公开(公告)号：US09535528B2

公开(公告)日：2017-01-03

申请号：US14627624

申请日：2015-02-20

申请人： INNOCOM TECHNOLOGY (SHENZHEN) CO., LTD. ,  INNOLUX CORPORATION

发明人： Szu-Wei Lai ,  Yu-Ching Liu ,  Wan-Yu Ho

IPC分类号： G06F3/041 ,  G06F1/16 ,  H05K3/46

CPC分类号： G06F3/0412 ,  G06F1/169 ,  G06F3/041 ,  G06F2203/04103 ,  H05K3/4685 ,  H05K2201/0326 ,  Y10T29/49155 ,  Y10T29/49162

摘要： A system for displaying images is provided. The system includes a touch sensor device including a transparent substrate having a sensing region and a non-sensing region adjacent to the sensing region. A sensing electrode pattern layer is on the transparent substrate in the sensing region. An inorganic dielectric material layer is on the transparent substrate. The inorganic dielectric material layer has a first portion in the non-sensing region and a second portion in the sensing region and partially covering the sensing electrode pattern layer. A method of forming a touch sensor device is also disclosed.

摘要翻译： 提供了一种用于显示图像的系统。 该系统包括触摸传感器装置，其包括具有感测区域和与感测区域相邻的非感测区域的透明基板。 感测电极图案层位于感测区域中的透明衬底上。 无机介电材料层位于透明基板上。 无机介电材料层具有非感测区域中的第一部分和感测区域中的第二部分，并且部分地覆盖感测电极图案层。 还公开了一种形成触摸传感器装置的方法。

公开(公告)号：USD773788S1

公开(公告)日：2016-12-13

申请号：US29450122

申请日：2013-03-15

申请人： Decky Company Inc.

设计人： John Whang

公开(公告)号：US09465958B2

公开(公告)日：2016-10-11

申请号：US14015031

申请日：2013-08-30

申请人： ABSOLUTE SOFTWARE CORPORATION

发明人： Philip B. Gardner

IPC分类号： G06F7/04 ,  G06F21/70 ,  G06F9/44 ,  G06F21/57 ,  G06F21/55 ,  H04L29/06 ,  H04L12/24

CPC分类号： G06F21/70 ,  G06F9/4411 ,  G06F21/552 ,  G06F21/572 ,  G06F21/575 ,  H04L41/50 ,  H04L63/20

摘要： A tamper resistant servicing Agent for providing various services (e.g., data delete, firewall protection, data encryption, location tracking, message notification, and updating software) comprises multiple functional modules, including a loader module (CLM) that loads and gains control during POST, independent of the OS, an Adaptive Installer Module (AIM), and a Communications Driver Agent (CDA). Once control is handed to the CLM, it loads the AIM, which in turn locates, validates, decompresses and adapts the CDA for the detected OS environment. The CDA exists in two forms, a mini CDA that determines whether a full or current CDA is located somewhere on the device, and if not, to load the full-function CDA from a network; and a full-function CDA that is responsible for all communications between the device and the monitoring server. The servicing functions can be controlled by a remote server.

摘要翻译： 用于提供各种服务（例如数据删除，防火墙保护，数据加密，位置跟踪，消息通知和更新软件）的防篡改服务代理包括多个功能模块，包括在POST期间加载和获取控制的加载程序模块（CLM） ，独立于操作系统，自适应安装程序模块（AIM）和通信驱动程序代理（CDA）。 一旦控制权交给CLM，它将加载AIM，AIM又会定位，验证，解压缩并适应检测到的OS环境的CDA。 CDA以两种形式存在，一种mini CDA，用于确定完整或当前的CDA是否位于设备的某处，如果不是，则从网络加载全功能CDA; 以及负责设备和监控服务器之间所有通信的全功能CDA。 服务功能可由远程服务器控制。

公开(公告)号：US09449897B2

公开(公告)日：2016-09-20

申请号：US14198542

申请日：2014-03-05

申请人： XINTEC INC.

