公开(公告)号：US20130240862A1

公开(公告)日：2013-09-19

申请号：US13886098

申请日：2013-05-02

Applicant: LG CHEM, LTD.

Inventor： Hyun Jee Yoo ,  Yoon Gyung Cho ,  Jung Sup Shim ,  Suk Chin Lee ,  Kwang Jin Jeong ,  Suk Ky Chang

IPC: H01L51/52 ,  H01L51/56

CPC classification number: H01L51/0094 ,  C08K3/16 ,  C08K3/22 ,  C08K3/346 ,  C08K3/36 ,  C08K2003/162 ,  C08K2003/166 ,  C08K2003/2206 ,  C09J7/00 ,  C09J7/10 ,  C09J7/35 ,  C09J9/00 ,  C09J11/04 ,  C09J163/00 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  H01L21/56 ,  H01L23/28 ,  H01L23/295 ,  H01L23/564 ,  H01L51/0034 ,  H01L51/0035 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5256 ,  H01L51/5259 ,  H01L51/56 ,  H01L2251/301 ,  H01L2251/303 ,  H01L2924/0002 ,  H05B33/04 ,  H01L2924/00

Abstract: An adhesive film, and a product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable hot-melt adhesive layer including a curable resin and a moisture absorbent, and the curable hot-melt adhesive layer includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive layer.

Abstract translation: 提供了一种粘合膜，以及使用其的封装有机电子器件（OED）的产品和方法。 粘合膜用于包封OED并且包括可固化的热熔粘合剂层，其包括可固化树脂和吸湿剂，并且可固化热熔粘合剂层包括在封装OED时与OED接触的第一区域，以及 第二个区域不与OED接触。 此外，基于粘合剂层中的吸湿剂的总重量，吸湿剂在第一和第二区域中的含量分别为0至20％和80至100％。

公开(公告)号：US08524032B2

公开(公告)日：2013-09-03

申请号：US13613560

申请日：2012-09-13

Applicant: Yasushi Akutsu ,  Tomoyuki Ishimatsu ,  Koichi Miyauchi

Inventor： Yasushi Akutsu ,  Tomoyuki Ishimatsu ,  Koichi Miyauchi

IPC: H05K3/36 ,  H05K3/02 ,  H05K3/10 ,  B21F15/02 ,  H01R3/00 ,  H01R4/00 ,  H01R43/00 ,  H02G1/14 ,  B32B7/12

CPC classification number: C09J7/00 ,  C08K3/017 ,  C08K3/08 ,  C08K9/02 ,  C09J7/10 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15788 ,  H01R4/04 ,  H05K1/0346 ,  H05K3/323 ,  H05K2201/0154 ,  H05K2201/10674 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T428/25 ,  Y10T428/31511 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/0401

Abstract: A method for producing a joined structure involving pressure-bonding a first circuit member and a second circuit member together via a connecting film while the circuit members are being heated, to thereby join the circuit members with each other, wherein the connecting film is defined and includes first and second layers wherein one of the first layer and the second layer is a conductive particle-containing organic resin layer, and the other layer is an insulating organic resin layer containing no conductive particles, and wherein the minimum melt viscosity of the conductive particle-containing organic resin layer is ten times or more greater than the minimum melt viscosity of the insulating organic resin layer.

Abstract translation: 一种接合结构体的制造方法，其特征在于，在将所述电路部件加热的同时，经由连接膜将第一电路部件和第二电路部件压接在一起，从而将所述电路部件彼此接合， 包括第一层和第二层，其中第一层和第二层之一是含导电颗粒的有机树脂层，另一层是不含导电颗粒的绝缘有机树脂层，并且其中导电颗粒的最小熔体粘度 的绝缘性有机树脂层的绝缘性有机树脂层的最低熔融粘度的10倍以上。

公开(公告)号：US20130196129A1

公开(公告)日：2013-08-01

申请号：US13803266

申请日：2013-03-14

Applicant: Woo Suk LEE ,  Bong Yong KIM ,  Dong Seon UH ,  Jin Seong PARK ,  Kyoung Soo PARK ,  Woo Jun LIM ,  Kyung Jin LEE

Inventor： Woo Suk LEE ,  Bong Yong KIM ,  Dong Seon UH ,  Jin Seong PARK ,  Kyoung Soo PARK ,  Woo Jun LIM ,  Kyung Jin LEE

IPC: H01R4/04

CPC classification number: H01R4/04 ,  B32B7/12 ,  C09J7/22 ,  C09J7/38 ,  C09J9/02 ,  C09J2201/36 ,  C09J2201/622 ,  Y10T428/24942

Abstract: An anisotropic conductive film includes a first insulating adhesive layer, a conductive adhesive layer, and a second insulating adhesive layer which are sequentially stacked on a base film, wherein an adhesive strength ratio of the second insulating adhesive layer to the first insulating adhesive layer is about 1.1 to about 20.

