公开(公告)号：US20180318868A1

公开(公告)日：2018-11-08

申请号：US15964548

申请日：2018-04-27

Applicant: CANON KABUSHIKI KAISHA

Inventor： Ken Katsuta

IPC: B05C11/10 ,  B41J2/015 ,  B05D1/26 ,  B81C1/00

CPC classification number: B05C11/10 ,  B05D1/26 ,  B41J2/015 ,  B41J2/04508 ,  B41J2/0456 ,  B41J2/04581 ,  B81C1/00436 ,  B81C2201/0153

Abstract: An imprint apparatus, comprises: a discharge unit that discharges a liquid onto a substrate; a storage unit that stores a plurality of discharge conditions for the discharge unit; and a control unit that controls the discharge unit based on a discharge condition that is stored in the storage unit, wherein the control unit selects the discharge condition from the plurality of discharge conditions in accordance with a discharge spacing for discharging the liquid.

公开(公告)号：US20180311877A1

公开(公告)日：2018-11-01

申请号：US15772042

申请日：2016-10-27

Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH ,  BANSHING INDUSTRIAL PTE LTD

Inventor： Mohamed Sultan Mohiddin SAIFULLAH ,  Siew Ling Karen CHONG ,  Yee Chong LOKE ,  Alvin CHENG ,  Nicholas LEONG

IPC: B29C45/37 ,  B81C99/00 ,  C23C14/14 ,  C23C14/34 ,  C25D1/10 ,  G03F7/00

CPC classification number: B29C45/37 ,  B81C99/009 ,  B81C2201/0153 ,  B82Y40/00 ,  C23C14/14 ,  C23C14/34 ,  C25D1/10 ,  G03F7/0002

Abstract: An injection mold insert with hierarchical structures and a method for method of making such injection mold inserts are provided. The method includes imprinting a primary imprint structure on an article and imprinting a secondary imprint structure on the primary imprint structure on the article. The secondary imprint structure includes a plurality of shapes, each of the plurality of shapes being substantially smaller than shapes of the primary imprint structure. The method further includes bonding the article to a substrate, sputter-coating the article with a metal film as an electroforming seed layer, and electroforming the injection mold insert over the article. Finally, the method includes dissolving the article to define the injection mold insert having a negative replica of the primary and secondary imprint structures.

公开(公告)号：US20170363954A1

公开(公告)日：2017-12-21

申请号：US15538526

申请日：2015-12-22

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

Inventor： Stephan LANDIS ,  Nicolas POSSEME ,  Lamia NOURI

IPC: G03F7/00 ,  B82Y40/00 ,  B82Y10/00

CPC classification number: H01L21/266 ,  B81C1/00103 ,  B81C1/0046 ,  B81C1/00587 ,  B81C2201/0136 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  C23C14/042 ,  C23C14/48 ,  G03F7/0002 ,  H01L21/30604 ,  H01L21/30608 ,  H01L21/3065 ,  H01L21/3086 ,  H01L21/31111 ,  H01L21/31144 ,  H01L31/02363 ,  H01L31/0392 ,  H01L31/1852 ,  H01L33/007 ,  H01L33/20 ,  H01L33/22 ,  Y02E10/50

Abstract: The invention relates in particular to a method for producing subsequent patterns in an underlying layer (120), the method comprising at least one step of producing prior patterns in a carbon imprintable layer (110) on top of the underlying layer (120), the production of the prior patterns involving nanoimprinting of the imprintable layer (110) and leave in place a continuous layer formed by the imprintable layer (110) and covering the underlying layer (120), characterized in that it comprises the following step: at least one step of modifying the underlying layer (120) via ion implantation (421) in the underlying layer (120), the implantation (421) being carried out through the imprintable layer (110) comprising the subsequent patterns, the parameters of the implantation (421) being chosen in such a way as to form, in the underlying layer (120), implanted zones (122) and non-implanted zones, the non-implanted zones defining the subsequent patterns and having a geometry that is dependent on the prior patterns.

公开(公告)号：US09777079B2

公开(公告)日：2017-10-03

申请号：US15035897

申请日：2014-12-17

Applicant: DIC Corporation

Inventor： Takeshi Ibe ,  Makoto Yada

IPC: B29C59/02 ,  C08F12/36 ,  H01L21/311 ,  C08F12/34 ,  C08F257/00 ,  C08K5/00 ,  C08L101/02 ,  C08F12/32 ,  C09D125/16 ,  G03F7/00

CPC classification number: C08F12/36 ,  B29C59/026 ,  B81C2201/0153 ,  C08F12/32 ,  C08F12/34 ,  C08F257/00 ,  C08K5/00 ,  C08L101/02 ,  C09D125/16 ,  G03F7/0002 ,  H01L21/31144

Abstract: Provided is a curable resin composition for a dry-etching resist, the curable resin composition containing a polymer (A) having, in a side chain, a particular structure including an aromatic group having a vinyl group. The polymer (A) includes 80 to 100 wt % of the particular structure. In addition, provided are a dry-etching resist mask obtained by curing the curable composition for a dry-etching resist, and the dry-etching resist mask having a pattern formed by a nanoimprint method.