发明人： Bai-Yao Lou ,  Shih-Kuang Chen ,  Sheng-Yuan Lee

IPC分类号： H01L21/78 ,  H01L23/48 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L23/48 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3114 ,  H01L2924/0002 ,  H01L2924/00

摘要： An embodiment of the invention provides a chip package which includes: a semiconductor substrate; a device region formed in the semiconductor substrate; at least a conducting pad disposed over a surface of the semiconductor substrate; a protection plate disposed over the surface of the semiconductor substrate; and a spacer layer disposed between the surface of the semiconductor substrate and the protection plate, wherein the protection plate and the spacer layer surround a cavity over the device region, the spacer layer has an outer side surface away from the cavity, and the outer side surface of the spacer layer is not a cutting surface.

摘要翻译： 本发明的实施例提供一种芯片封装，其包括：半导体衬底; 形成在所述半导体衬底中的器件区域; 至少一个设置在所述半导体衬底的表面上的导电焊盘; 设置在所述半导体衬底的表面上的保护板; 以及设置在所述半导体衬底的表面和所述保护板之间的间隔层，其中所述保护板和所述间隔层围绕所述器件区域的空腔，所述间隔层具有远离所述腔的外侧表面，并且所述外侧 间隔层的表面不是切割面。

公开(公告)号：US09433268B2

公开(公告)日：2016-09-06

申请号：US14203541

申请日：2014-03-10

申请人： Mark J. S. Ma

发明人： Mark J. S. Ma

IPC分类号： A45B17/00 ,  A45B23/00

CPC分类号： A45B17/00 ,  A45B23/00 ,  A45B2017/005 ,  A45B2023/0037 ,  A45B2023/0056 ,  A45B2023/0075

摘要： An umbrella having the crown of the canopy coupled to a support structure via a pivot joint that is structured and configured to allow swiveling and/or tilting of the canopy with ease by a user, in more than one plane or with more than one degree of freedom with respect to the support structure. The canopy frame includes a longitudinal central support hub, and the pivot joint is rotatable about a rotation axis, wherein the axis of the canopy support hub makes a fixed or variable non-zero angle with respect to the pivot joint rotation axis. As a result of the angle between the pivot joint rotation axis and the canopy support hub axis. The rotation of the pivot joint causes tilting of the canopy support hub axis, thus tilting the canopy to change its orientation.

摘要翻译： 具有通过枢转接头联接到支撑结构的顶篷冠的伞，所述枢转接头被构造和构造成允许使用者在多于一个平面或多于一个平面中容易地旋转和/或倾斜遮篷的倾斜 关于支持结构的自由。 顶篷框架包括纵向中心支撑毂，并且枢转接头可围绕旋转轴线旋转，其中顶盖支撑轮毂的轴线相对于枢转接头旋转轴线具有固定或可变的非零角度。 由于枢转关节旋转轴和冠层支撑轮毂轴线之间的角度。 枢转接头的旋转引起罩盖支撑轮毂轴线的倾斜，从而使罩盖倾斜以改变其定向。

公开(公告)号：US09425134B2

公开(公告)日：2016-08-23

申请号：US14339323

申请日：2014-07-23

申请人： XINTEC INC.

发明人： Yen-Shih Ho ,  Tsang-Yu Liu ,  Shu-Ming Chang ,  Yu-Lung Huang ,  Chao-Yen Lin ,  Wei-Luen Suen ,  Chien-Hui Chen

IPC分类号： H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  G06K9/00 ,  H01L25/065 ,  H01L23/525 ,  H01L23/532

CPC分类号： H01L23/49805 ,  G06K9/00006 ,  G06K9/00053 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/3192 ,  H01L23/525 ,  H01L23/5329 ,  H01L24/05 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/02166 ,  H01L2224/02381 ,  H01L2224/024 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2224/05558 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/05687 ,  H01L2224/0569 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48611 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48669 ,  H01L2224/48687 ,  H01L2224/4869 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/10155 ,  H01L2924/10156 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2224/03 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05552

摘要： A chip package is provided. The chip package includes a chip having an upper surface, a lower surface and a sidewall. The chip includes a sensing region or device region and a signal pad region adjacent to the upper surface. A shallow recess structure is located outside of the signal pad region and extends from the upper surface toward the lower surface along the sidewall. The shallow recess structure has at least a first recess and a second recess under the first recess. A redistribution layer is electrically connected to the signal pad region and extends into the shallow recess structure. A first end of a wire is located in the shallow recess structure and is electrically connected to the redistribution layer. A second end of the wire is used for external electrical connection. A method for forming the chip package is also provided.

