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41.发明公开公开(公告)号：US20240234105A9
公开(公告)日：2024-07-11
申请号：US17971205
申请日：2022-10-21
Applicant: Applied Materials, Inc.
Inventor： Zheng John YE , Andrew C. LAM , Zeqiong ZHAO , Jianhua ZHOU , Hshiang AN , Suhail ANWAR , Yoshitake NAKAJIMA , Fu-ting CHANG
IPC: H01J37/32 , C23C16/458 , C23C16/505 , C23C16/52
CPC classification number: H01J37/32715 , C23C16/4586 , C23C16/505 , C23C16/52 , H01J37/321 , H01J37/32183 , H01J2237/0262 , H01J2237/20235 , H01J2237/24564 , H01J2237/3321 , H01J2237/3323
Abstract: Embodiments of the present disclosure generally relate to methods and apparatus for measuring and controlling local impedances at a substrate support in a plasma processing chamber during processing of a substrate. A substrate support includes a plurality of substrate support pins wherein the radio frequency voltage, current and phase of each of the plurality of substrate support pins are measured and impedances of the support pins are adjusted in real time. Each of the substrate support pins is coupled to an associated adjustable impedance circuit that may be remotely controlled. In one embodiment a variable capacitor is used to adjust the impedance of the impedance circuit coupled to the associated substrate support pin and may be remotely adjusted with a stepper motor. In another embodiment a microcontroller may control the impedance adjustments for all of the plurality of substrate support pins and may be used to track these impedances with each other and with a bulk impedance of the plasma processing chamber.
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公开(公告)号：US11996263B2
公开(公告)日：2024-05-28
申请号：US18196296
申请日：2023-05-11
Applicant: ASML Netherlands B.V.
CPC classification number: H01J37/20 , H02G11/00 , H01J2237/0262 , H01J2237/2007
Abstract: The present disclosure relates to a stage apparatus comprising: an object table configured to hold a substrate, the object table comprising an electrode configured to be charged by a power source and an electrical connection configured to electrically connect the electrode to the power source, and an electric field shield configured to shield at least a part of the electrical connection.
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公开(公告)号：US20240071711A1
公开(公告)日：2024-02-29
申请号：US18477213
申请日：2023-09-28
Applicant: ASML Netherlands B.V.
Inventor： Xuerang HU , Weiming REN , Xuedong LIU , Zhong-wei CHEN
IPC: H01J37/147 , H01J37/12 , H01J37/26
CPC classification number: H01J37/1477 , H01J37/12 , H01J37/26 , H01J2237/0213 , H01J2237/0262 , H01J2237/038 , H01J2237/0435
Abstract: Disclosed herein is an apparatus comprising: a first electrically conductive layer, a second electrically conductive layer; a plurality of optics element s between the first electrically conductive layer and the second electrically conductive layer, wherein the plurality of optics elements are configured to influence a plurality of beams of charged particles; a third electrically conductive layer between the first electrically conductive layer and the second electrically conductive layer; and an electrically insulating layer physically connected to the optics elements, wherein the eclectically insulating layer is configured to electrically insulate the optics elements from the first electrically conductive layer, and the second electrically conductive layer.
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公开(公告)号：US20170309442A1
公开(公告)日：2017-10-26
申请号：US15486880
申请日：2017-04-13
Applicant: APPLIED MATERIALS ISRAEL LTD.
Inventor： Yosef Basson
IPC: H01J37/20 , H01J37/18 , H01J37/248 , H01J37/28
CPC classification number: H01J37/20 , H01J37/09 , H01J37/16 , H01J37/18 , H01J37/226 , H01J37/248 , H01J37/28 , H01J2237/0206 , H01J2237/0262 , H01J2237/038 , H01J2237/049 , H01J2237/20292 , H01J2237/2813
Abstract: A high voltage inspection system that includes a vacuum chamber; electron optics that is configured to direct an electron beam towards an upper surface of a substrate; a substrate support module that comprises a chuck and a housing; wherein the chuck is configured to support a substrate; wherein the housing is configured to surround the substrate without masking the electron beam, when the substrate is positioned on the chuck during a first operational mode of the high voltage inspection system; and wherein the substrate, the chuck and the housing are configured to (a) receive a high voltage bias signal of a high voltage level that exceeds ten thousand volts, and (b) to maintain at substantially the high voltage level during the first operational mode of the high voltage inspection system.