Abstract translation: 各向异性导电膜包括依次堆叠在基膜上的第一绝缘粘合剂层，导电粘合剂层和第二绝缘粘合剂层，其中第二绝缘粘合剂层与第一绝缘粘合剂层的粘合强度比为约 1.1〜约20。

公开(公告)号：US20130164478A1

公开(公告)日：2013-06-27

申请号：US13813925

申请日：2011-08-03

Applicant: Masayuki Yamamoto ,  Yohei Nakamura ,  Kuniaki Muto ,  Yasufumi Sumitomo

Inventor： Masayuki Yamamoto ,  Yohei Nakamura ,  Kuniaki Muto ,  Yasufumi Sumitomo

IPC: C09J7/00 ,  B32B27/00 ,  B32B7/12

CPC classification number: C09J7/00 ,  B32B7/12 ,  B32B23/20 ,  B32B27/00 ,  B32B27/08 ,  B32B27/308 ,  B32B27/325 ,  B32B27/365 ,  B32B2307/412 ,  B32B2457/208 ,  B32B2551/00 ,  C09J7/10 ,  C09J133/08 ,  C09J133/10 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2433/00 ,  Y10T428/1476 ,  Y10T428/24612 ,  Y10T428/24959 ,  Y10T428/264 ,  Y10T428/2891

Abstract: A double-faced pressure-sensitive adhesive sheet, including a first pressure-sensitive adhesive layer, and a second pressure-sensitive adhesive layer provided on one side of the aforementioned first pressure-sensitive adhesive layer, wherein a primary component of the first pressure-sensitive adhesive layer is a two-part acrylic pressure-sensitive adhesive (I), and a weight average molecular weight of the pertinent two-part acrylic pressure-sensitive adhesive (I) is 150,000-800,000, and wherein a primary component of the second pressure-sensitive adhesive layer is a two-part acrylic pressure-sensitive adhesive (II), and a weight average molecular weight of the pertinent two-part acrylic pressure-sensitive adhesive (II) is 900,000-2,000,000.

Abstract translation: 一种双面粘合片，包括第一粘合剂层和设置在上述第一粘合剂层一侧的第二压敏粘合剂层，其中，第一压敏粘合剂层的主要组分， 粘合剂层是双组分丙烯酸类压敏粘合剂（I），相关的两部分丙烯酸类压敏粘合剂（I）的重均分子量为150,000-800,000，其中第二 压敏粘合剂层是两部分丙烯酸类压敏粘合剂（II），相关的两部分丙烯酸类压敏粘合剂（II）的重均分子量为90万〜200万。

公开(公告)号：US20130149502A1

公开(公告)日：2013-06-13

申请号：US13817739

申请日：2011-08-23

Applicant: William R. Dudley ,  Audrey A. Sherman ,  Scott M. Tapio

Inventor： William R. Dudley ,  Audrey A. Sherman ,  Scott M. Tapio

IPC: C09J167/03 ,  C09J167/00 ,  C09J133/00

CPC classification number: C09J167/03 ,  B32B7/06 ,  B32B7/12 ,  B32B27/36 ,  B32B2405/00 ,  C08G2170/40 ,  C09J4/00 ,  C09J7/22 ,  C09J7/38 ,  C09J133/00 ,  C09J167/00 ,  C09J2201/36 ,  C09J2433/00 ,  C09J2475/00 ,  C09J2483/00 ,  Y10T428/24612 ,  Y10T428/2848 ,  Y10T428/2887

Abstract: Methods for preparing double-sided multi-layer adhesives, double-sided multi-layer adhesives and articles prepared with double-sided multi-layer adhesives are disclosed. The methods for preparing double-sided multi-layer adhesives include providing a first fluid, the first fluid including a polymeric adhesive composition solution or dispersion, providing a second fluid, the second fluid including a curable composition, coating the first fluid and the second fluid onto a substrate, and curing the curable composition to form a double-sided multi-layer adhesive. The coating of the first fluid and the second fluid onto a substrate may include simultaneous slot die coating of the two fluids or sequential coating of the two fluids. The curable composition layer is cured to form a multi-layer adhesive article. The formed multi-layer adhesive article may be a transfer tape.

