯液面特征和透镜材料保持半球形状的透镜材料固化使其比内部材料更硬。

    Light emitting diode package with optical element
    43.
    发明授权
    Light emitting diode package with optical element 有权
    具有光学元件的发光二极管封装

    公开(公告)号：US08735920B2

    公开(公告)日：2014-05-27

    申请号：US11496922

    申请日：2006-07-31

    申请人： James Ibbetson ,  Eric Tarsa ,  Michael Leung ,  Maryanne Becerra ,  Bernd Keller

    发明人： James Ibbetson ,  Eric Tarsa ,  Michael Leung ,  Maryanne Becerra ,  Bernd Keller

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2933/005 ,  H01L2924/00014

    摘要： A light emitting diode (LED) package comprising a substrate with an LED chip mounted to the substrate and in electrical contact with it. An inner material covers the LED chip, and a lens covers the inner material with the lens material being harder than the inner material. An adhesive is arranged between the substrate and the lens to hold the lens to the substrate and to compensate for different coefficients of thermal expansion (CTE) between the lens and the remainder of the package. A method for forming an LED package comprises providing a substrate with a first meniscus ring on a surface of the substrate. An LED chip is mounted to the substrate, within the meniscus ring. An inner material is deposited over the LED chip, and a lens material in liquid form is deposited over the inner material. The lens material held in a hemispheric shape by the first meniscus feature and the lens material is cured making it harder than the inner material.

    摘要翻译： 一种发光二极管（LED）封装，其包括具有安装到所述衬底并与其电接触的LED芯片的衬底。 内部材料覆盖LED芯片，透镜覆盖内部材料，透镜材料比内部材料硬。 在基板和透镜之间布置粘合剂以将透镜保持在基板上并补偿透镜与封装的其余部分之间的不同热膨胀系数（CTE）。 一种用于形成LED封装的方法，包括在基板的表面上提供具有第一弯液面环的基板。 LED芯片安装在弯液面环内的基板上。 内部材料沉积在LED芯片上，液体形式的透镜材料沉积在内部材料上。 通过第一弯液面特征和透镜材料保持半球形状的透镜材料固化使其比内部材料更硬。

    Multiple component solid state white light
    47.
    发明申请
    Multiple component solid state white light 有权

    公开(公告)号：US20060138435A1

    公开(公告)日：2006-06-29

    申请号：US11347645

    申请日：2006-02-02

    申请人： Eric Tarsa ,  Michael Dunn ,  Bernd Keller

    发明人： Eric Tarsa ,  Michael Dunn ,  Bernd Keller

    IPC分类号： H01L33/00

    CPC分类号： H01L25/0753 ,  H01L33/50 ,  H01L2924/0002 ,  H01L2933/0091 ,  Y10S362/80 ,  H01L2924/00

    摘要： A white light emitting lamp is disclosed comprising a solid state ultra violet (UV) emitter that emits light in the UV wavelength spectrum. A conversion material is arranged to absorb at least some of the light emitting from the UV emitter and re-emit light at one or more different wavelengths of light. One or more complimentary solid state emitters are included that emit at different wavelengths of light than the UV emitter and the conversion material. The lamp emits a white light combination of light emitted from the complimentary emitters and from the conversion material, with the white light having high efficacy and good color rendering. Other embodiments of white light emitting lamp according to the present invention comprises a solid state laser instead of a UV emitter. A high flux white emitting lamp embodiment according to the invention comprises a large area light emitting diode (LED) that emits light at a first wavelength spectrum and includes a conversion material. A plurality of complimentary solid state emitters surround the large area LED, with each emitter emitting light in a spectrum different from the large area LED and conversion material such that the lamp emits a balanced white light. Scattering particles can be included in each of the embodiments to scatter the light from the emitters, conversion material and complimentary emitters to provide a more uniform emission.

    LIGHT EMITTING DIODE PRIMARY OPTIC FOR BEAM SHAPING
    50.
    发明申请
    LIGHT EMITTING DIODE PRIMARY OPTIC FOR BEAM SHAPING 有权
    光发射二极管主光学用于光束形状

    公开(公告)号：US20140009932A1

    公开(公告)日：2014-01-09

    申请号：US13544662

    申请日：2012-07-09

    申请人： Eric Tarsa ,  Monica Hansen ,  Bernd Keller

    发明人： Eric Tarsa ,  Monica Hansen ,  Bernd Keller

    IPC分类号： F21V7/04 ,  F21V7/00

    CPC分类号： H01L33/54 ,  F21K9/233 ,  F21S8/026 ,  F21V7/0008 ,  F21V7/005 ,  F21V13/04 ,  F21V29/74 ,  F21Y2115/10

    摘要： LED components are described having primary optics provide improved LED component emission characteristics. Light fixtures are also described that utilize the LED components to provide improved light fixture emissions. One LED component according to the present invention comprises an LED chip emitting an LED chip emission pattern. A primary optic is included directly on the LED chip with LED light from the LED chip passing through the primary optic. The primary optic shapes the LED emission pattern into an LED component emission pattern with the LED component emission pattern being broader than the LED chip emission pattern.

    摘要翻译： 描述了具有主要光学器件的LED组件，提供了改进的LED组件发射特性。 还描述了利用LED组件来提供改进的灯具排放物的灯具。 根据本发明的一个LED组件包括发射LED芯片发射图案的LED芯片。 主要光学元件直接包含在LED芯片上，LED芯片的LED光通过主光学元件。 主要光学器件将LED发射图案形成LED组件发射图案，其中LED组件发射图案比LED芯片发射图案更宽。