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公开(公告)号：US20170250053A1
公开(公告)日：2017-08-31
申请号：US15594712
申请日：2017-05-15
Applicant: MAPPER LITHOGRAPHY IP B.V.
IPC: H01J37/09 , H01J37/302 , H01J37/147 , H01J37/30 , H01J37/317
CPC classification number: H01J37/09 , B82Y10/00 , B82Y40/00 , H01J37/147 , H01J37/3007 , H01J37/302 , H01J37/3174 , H01J37/3177 , H01J2237/002 , H01J2237/026 , H01J2237/0262 , H01J2237/0264 , H01J2237/16 , H01J2237/182 , H01J2237/188
Abstract: The invention relates to a charged particle beam generator. The generator may comprise a high voltage shielding arrangement (201) for shielding components outside the shielding arrangement from high voltages within the shielding arrangement, and a vacuum pump (220) located outside the shielding arrangement for regulating a pressure of a space within the shielding arrangement. The generator may comprise a collimator system with a cooling arrangement (405a/407a-407b/405b) comprising cooling channels inside electrodes of the collimator system.
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Patent Agency Ranking
46.发明申请公开(公告)号：US20160172158A1
公开(公告)日：2016-06-16
申请号：US14890258
申请日：2013-05-14
Applicant: Hitachi, Ltd.
Inventor： Noriyuki LEE , Hiroyuki YAMAMOTO , Akira SUGAWARA
IPC: H01J37/305
CPC classification number: H01J37/3056 , H01J37/317 , H01J2237/0262 , H01J2237/045 , H01J2237/12 , H01J2237/151 , H01J2237/206 , H01J2237/31745 , H01J2237/31749
Abstract: To realize a focused-ion-beam machining apparatus capable of machining a thin sample with a wide area and a uniform film thickness and a needle-like sample with a sharp tip, in a focused-ion-beam machining apparatus including: an ion source (1); an electronic lens (3) focusing an ion beam extracted from the ion source (1) and irradiating the ion beam to a sample (5); and a sample holder (13) holding the sample (5), the sample holder (13) is provided with a shield electrode (7) arranged in a manner such as to cover the sample (5), and the sample (5) and the shield electrode (7) are insulated from each other in a manner such that voltages can be applied to them separately from each other.
Abstract translation: 为了实现聚焦离子束加工装置，该聚焦离子束加工装置能够在聚焦离子束加工装置中对具有广泛面积和均匀薄膜厚度的薄样品进行加工的针状样品和具有尖尖的针状样品进行加工，所述聚焦离子束加工装置包括：离子源 （1）; 聚焦从离子源（1）提取的离子束并将离子束照射到样品（5）的电子透镜（3）; 和保持样品（5）的样品架（13），样品保持器（13）设置有以覆盖样品（5）的方式配置的屏蔽电极（7）和样品（5）和 屏蔽电极（7）以能够彼此分开施加电压的方式彼此绝缘。
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公开(公告)号：US20150124229A1
公开(公告)日：2015-05-07
申请号：US14400569
申请日：2013-05-14
Applicant: MAPPER LITHOGRAPHY IP B.V.
IPC: H01J37/317
CPC classification number: H01J37/09 , B82Y10/00 , B82Y40/00 , H01J37/147 , H01J37/3007 , H01J37/302 , H01J37/3174 , H01J37/3177 , H01J2237/002 , H01J2237/026 , H01J2237/0262 , H01J2237/0264 , H01J2237/16 , H01J2237/182 , H01J2237/188
Abstract: The invention relates to a charged particle lithography system for exposing a target. The system includes a charged particle beam generator for generating a charged particle beam; an aperture array (6) for forming a plurality of beamlets from the charged particle beam; and a beamlet projector (12) for projecting the beamlets onto a surface of the target. The charged particle beam generator includes a charged particle source (3) for generating a diverging charged particle beam; a collimator system (5a,5b,5c,5d; 72;300) for refracting the diverging charged particle beam; and a cooling arrangement (203) for removing heat from the collimator system, the cooling arrangement comprising a body surrounding at least a portion of the collimator system.