Abstract translation: 公开了制备双面多层粘合剂的方法，双面多层粘合剂和用双面多层粘合剂制备的制品。 制备双面多层粘合剂的方法包括提供第一流体，第一流体包括聚合物粘合剂组合物溶液或分散体，提供第二流体，第二流体包括可固化组合物，涂覆第一流体和第二流体 固化在基材上，固化可固化组合物以形成双面多层粘合剂。 第一流体和第二流体在基底上的涂层可以包括两个流体的同时槽模涂层或两个流体的顺序涂覆。 可固化组合物层被固化以形成多层粘合剂制品。 形成的多层粘合剂制品可以是转移带。

公开(公告)号：US08409703B2

公开(公告)日：2013-04-02

申请号：US12842068

申请日：2010-07-23

Applicant: Robert Ray Burch

Inventor： Robert Ray Burch

IPC: B32B7/12 ,  B32B15/04

CPC classification number: C09J7/21 ,  C09J7/38 ,  C09J2201/36 ,  C09J2453/00 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2852

Abstract: Disclosed herein are temperature switchable adhesive assemblies, which maintain tack above and below the switching temperature. The temperature switchable adhesive assemblies comprise a backing, a first adhesive layer comprising a temperature switchable pressure sensitive adhesive disposed on the backing, and a second adhesive layer comprising a non-switchable pressure sensitive adhesive disposed on the first adhesive layer. The temperature switchable adhesive assemblies have use in medical, consumer, and industrial applications.

Abstract translation: 这里公开了温度可切换的粘合剂组件，其保持高于和低于开关温度的粘度。 温度可切换粘合剂组件包括背衬，包括设置在背衬上的可温度切换的压敏粘合剂的第一粘合剂层和包括设置在第一粘合剂层上的不可切换压敏粘合剂的第二粘合剂层。 温度可切换粘合剂组件可用于医疗，消费和工业应用。

公开(公告)号：US08357449B2

公开(公告)日：2013-01-22

申请号：US12515788

申请日：2007-11-23

Applicant: Ingo Neubert ,  Bernd Lühmann

Inventor： Ingo Neubert ,  Bernd Lühmann

IPC: C09J7/02 ,  C09J7/00 ,  B32B38/00 ,  B32B37/14

CPC classification number: C09J5/02 ,  C09J7/10 ,  C09J2201/36 ,  C09J2433/00 ,  Y10T428/269 ,  Y10T428/28

Abstract: Self-adhesive tape comprising a laminate composed of at least two pressure-sensitive adhesive (PSA) layers A and B laminated directly to one another, one or both of the surfaces to be laminated to one another of the PSA layers A and B having been chemically and/or physically pretreated prior to lamination, and the shear strength tSA/B of the self-adhesive tape at 25° C., 40° C. and 70° C. under a weight load of 1000 g being at least 80% of the shear strength tSo of the PSA layer A and/or of the PSA layer B, where tSo represents the shear strength of the PSA layer having the lower shear strength.

Abstract translation: 包含由至少两个彼此层压的压敏粘合剂（A A和B）层压体组成的层压体的一层或两层粘合剂层A和B的层压自粘层 在层压之前进行化学和/或物理预处理，在25℃，40℃和70℃，1000克重量载荷下，自粘胶带的剪切强度tSA / B为至少80％ 的粘合剂层A和/或粘合剂层B的剪切强度tSo，其中tSo表示具有较低剪切强度的粘合剂层的剪切强度。

公开(公告)号：US20120326280A1

公开(公告)日：2012-12-27

申请号：US13530068

申请日：2012-06-21

Applicant: Takashi Oda ,  Naohide Takamoto ,  Hiroyuki Senzai

Inventor： Takashi Oda ,  Naohide Takamoto ,  Hiroyuki Senzai

IPC: H01L23/544 ,  B32B7/12 ,  C09J7/02 ,  H01L21/78

CPC classification number: H01L24/27 ,  C09J7/22 ,  C09J7/30 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L23/29 ,  H01L23/3114 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/27003 ,  H01L2224/27334 ,  H01L2224/32145 ,  H01L2224/73104 ,  H01L2224/81193 ,  H01L2224/8191 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/01029 ,  H01L2924/15787 ,  Y10T428/2826 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00

Abstract: Provided is a laminated film wherein the space between semiconductor elements that are three-dimensionally mounted can be filled easily and securely. The laminated film of the present invention is a laminated film for filling the space between semiconductor elements that are electrically connected through a member or connection, the film including a dicing sheet in which a pressure-sensitive adhesive layer is laminated on a base material and a curable film that is laminated on the pressure-sensitive adhesive layer, wherein the curable film has a lowest melt viscosity at 50 to 200° C. of 1×102 Pa·s or more and 1×104 Pa·s or less.