摘要翻译： 提供芯片封装。 芯片封装包括具有上表面，下表面和侧壁的芯片。 芯片包括感测区域或器件区域以及与上表面相邻的信号焊盘区域。 浅凹陷结构位于信号垫区域的外侧，并且沿着侧壁从上表面向下表面延伸。 浅凹部结构在第一凹部下方具有至少第一凹部和第二凹部。 再分配层电连接到信号焊盘区域并延伸到浅凹陷结构中。 电线的第一端位于浅凹陷结构中，并且电连接到再分配层。 电线的第二端用于外部电气连接。 还提供了一种用于形成芯片封装的方法。

公开(公告)号：US09406818B2

公开(公告)日：2016-08-02

申请号：US14971395

申请日：2015-12-16

申请人： XINTEC INC.

发明人： Tsang-Yu Liu ,  Shu-Ming Chang ,  Po-Han Lee

IPC分类号： H01L23/00 ,  H01L31/0203 ,  H01L31/18 ,  H01L31/02 ,  H01L23/31 ,  H01L23/48

CPC分类号： H01L31/0203 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/12 ,  H01L24/13 ,  H01L31/02005 ,  H01L31/18 ,  H01L2224/131 ,  H01L2224/73253 ,  Y02P70/521 ,  H01L2924/014

摘要： A method of manufacturing chip package includes providing a semiconductor wafer having a plurality of semiconductor chips. An outer spacer and a plurality of inner spacers are formed on the semiconductor wafer. A protection lid is formed and disposed on the outer spacer and the inner spacers. A plurality of cavities is formed on each of the semiconductor chips from a lower surface thereof to expose the conductive pad disposed on the upper surface of the semiconductor chip. A plurality of conductive portions is formed and fills each of the cavities and electrically connected to each of the conductive pads. A plurality of solder balls is disposed on the lower surface and electrically connected to each of the conductive portions. The semiconductor chips are separated by cutting along a plurality of cutting lines between each of the semiconductor chips.

摘要翻译： 制造芯片封装的方法包括提供具有多个半导体芯片的半导体晶片。 在半导体晶片上形成有外隔离物和多个内隔离物。 保护盖形成并设置在外隔离件和内间隔件上。 从其下表面在每个半导体芯片上形成多个空腔，以露出设置在半导体芯片的上表面上的导电焊盘。 形成多个导电部分，并填充每个空腔并电连接到每个导电焊盘。 多个焊球设置在下表面并电连接到每个导电部分。 半导体芯片通过沿着每个半导体芯片之间的多个切割线进行切割来分离。

公开(公告)号：US09406737B2

公开(公告)日：2016-08-02

申请号：US14572460

申请日：2014-12-16

申请人： INNOLUX CORPORATION

发明人： Kuang-Pin Chao ,  Yun-Sheng Chen ,  Ming-Chien Sun

IPC分类号： G02F1/136 ,  H01L27/32 ,  G02F1/1368 ,  H01L27/12 ,  H01L51/52

CPC分类号： H01L27/124 ,  G02F1/133514 ,  G02F1/1339 ,  G02F1/13394 ,  G02F1/1341 ,  G02F1/136227 ,  G02F1/136286 ,  G02F1/1368 ,  G02F2201/50 ,  H01L27/1248 ,  H01L27/1251 ,  H01L27/3246 ,  H01L27/3248 ,  H01L27/3258 ,  H01L27/3262 ,  H01L27/3276 ,  H01L51/5246 ,  H01L51/525 ,  H01L2251/558

摘要： A display device is disclosed, which comprises: a first substrate; a first insulating layer disposed on the first substrate; a second insulating layer disposed on the first insulating layer; and a patterned metal layer disposed on the second insulating layer and comprising plural conductive lines, wherein an opening region is located between two adjacent conductive lines to expose the second insulating layer, and a thickness of the second insulating layer under the conductive lines of the patterned metal layer is larger than that exposed from the opening region.