Abstract translation: 本发明涉及用于曝光目标物的带电粒子光刻系统。 该系统包括用于产生带电粒子束的带电粒子束发生器; 用于从带电粒子束形成多个子束的孔径阵列（6） 以及用于将子束投影到目标表面上的小射束投影仪（12）。 带电粒子束发生器包括用于产生发散带电粒子束的带电粒子源（3） 用于折射发散带电粒子束的准直器系统（5a，5b，5c，5d; 72; 300） 以及用于从准直器系统去除热的冷却装置（203），所述冷却装置包括围绕准直器系统的至少一部分的主体。
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公开(公告)号：US09000369B2
公开(公告)日：2015-04-07
申请号：US14512583
申请日：2014-10-13
Applicant: Hermes Microvision Inc.
Inventor： Weiming Ren , Zhongwei Chen
CPC classification number: H01J37/026 , H01J37/14 , H01J37/261 , H01J37/28 , H01J2237/0045 , H01J2237/0262 , H01J2237/1405 , H01J2237/2801 , H01J2237/2803
Abstract: The present invention provides means and corresponding embodiments to control charge-up in an electron beam apparatus, which can eliminate the positive charges soon after being generated on the sample surface within a frame cycle of imaging scanning. The means are to let some or all of secondary electrons emitted from the sample surface return back to neutralize positive charges built up thereon so as to reach a charge balance within a limited time period. The embodiments use control electrodes to generate retarding fields to reflect some of secondary electrons with low kinetic energies back to the sample surface.
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49.发明授权公开(公告)号：US08987677B2
公开(公告)日：2015-03-24
申请号：US12911861
申请日：2010-10-26
Applicant: Marco Jan-Jaco Wieland , Ferry Michael Postma
Inventor： Marco Jan-Jaco Wieland , Ferry Michael Postma
CPC classification number: H01J37/3177 , B82Y10/00 , B82Y40/00 , H01J37/045 , H01J37/07 , H01J37/3174 , H01J2237/0262 , H01J2237/0435 , H01J2237/0437 , H01J2237/31774
Abstract: The invention relates to a modulation device for use in a charged particle multi-beamlet lithography system. The device includes a body comprising an interconnect structure provided with a plurality of modulators and interconnects at different levels within the interconnect structure for enabling connection of the modulators to one or more pattern data receiving elements. A modulator includes a first electrode, a second electrode, and an aperture extending through the body. The electrodes are located on opposing sides of the aperture for generating an electric field across the aperture. At least one of the first electrode and the second electrode includes a first conductive element formed at a first level of the interconnect structure and a second conductive element formed at a second level of the interconnect structure. The first and second conductive elements are electrically connected with each other.
Abstract translation: 本发明涉及一种用于带电粒子多子束光刻系统的调制装置。 该装置包括主体，其包括在互连结构内的不同级别设置有多个调制器和互连的互连结构，用于使调制器能够连接到一个或多个图案数据接收元件。 调制器包括第一电极，第二电极和延伸穿过本体的孔。 电极位于孔的相对侧上，以产生穿过孔的电场。 第一电极和第二电极中的至少一个包括形成在互连结构的第一电平处的第一导电元件和形成在互连结构的第二电平处的第二导电元件。 第一和第二导电元件彼此电连接。
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公开(公告)号：US20150060670A1
公开(公告)日：2015-03-05
申请号：US14512583
申请日：2014-10-13
Applicant: Hermes Microvision Inc.
Inventor： Weiming Ren , Zhongwei Chen
CPC classification number: H01J37/026 , H01J37/14 , H01J37/261 , H01J37/28 , H01J2237/0045 , H01J2237/0262 , H01J2237/1405 , H01J2237/2801 , H01J2237/2803
Abstract: The present invention provides means and corresponding embodiments to control charge-up in an electron beam apparatus, which can eliminate the positive charges soon after being generated on the sample surface within a frame cycle of imaging scanning. The means are to let some or all of secondary electrons emitted from the sample surface return back to neutralize positive charges built up thereon so as to reach a charge balance within a limited time period. The embodiments use control electrodes to generate retarding fields to reflect some of secondary electrons with low kinetic energies back to the sample surface.
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