公开(公告)号：US20170242503A1

公开(公告)日：2017-08-24

申请号：US15437304

申请日：2017-02-20

申请人： Intevac, Inc.

发明人： Babak Adibi ,  Terry Bluck

IPC分类号： G06F3/041 ,  H01L21/265

CPC分类号： G06F3/041 ,  C03C17/3417 ,  C03C17/3435 ,  C03C17/3441 ,  C03C17/42 ,  C03C23/0055 ,  C03C2217/734 ,  C03C2217/76 ,  C03C2217/78 ,  G06F2203/04103 ,  H01L21/265 ,  Y02P40/57

摘要： Mechanical properties of a cover glass for a touch screen are improved by ion implanting the front surface. The implant process uses non-mass analyzed ions that physically embed in voids between inter-connected molecules of the glass. The embedded ions create compression stress on the molecular structure, thus enhancing the mechanical properties of the glass to avoid scratches. Also, implanting ions containing fluoride enhances the hydrophobic and oleophobis properties of the glass to prevent finger prints.

公开(公告)号：US09605340B2

公开(公告)日：2017-03-28

申请号：US13935993

申请日：2013-07-05

申请人： Intevac, Inc.

发明人： David Fang Wei Chen ,  David Ward Brown ,  Charles Liu ,  Samuel D. Harkness, IV

IPC分类号： C23C14/35 ,  C23C14/34 ,  C23C14/00 ,  C23C14/06 ,  C23C14/56

CPC分类号： C23C14/0057 ,  C23C14/0605 ,  C23C14/3464 ,  C23C14/35 ,  C23C14/562 ,  H01J37/3426

摘要： A physical vapor deposition (PVD) chamber for depositing a transparent and clear hydrogenated carbon, e.g., hydrogenated diamond-like carbon, film. A chamber body is configured for maintaining vacuum condition therein, the chamber body having an aperture on its sidewall. A plasma cage having an orifice is attached to the sidewall, such that the orifice overlaps the aperture. Two sputtering targets are situated on cathodes inside the plasma cage and are oriented opposite each other and configured to sustain plasma there-between and confined inside the plasma cage. The plasma inside the cage sputters material from the targets, which then passes through the orifice and aperture and lands on the substrate. The substrate is moved continuously in a pass-by fashion during the process.

公开(公告)号：US20170062258A1

公开(公告)日：2017-03-02

申请号：US15284241

申请日：2016-10-03

申请人： Intevac, Inc.

发明人： Terry Bluck ,  Aaron Zanetto ,  William Eugene Runstadler, JR. ,  Terry Pederson

IPC分类号： H01L21/68 ,  H01L21/677 ,  H01L21/683

摘要： A system for processing wafers in a vacuum processing chamber. Carrier comprising a frame having a plurality of openings, each opening configured to accommodate one wafer. A transport mechanism configured to transport the plurality of carriers throughout the system. A plurality of wafer plates configured for supporting wafers. An attachment mechanism for attaching a plurality of wafer plates to each of the carriers, wherein each of the wafer plates is attached to a corresponding position at an underside of a corresponding carrier, such that each of the wafers positioned on one of the wafer carriers is positioned within one of the plurality of opening in the carrier. Mask attached over front side of one of the plurality of opening in the carrier. Alignment stage supports wafer plate under the opening in the carrier. A camera positioned to simultaneously image the mask and the wafer.

摘要翻译： 一种用于在真空处理室中处理晶片的系统。 载体包括具有多个开口的框架，每个开口被配置为容纳一个晶片。 一种配置成在整个系统中传送多个载体的传送机构。 配置用于支撑晶片的多个晶片板。 一种用于将多个晶片板附接到每个载体的附接机构，其中每个晶片板附接到相应载体的下侧处的对应位置，使得位于晶片载体之一上的每个晶片是 定位在载体中的多个开口中的一个内。 掩模附着在载体中的多个开口中的一个的前侧上。 对准台在载体的开口下面支撑晶片板。 定位成同时对掩模和晶片进行成像的照相机。

公开(公告)号：US20160177438A1

公开(公告)日：2016-06-23

申请号：US15053997

申请日：2016-02-25

申请人： Intevac, Inc.

发明人： Vinay Shah ,  Alexandru Riposan ,  Terry Bluck

IPC分类号： C23C14/35 ,  H01J37/34 ,  C23C14/56

CPC分类号： C23C14/351 ,  C23C14/35 ,  C23C14/56 ,  H01J37/32779 ,  H01J37/32899 ,  H01J37/3405 ,  H01J37/3417 ,  H01J37/3452 ,  H01J37/3455 ,  H01J2237/202 ,  H01J2237/3323

摘要： A method for depositing material from a target onto substrates, comprising using a processing chamber; a sputtering target having length L and having sputtering material provided on front surface thereof; a magnet operable to reciprocally scan across the length L in close proximity to rear surface of the target; and a counterweight operable to reciprocally scan at same speed but opposite direction of the magnet; and moving the magnets at speeds at least several times faster than the speed of the substrates.

