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51.发明授权Micro device transfer head heater assembly and method of transferring a micro device 有权微型设备传送头加热器组件和传送微型设备的方法公开(公告)号：US08349116B1
公开(公告)日：2013-01-08
申请号：US13372422
申请日：2012-02-13
Applicant: Andreas Bibl , John A. Higginson , Hung-Fai Stephen Law , Hsin-Hua Hu
Inventor： Andreas Bibl , John A. Higginson , Hung-Fai Stephen Law , Hsin-Hua Hu
CPC classification number: H01L29/167 , B32B38/18 , H01L21/67144 , H01L24/75 , H01L24/83 , H01L24/95 , H01L24/97 , H01L25/0753 , H01L33/62 , H01L2224/75725 , H01L2224/7598 , H01L2224/83005 , H01L2224/97 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/1421 , H01L2924/1431 , H01L2924/1434 , H01L2924/1461 , H01L2933/0066 , Y10T156/1153 , Y10T156/17 , Y10T156/1705 , Y10T156/1707 , Y10T156/1744 , Y10T156/1749 , Y10T156/1776 , Y10T156/1911 , H01L2224/83 , H01L2924/00
Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
Abstract translation: 公开了一种传送微型装置和微型装置阵列的方法。 承载连接到接合层的微型器件的载体衬底被加热到低于接合层的液相线温度的温度，并且转移头被加热到高于接合层的液相线温度的温度。 当微型装置与转印头接触时，来自转印头的热量转移到粘结层中以至少部分地熔化粘结层。 施加到转印头的电压产生从载体衬底拾取微器件的夹持力。
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公开(公告)号：US08333860B1
公开(公告)日：2012-12-18
申请号：US13372310
申请日：2012-02-13
Applicant: Andreas Bibl , John A. Higginson , Hung-Fai Stephen Law , Hsin-Hua Hu
Inventor： Andreas Bibl , John A. Higginson , Hung-Fai Stephen Law , Hsin-Hua Hu
CPC classification number: H01L24/83 , B32B37/025 , B32B37/06 , B32B2457/20 , H01L21/67144 , H01L21/6833 , H01L24/75 , H01L24/95 , H01L24/97 , H01L2224/75725 , H01L2224/7598 , H01L2224/83005 , H01L2224/97 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/1421 , H01L2924/1431 , H01L2924/1434 , H01L2924/1461 , H01L2924/15153 , Y10T156/1153 , Y10T156/1707 , Y10T156/1744 , Y10T156/1749 , Y10T156/1776 , H01L2224/83 , H01L2924/00
Abstract: A micro device transfer head and head array are disclosed. In an embodiment, the micro device transfer head includes a base substrate, a mesa structure with sidewalls, an electrode formed over the mesa structure, and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate.
Abstract translation: 公开了一种微器件转印头和头阵列。 在一个实施例中，微器件转移头包括基底，具有侧壁的台面结构，形成在台面结构上的电极以及覆盖电极的电介质层。 可以将电压施加到微器件转移头和头阵列以从载体衬底拾取微器件并将微器件释放到接收衬底上。
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公开(公告)号：US09209348B2
公开(公告)日：2015-12-08
申请号：US14681715
申请日：2015-04-08
Applicant: LuxVue Technology Corporation
Inventor： Hsin-Hua Hu , Kevin K. C. Chang , Andreas Bibl
CPC classification number: H01L33/62 , H01L24/75 , H01L24/83 , H01L24/95 , H01L25/0753 , H01L27/15 , H01L27/156 , H01L33/005 , H01L33/0079 , H01L33/0095 , H01L33/04 , H01L33/06 , H01L33/08 , H01L33/32 , H01L33/60 , H01L2224/83005 , H01L2924/12041 , H01L2924/12042 , H01L2933/0066 , H01L2924/00
Abstract: A method and structure for stabilizing an array of micro devices is disclosed. A stabilization layer includes an array of stabilization cavities and array of stabilization posts. Each stabilization cavity includes sidewalls surrounding a stabilization post. The array of micro devices is on the array of stabilization posts. Each micro device in the array of micro devices includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
Abstract translation: 公开了一种稳定微器件阵列的方法和结构。 稳定层包括稳定腔阵列和稳定柱阵列。 每个稳定腔包括围绕稳定柱的侧壁。 微型设备阵列位于稳定柱阵列上。 微器件阵列中的每个微器件包括比直接在底表面下方的相应的稳定位置更宽的底表面。
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公开(公告)号：US20150263066A1
公开(公告)日：2015-09-17
申请号：US14210295
申请日：2014-03-13
Applicant: LuxVue Technology Corporation
Inventor： Hsin-Hua Hu , Andreas Bibl
CPC classification number: H01L27/153 , H01L24/75 , H01L24/83 , H01L24/95 , H01L25/0753 , H01L29/0669 , H01L29/0676 , H01L33/0079 , H01L33/0095 , H01L33/08 , H01L33/16 , H01L33/18 , H01L33/24
Abstract: A nanowire device and a method of forming a nanowire device that is poised for pick up and transfer to a receiving substrate are described. In an embodiment, the nanowire device includes a base layer and a plurality of nanowires on and protruding away from a first surface of the base layer. An encapsulation material laterally surrounds the plurality of nanowires in the nanowire device, such that the nanowires are embedded within the encapsulation material.
