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    Method for assembling semiconductor die packages with standard ball grid array footprint
    44.
    发明授权
    Method for assembling semiconductor die packages with standard ball grid array footprint 有权
    用于组装具有标准球栅阵列足迹的半导体管芯封装的方法

    公开(公告)号：US07279366B2

    公开(公告)日：2007-10-09

    申请号：US11168776

    申请日：2005-06-28

    申请人： Todd O. Bolken

    发明人： Todd O. Bolken

    IPC分类号： H01L21/00 ,  H01L23/48 ,  H05K13/00

    CPC分类号： H01L24/32 ,  H01L21/563 ,  H01L23/13 ,  H01L23/24 ,  H01L24/28 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/73203 ,  H01L2224/83051 ,  H01L2224/83102 ,  H01L2224/83385 ,  H01L2224/92125 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/14 ,  Y10T29/49172

    摘要： Apparatus and methods for forming semiconductor assemblies. An interposer includes a perimeter wall surrounding at least a portion of an upper surface thereof to form a recess. An array of electrical connection pads is located within the recess. A semiconductor die can be flip chip attached to the interposer by at least partial insertion of the semiconductor die within the recess with discrete conductive elements between bond pads of the semiconductor die and electrical connection pads of the interposer. The electrical connection pads communicate with a number of other electrical contact pads accessible elsewhere on the interposer, preferably on a lower surface thereof. A low viscosity underfill encapsulant is disposed between the semiconductor die and the interposer and around the discrete conductive elements by permitting the same to flow into the space between the die and the perimeter wall. The encapsulant may form an underfill or substantially encapsulate the semiconductor die within the recess of the interposer.

    摘要翻译： 用于形成半导体组件的装置和方法。 插入器包括围绕其上表面的至少一部分的周边壁以形成凹部。 电连接垫阵列位于凹槽内。 半导体管芯可以通过在半导体管芯的接合焊盘和插入器的电连接焊盘之间的离散导电元件至少部分地插入凹槽内而将倒装芯片附接到插入器。 电连接焊盘与可插入到其他地方的多个其它电接触焊盘通信，优选地在其下表面上。 低粘度底部填充密封剂通过允许其相同的流入模具和周边壁之间的空间而设置在半导体管芯和插入件之间以及离散的导电元件周围。 密封剂可以形成底部填充物或基本上将半导体管芯封装在插入件的凹部内。

    Method and apparatus for packaging a microelectronic die
    47.
    发明授权
    Method and apparatus for packaging a microelectronic die 有权

    公开(公告)号：US06653173B2

    公开(公告)日：2003-11-25

    申请号：US09955620

    申请日：2001-09-19

    申请人： Todd O. Bolken

    发明人： Todd O. Bolken

    IPC分类号： H01L2144

    CPC分类号： H01L21/565 ,  H01L23/4951 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/4824 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

    摘要： The present invention is directed toward methods and apparatuses for encapsulating a microelectronic die or another type of microelectronic device. One aspect of the present invention is directed toward packaging a microelectronic die that is attached to either a first surface or a second surface of a substrate. The die can be encapsulated by positioning the die in a cavity of a substrate and sealing the substrate to the substrate. The method can further include injecting an encapsulation compound into the cavity at a first end of the substrate to move along the first surface of the substrate. This portion of the compound defines a first flow of compound along the first surface that moves in a first direction from a first end of the substrate toward a second end of the substrate. Several embodiments of the method also include driving a portion of the compound through the substrate at a pass-through location or a secondary gate that is spaced apart from the first end of the substrate to generate a second flow of compound along the second surface of the substrate. The second flow of compound moves in a second direction toward the first end of the substrate. As the first and second flows of compound move through the mold, the method includes inhibiting a third flow of compound from moving in the first direction along the second surface of the substrate between the first end of the substrate and the pass-through location.