摘要翻译： 公开了一种显示装置，包括：第一基板; 设置在所述第一基板上的第一绝缘层; 设置在所述第一绝缘层上的第二绝缘层; 以及图案化的金属层，其设置在所述第二绝缘层上并且包括多个导电线，其中开口区域位于两个相邻的导电线之间以暴露所述第二绝缘层，并且所述第二绝缘层的厚度在所述图案化的导电线之下 金属层大于从开口区域露出的金属层。

公开(公告)号：US09406590B2

公开(公告)日：2016-08-02

申请号：US14255883

申请日：2014-04-17

申请人： XINTEC INC.

发明人： Chia-Sheng Lin ,  Yen-Shih Ho ,  Tsang-Yu Liu

IPC分类号： H01L23/48 ,  H01L23/495 ,  H01L23/00

CPC分类号： H01L23/4952 ,  H01L24/05 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/49107 ,  H01L2224/494 ,  H01L2224/8536 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package is provided. The chip package comprises a semiconductor chip, an isolation layer, a redistributing metal layer, and a bonding pad. The semiconductor chip has a first conducting pad disposed on a lower surface, and a first hole corresponding to the first conducting pad. The first hole and the isolation layer extend from an upper surface to the lower surface to expose the first conducting pad. The redistributing metal layer is disposed on the isolation layer and has a redistributing metal line corresponding to the first conducting pad, the redistributing metal line is connected to the first conducting pad through the opening. The bonding pad is disposed on the isolation layer and one side of the semiconductor chip, wherein the redistributing metal line extends to the bonding pad to electrically connect the first conducting pad to the bonding pad. A method thereof is also provided.

摘要翻译： 提供芯片封装。 芯片封装包括半导体芯片，隔离层，再分布金属层和接合焊盘。 半导体芯片具有设置在下表面上的第一导电焊盘和对应于第一导电焊盘的第一孔。 第一孔和隔离层从上表面延伸到下表面以暴露第一导电垫。 再分布金属层设置在隔离层上并具有对应于第一导电焊盘的再分布金属线，再分布金属线通过开口连接到第一导电焊盘。 接合焊盘设置在隔离层和半导体芯片的一侧，其中再分布金属线延伸到接合焊盘以将第一导电焊盘电连接到接合焊盘。 还提供了其方法。

公开(公告)号：US09360606B2

公开(公告)日：2016-06-07

申请号：US14486206

申请日：2014-09-15

申请人： INNOLUX CORPORATION

发明人： Yao-Teng Tseng ,  Tsung-Han Tsai ,  Ying-Tong Lin

IPC分类号： G02F1/1335 ,  G02B5/20

CPC分类号： G02B5/201 ,  G02F1/133345 ,  G02F1/133512 ,  G02F1/133514

摘要： An embodiment of the invention provides a color filter substrate which includes: a substrate having a surface; a light-shielding layer disposed on the surface; a first color filter layer; and a second color filter layer disposed on the surface, the light-shielding layer has a first sidewall in direct contact with the first color filter layer, the first sidewall and the surface form a first angle, the light-shielding layer has a second sidewall in direct contact with the second color filter layer, the second sidewall and the surface form a second angle, and the second angle is less than the first angle.

摘要翻译： 本发明的实施例提供了一种滤色器基板，其包括：具有表面的基板; 设置在所述表面上的遮光层; 第一滤色器层; 以及设置在所述表面上的第二滤色器层，所述遮光层具有与所述第一滤色器层直接接触的第一侧壁，所述第一侧壁和所述表面形成第一角度，所述遮光层具有第二侧壁 与第二滤色器层直接接触，第二侧壁和表面形成第二角度，并且第二角度小于第一角度。