Abstract translation: 描述了纳米线器件和形成用于拾取和转移到接收衬底的纳米线器件的方法。 在一个实施例中，纳米线器件包括基底层和在基底层的第一表面上并远离基底层的多个纳米线。 封装材料横向围绕纳米线装置中的多个纳米线，使得纳米线嵌入封装材料内。
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55.发明授权公开(公告)号：US09105714B2
公开(公告)日：2015-08-11
申请号：US13754739
申请日：2013-01-30
Applicant: LUXVUE TECHNOLOGY CORPORATION
Inventor： Hsin-Hua Hu , Andreas Bibl
IPC: H01L21/78 , H01L27/15 , H01L25/075 , H01L33/00
CPC classification number: H01L21/7806 , H01L24/75 , H01L24/95 , H01L25/0753 , H01L27/15 , H01L33/0079 , H01L2224/83 , H01L2224/95 , H01L2924/0002 , H01L2924/00
Abstract: A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is within an array of staging cavities on a carrier substrate. Each micro device is laterally retained between a plurality of staging bollards of a corresponding staging cavity.
Abstract translation: 公开了一种稳定微器件阵列的方法和结构。 微器件阵列位于载体衬底上的分段腔阵列内。 每个微型装置横向保持在相应的分段腔的多个分段固定柱之间。
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Patent Agency Ranking
公开(公告)号：US09095980B2
公开(公告)日：2015-08-04
申请号：US13776188
申请日：2013-02-25
Applicant: LuxVue Technology Corporation
Inventor： Dariusz Golda , John A. Higginson , Andreas Bibl , Paul Argus Parks , Stephen Paul Bathurst
CPC classification number: B25J11/00 , B25J7/00 , B25J9/0015 , B25J15/0052 , B25J15/0085 , H01L24/75 , H01L2224/7598
Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.
Abstract translation: 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，质量传递工具操纵器组件允许在微拾取阵列上的静电转印头阵列和载体衬底上的微器件阵列之间的主动对准。 可以检测质量传递工具操纵器组件的柔性元件的位移，以控制静电转印头阵列与微器件阵列之间的对准。
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公开(公告)号：US20150187991A1
公开(公告)日：2015-07-02
申请号：US14194509
申请日：2014-02-28
Applicant: LuxVue Technology Corporation
Inventor： Kelly McGroddy , Hsin-Hua Hu , Andreas Bibl , Clayton Ka Tsun Chan , Daniel Arthur Haeger
CPC classification number: H01L33/145 , G09G3/32 , H01L24/75 , H01L24/95 , H01L25/0753 , H01L27/016 , H01L27/156 , H01L33/0016 , H01L33/0079 , H01L33/0095 , H01L33/06 , H01L33/14 , H01L33/16 , H01L33/20 , H01L33/30 , H01L33/42 , H01L2224/75305 , H01L2224/75725 , H01L2224/7598 , H01L2224/82203 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/00
Abstract: Methods and structures for forming arrays of LED devices are disclosed. The LED devices in accordance with embodiments of the invention may include an internally confined current injection area to reduce non-radiative recombination due to edge effects. Several manners for confining current may include etch removal of a current distribution layer, etch removal of a current distribution layer and active layer followed by mesa re-growth, isolation by ion implant or diffusion, quantum well intermixing, and oxide isolation.