Abstract translation: 提供一种层叠膜，其中可以容易且可靠地填充三维安装的半导体元件之间的空间。 本发明的层压膜是用于填充通过构件或连接电连接的半导体元件之间的空间的层压膜，该膜包括其中压敏粘合剂层层压在基材上的切割片和 层压在粘合剂层上的固化膜，其中固化膜在50〜200℃下的熔融粘度最低为1×102Pa·s以上且1×104Pa·s以下。

公开(公告)号：US20120320317A1

公开(公告)日：2012-12-20

申请号：US13580605

申请日：2011-02-28

Applicant: Sung Soo Yoon ,  Ki Ok Kwon ,  No Ma Kim ,  In Ho Hwang ,  Sung Hyun Nam ,  In Kyu Park ,  Kyun Il Rah ,  Min Ki Lee

Inventor： Sung Soo Yoon ,  Ki Ok Kwon ,  No Ma Kim ,  In Ho Hwang ,  Sung Hyun Nam ,  In Kyu Park ,  Kyun Il Rah ,  Min Ki Lee

IPC: G02F1/1335 ,  G02B5/30

CPC classification number: G02B5/305 ,  B32B2457/202 ,  C09J133/08 ,  C09J133/10 ,  C09J2201/36 ,  C09J2201/40 ,  C09J2201/60 ,  C09J2201/606 ,  C09J2203/318 ,  C09J2433/00 ,  G02B5/3041 ,  G02F1/133528 ,  Y10T428/1041 ,  Y10T428/105 ,  Y10T428/1059 ,  Y10T428/1077 ,  Y10T428/1082

Abstract: The present invention relates to a polarizing plate and a liquid crystal display device. The polarizing plate, which is lightweight and has a small thickness and excellent physical properties including durability, water resistance, workability, pressure-sensitive adhesion and a light leakage prevention effect; and the liquid crystal display device including the same may be provided.

Abstract translation: 本发明涉及一种偏振板和液晶显示装置。 偏光板重量轻，厚度小，物理性能优异，包括耐久性，耐水性，可加工性，压敏粘合性和防漏光效果; 并且可以提供包括该液晶显示装置的液晶显示装置。

公开(公告)号：US08302366B2

公开(公告)日：2012-11-06

申请号：US12719799

申请日：2010-03-08

Applicant: Steven L. Taylor ,  Norman C. Tracy ,  Charles R. Cornman ,  John W. McMullen ,  Thomas R. Peck, Jr.

Inventor： Steven L. Taylor ,  Norman C. Tracy ,  Charles R. Cornman ,  John W. McMullen ,  Thomas R. Peck, Jr.

IPC: E04B1/00 ,  E04C1/00

CPC classification number: E04F13/0887 ,  C09J7/38 ,  C09J2201/128 ,  C09J2201/134 ,  C09J2201/28 ,  C09J2201/36 ,  C09J2201/40 ,  E04F15/02155 ,  E04F15/02188 ,  E04F15/187

Abstract: The installation system and method for installing an architectural covering material to a substrate surface utilizes an adhesive mat having layers of adhesive and release layers arranged to allow the covering material to be initially positioned, and later repositioned to be permanently set. The adhesive mat includes a planar carrier member, one or more adhesive layers on at least one planar side of the planar carrier member, and at least one release layer of material removably covering the one or more adhesive layers. In one form, the adhesive mat includes a carrier sheet, first and second adhesive layers on opposing planar sides of the carrier sheet, and first and second release layers of material removably covering the two adhesive layers.

Abstract translation: 用于将建筑覆盖材料安装到基底表面的安装系统和方法利用具有布置成允许覆盖材料被初始定位并且随后重新定位以永久设置的粘合剂层和释放层的粘合剂垫。 粘合垫包括平面载体构件，在平面载体构件的至少一个平面侧上的一个或多个粘合剂层和至少一个可移除地覆盖一个或多个粘合剂层的材料释放层。 在一种形式中，粘合剂垫包括载体片，载体片的相对平面侧上的第一和第二粘合剂层，以及可移除地覆盖两个粘合剂层的材料的第一和第二释放层。