公开(公告)号：US09718674B2

公开(公告)日：2017-08-01

申请号：US14914015

申请日：2014-08-26

Applicant: SILEX MICROSYSTEMS AB

Inventor： Edvard Kalvesten ,  Thorbjorn Ebefors ,  Niklas Svedin

IPC: H01L23/08 ,  B81B7/00 ,  H01L21/50 ,  B81C1/00 ,  H01L23/00

CPC classification number: B81B7/007 ,  B81B2201/01 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2207/095 ,  B81C1/00301 ,  B81C2201/0153 ,  B81C2201/036 ,  B81C2203/0109 ,  B81C2203/0145 ,  H01L21/50 ,  H01L23/08 ,  H01L24/94 ,  H01L2924/16235

Abstract: A device includes a base substrate (700) with a micro component (702) attached thereto. Suitably it is provided with routing elements (704) for conducting signals to and from the component (702). It also includes spacer members (706) which also can act as conducting structures for routing signals vertically. There is a capping structure (708) of a glass material, provided above the base substrate (700), bonded via the spacer members (706), preferably by eutectic bonding, wherein the capping structure (708) includes vias (710) including metal for providing electrical connection through the capping structure. The vias can be made by a stamping/pressing method entailing pressing needles under heating to soften the glass and applying pressure, to a predetermined depth in the glass. However, other methods are possible, e-g- drilling, etching, blasting.

公开(公告)号：US20140034229A1

公开(公告)日：2014-02-06

申请号：US14048745

申请日：2013-10-08

Applicant: Molecular Imprints, Inc.

Inventor： Frank Y. Xu

IPC: B32B37/14

CPC classification number: B32B37/14 ,  B32B38/06 ,  B81C1/0046 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  C08L59/00 ,  C09J5/00 ,  C09J2205/31 ,  C09J2451/00 ,  G03F7/0002 ,  Y10T156/10

Abstract: The present invention provides a method for adhering a layer to a substrate that features defining first and second interfaces by having a composition present between the layer and the substrate that forms covalent bonds to the layer and adheres to the substrate employing one or more of covalent bonds, ionic bonds and Van der Waals forces. In this manner, the strength of the adhering force of the layer to the composition is assured to be stronger than the adhering force of the layer to the composition formed from a predetermined adhering mechanism, i.e., an adhering mechanism that does not include covalent bonding.

Abstract translation: 本发明提供了一种通过使层与衬底之间存在的组合物与层形成共价键并且使用一种或多种共价键粘合到衬底上而将层粘合到基底上的特征，其特征在于限定第一和第二界面 ，离子键和范德华力。 以这种方式，确保层对组合物的粘附力的强度比由预定粘合机构即不包括共价键的粘合机构形成的组合物的层的粘合力更强。

公开(公告)号：US08557351B2

公开(公告)日：2013-10-15

申请号：US11187407

申请日：2005-07-22

Applicant: Frank Y. Xu

Inventor： Frank Y. Xu

IPC: B05D3/00 ,  C08J7/18 ,  G21H5/00

CPC classification number: B32B37/14 ,  B32B38/06 ,  B81C1/0046 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  C08L59/00 ,  C09J5/00 ,  C09J2205/31 ,  C09J2451/00 ,  G03F7/0002 ,  Y10T156/10

Abstract: The present invention provides a method adhering a layer to a substrate that features defining first and second interfaces by having a composition present between the layer and the substrate that forms covalent bonds to the layer and adheres to the substrate employing one or more of covalent bonds, ionic bonds and Van der Waals forces. In this manner, the strength of the adhering force of the layer to the composition is assured to be stronger than the adhering force of the layer to the composition formed from a predetermined adhering mechanism, i.e., an adhering mechanism that does not include covalent bonding.

Abstract translation: 本发明提供了一种通过使层与衬底之间存在的组合物与层形成共价键并且使用一种或多种共价键粘合到衬底上而将层粘附到基底上的方法，其特征在于限定第一和第二界面， 离子键和范德华力。 以这种方式，确保层对组合物的粘附力的强度比由预定粘合机构即不包括共价键的粘合机构形成的组合物的层的粘合力更强。

公开(公告)号：US08543352B2

公开(公告)日：2013-09-24

申请号：US12600527

申请日：2008-04-02

Applicant: Yuki Aritsuka ,  Morihisa Hoga

Inventor： Yuki Aritsuka ,  Morihisa Hoga

IPC: G01B3/46 ,  G01B3/04 ,  G01B3/20 ,  H04B17/00

CPC classification number: G01B21/20 ,  B81C99/0065 ,  B81C2201/0153 ,  B81C2201/0198 ,  G03F1/84

Abstract: A system for measuring a shape, includes an external storage unit storing tolerances of first and second shape factors defining a design shape of a measuring object; a first measuring tool measuring the first shape factor of the measuring object to obtain measurement data; and a measurement processing unit determining a shape of the measuring object. The measurement processing unit includes; a comparison module comparing the measurement data of the first shape factor with the tolerance of the first shape factor; a verification module composing a predicted shape using the measurement data and verifying whether the predicted shape is formed as a figure; a calculation module calculating predicted data of the second shape factor from the predicted shape; and a determination module determining a measurement shape by comparing the predicted data with the tolerance of the second shape factor.