Abstract translation: 公开了用于形成LED器件阵列的方法和结构。 根据本发明的实施例的LED器件可以包括内部限制的电流注入区域，以减少由于边缘效应引起的非辐射复合。 限制电流的几种方式可以包括电流分布层的蚀刻去除，电流分布层和活性层的蚀刻去除，随后的台面再生长，通过离子注入或扩散的分离，量子阱混合和氧化物隔离。
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公开(公告)号：US09000566B2
公开(公告)日：2015-04-07
申请号：US14173693
申请日：2014-02-05
Applicant: LuxVue Technology Corporation
Inventor： Dariusz Golda , Andreas Bibl
IPC: H01L21/00 , B32B38/18 , H01L21/683 , H01L23/538 , B81C99/00
CPC classification number: B32B38/18 , B81C99/002 , H01L21/6835 , H01L23/5384 , H01L2221/68368 , H01L2221/68381 , H01L2924/0002 , Y10T156/17 , H01L2924/00
Abstract: A compliant monopolar micro device transfer head array and method of forming a compliant monopolar micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array including a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect, and each silicon electrode is deflectable into a cavity between the base substrate and the silicon electrode. A dielectric layer covers a top surface of each mesa structure.
Abstract translation: 描述了一种兼容的单极微器件传输头阵列和从SOI衬底形成兼容单极微器件传输阵列的方法。 在一个实施例中，微器件转移头阵列包括基底衬底和在基底衬底上的图案化硅层。 图案化硅层可以包括硅互连和与硅互连电连接的硅电极阵列。 每个硅电极包括在硅互连上方突出的台面结构，并且每个硅电极可偏转到基底基板和硅电极之间的空腔中。 介电层覆盖每个台面结构的顶面。
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公开(公告)号：US20150028362A1
公开(公告)日：2015-01-29
申请号：US13952450
申请日：2013-07-26
Applicant: LuxVue Technology Corporation
Inventor： Clayton Ka Tsun Chan , Andreas Bibl
CPC classification number: H01L27/156 , H01L24/00 , H01L24/75 , H01L24/83 , H01L24/95 , H01L33/005 , H01L33/0079 , H01L33/06 , H01L2224/7598 , H01L2924/12041 , H01L2924/12042 , H01L2924/00
Abstract: A method and structure for forming an array of micro devices is disclosed. An array of micro devices is formed over an array of stabilization posts included in a stabilization layer. The stabilization layer is bonded to a spacer side of a carrier substrate. The spacer side of the carrier substrate includes raised spacers extending from a spacer-side surface of the carrier substrate.
Abstract translation: 公开了一种用于形成微器件阵列的方法和结构。 在包括在稳定层中的稳定柱的阵列上形成微器件阵列。 稳定层结合到载体基板的间隔侧。 载体基板的间隔件侧包括从载体基板的间隔件侧表面延伸的凸起间隔件。
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公开(公告)号：US08933433B2
公开(公告)日：2015-01-13
申请号：US13562184
申请日：2012-07-30
Applicant: John A. Higginson , Andreas Bibl , Hsin-Hua Hu
Inventor： John A. Higginson , Andreas Bibl , Hsin-Hua Hu
CPC classification number: H01L25/167 , H01L21/56 , H01L23/3171 , H01L25/0753 , H01L25/50 , H01L27/1214 , H01L27/1248 , H01L27/1262 , H01L33/005 , H01L33/06 , H01L33/42 , H01L33/44 , H01L33/54 , H01L33/62 , H01L2924/0002 , H01L2933/0016 , H01L2933/0025 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
Abstract translation: 公开了一种用于在接收基板上接收微型装置的方法和结构。 诸如微型LED器件的微器件通过覆盖接收衬底上的导电层的钝化层穿孔，并且钝化层硬化。 在一个实施例中，微型LED器件通过B阶热固性材料穿孔。 在一个实施例中，微型LED器件穿过热塑性材料。
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