Abstract translation: 一种用于测量形状的系统，包括存储限定测量对象的设计形状的第一和第二形状因子的公差的外部存储单元; 第一测量工具，测量测量对象的第一形状因子以获得测量数据; 以及测量处理单元，确定测量对象的形状。 测量处理单元包括： 将所述第一形状因子的测量数据与所述第一形状系数的公差进行比较的比较模块; 使用所述测量数据构成预测形状的验证模块，并验证所述预测形状是否形成为图形; 计算模块，根据所述预测形状计算所述第二形状因子的预测数据; 以及确定模块，通过将预测数据与第二形状因子的公差进行比较来确定测量形状。

公开(公告)号：US20130075361A1

公开(公告)日：2013-03-28

申请号：US13528348

申请日：2012-06-20

Applicant: Yoshiaki KAWAMONZEN ,  Yasuaki OOTERA ,  Akiko YUZAWA ,  Naoko KIHARA ,  Yoshiyuki KAMATA ,  Hiroyuki HIEDA ,  Norikatsu SASAO ,  Ryosuke YAMAMOTO ,  Takeshi OKINO ,  Tomoyuki MAEDA ,  Takuya SHIMADA

Inventor： Yoshiaki KAWAMONZEN ,  Yasuaki OOTERA ,  Akiko YUZAWA ,  Naoko KIHARA ,  Yoshiyuki KAMATA ,  Hiroyuki HIEDA ,  Norikatsu SASAO ,  Ryosuke YAMAMOTO ,  Takeshi OKINO ,  Tomoyuki MAEDA ,  Takuya SHIMADA

IPC: B44C1/22

CPC classification number: B44C1/227 ,  B41M5/00 ,  B81C1/0046 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L21/0337 ,  Y10T156/1041

Abstract: A pattern forming method according to an embodiment includes: forming a pattern film on a first substrate, the pattern film having a concave-convex pattern, the pattern film being made of a material containing a first to-be-imprinted agent; forming a material film on a second substrate, the material film containing a second to-be-imprinted agent having a higher etching rate than an etching rate of the first to-be-imprinted agent; transferring the concave-convex pattern of the pattern film onto the material film by applying pressure between the first substrate and the second substrate, with the pattern film being positioned to face the material film, and by curing the second to-be-imprinted agent; detaching the first substrate from the pattern film; and removing the material film by etching, to leave the pattern film on the second substrate.

Abstract translation: 根据实施例的图案形成方法包括：在第一基板上形成图案膜，所述图案膜具有凹凸图案，所述图案膜由包含第一待打印剂的材料制成; 在第二基板上形成材料膜，所述材料膜含有蚀刻速率高于第一待打印剂的蚀刻速率的第二待定印剂; 通过在第一基板和第二基板之间施加压力将图案膜的凹凸图案转印到材料膜上，图案膜定位成面对材料膜，并且通过固化第二待打印剂; 从图案膜分离第一衬底; 并通过蚀刻去除材料膜，以将图案膜留在第二基板上。

公开(公告)号：US08293641B2

公开(公告)日：2012-10-23

申请号：US13014771

申请日：2011-01-27

Applicant: Robert Seidel ,  Carsten Peters ,  Frank Feustel

Inventor： Robert Seidel ,  Carsten Peters ,  Frank Feustel

IPC: H01L21/4763

CPC classification number: B81B7/0006 ,  B81C2201/0153 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L21/28114 ,  H01L21/76224 ,  H01L21/76229 ,  H01L21/76804 ,  H01L21/76807 ,  H01L21/76817 ,  H01L21/76838 ,  H01L21/76852 ,  H01L21/76885 ,  H01L2221/1021

Abstract: By forming metallization structures on the basis of an imprint technique, in which via openings and trenches may be commonly formed, a significant reduction of process complexity may be achieved due to the omission of at least one further alignment process as required in conventional process techniques. Furthermore, the flexibility and efficiency of imprint lithography may be increased by providing appropriately designed imprint molds in order to provide via openings and trenches exhibiting an increased fill capability, thereby also improving the performance of the finally obtained metallization structures with respect to reliability, resistance against electromigration and the like.

Abstract translation: 通过基于压印技术形成金属化结构，其中可以通常形成通孔和沟槽，由于根据常规工艺技术所要求的至少一个进一步对准过程，可以实现工艺复杂性的显着降低。 此外，可以通过提供适当设计的压印模具来提高压印光刻的灵活性和效率，以便提供表现出增加的填充能力的通孔开口和沟槽，从而也提高了最终获得的金属化结构在可靠性，抗性 电迁移等。