摘要翻译： 一种用于将材料从靶材沉积到基板上的方法，包括使用处理室; 具有长度L并在其前表面上设置有溅射材料的溅射靶; 一个磁铁可操作以在紧邻目标的后表面的整个长度L上往复扫描; 以及配重可操作以在磁体的相同速度但相反的方向上往复扫描; 并以比基片的速度至少几倍的速度移动磁体。

公开(公告)号：US20150072461A1

公开(公告)日：2015-03-12

申请号：US14510109

申请日：2014-10-08

申请人： Intevac, Inc.

发明人： Babak Adibi ,  Moon Chun

IPC分类号： H01L31/18 ,  H01J37/18 ,  H01J37/317

CPC分类号： H01L31/1876 ,  C23C14/042 ,  C23C14/48 ,  H01J37/185 ,  H01J37/3171 ,  H01J37/32412 ,  H01J37/32422 ,  H01J2237/0437 ,  H01J2237/184 ,  H01J2237/201 ,  H01J2237/327 ,  H01J2237/3365 ,  H01L21/2236 ,  H01L31/068 ,  H01L31/0682 ,  H01L31/1804 ,  H01L31/1864 ,  Y02E10/547 ,  Y02P70/521

摘要： An ion implantation system having a grid assembly. The system includes a plasma source configured to provide plasma in a plasma region; a first grid plate having a plurality of apertures configured to allow ions from the plasma region to pass therethrough, wherein the first grid plate is configured to be biased by a power supply; a second grid plate having a plurality of apertures configured to allow the ions to pass therethrough subsequent to the ions passing through the first grid plate, wherein the second grid plate is configured to be biased by a power supply; and a substrate holder configured to support a substrate in a position where the substrate is implanted with the ions subsequent to the ions passing through the second grid plate.

摘要翻译： 具有栅格组件的离子注入系统。 该系统包括构造成在等离子体区域中提供等离子体的等离子体源; 第一格栅板，其具有多个孔，其被配置为允许来自等离子体区域的离子通过，其中所述第一格栅板被配置为被电源偏置; 第二格栅板，其具有多个孔，其构造成允许离子穿过第一栅格板之后的离子通过，其中第二栅格板被配置为被电源偏置; 以及衬底保持器，其被配置为在所述离子通过所述第二栅格板之后将所述衬底支撑在所述衬底被注入的位置处的所述离子。

公开(公告)号：US20140170795A1

公开(公告)日：2014-06-19

申请号：US14135519

申请日：2013-12-19

申请人： Intevac, Inc.

发明人： Vinay Prabhakar ,  Babak Adibi

IPC分类号： H01L31/18

CPC分类号： H01L31/0516 ,  H01J37/32412 ,  H01J37/32422 ,  H01J37/32623 ,  H01J2237/20 ,  H01J2237/3365 ,  H01L21/266 ,  H01L21/426 ,  H01L31/0682 ,  H01L31/1804 ,  H01L31/188 ,  Y02E10/50 ,  Y02E10/547 ,  Y02P70/521

摘要： A grid for minimizing effects of ion divergence in plasma ion implant. The plasma grid is made of a flat plate having a plurality of holes, wherein the holes are arranged in a plurality of rows and a plurality of columns thereby forming beamlets of ions that diverge in one direction. A mask is used to form the implanted shapes on the wafer, wherein the holes in the mask are oriented orthogonally to the direction of beamlet divergence.

摘要翻译： 用于最小化离子发散在等离子体离子注入中的网格。 等离子体格栅由具有多个孔的平板制成，其中孔布置成多行和多个列，从而形成沿一个方向发散的离子束。 掩模用于在晶片上形成植入的形状，其中掩模中的孔与子束发散的方向垂直。

公开(公告)号：US20130276978A1

公开(公告)日：2013-10-24

申请号：US13866856

申请日：2013-04-19

申请人： INTEVAC, INC.

发明人： Terry Bluck ,  Ian Latchford ,  Vinay Shah ,  Alex Riposan

IPC分类号： H01L31/18

CPC分类号： H01L31/1892 ,  C23C14/042 ,  C23C14/50 ,  C23C16/042 ,  C23C16/4585 ,  H01L21/6734 ,  H01L21/67346 ,  H01L31/18

摘要： An arrangement for supporting substrates during processing, having a wafer carrier with a susceptor for supporting the substrate and confining the substrate to predetermined position. An inner mask is configured for placing on top of the substrate, the inner mask having an opening pattern to mask unprocessed parts of the substrate, but expose remaining parts of the substrate for processing. An outer mask is configured for placing on top of the inner mask, the outer mask having an opening that exposes the part of the inner mask having the opening pattern, but cover the periphery of the inner mask.

摘要翻译： 一种用于在加工过程中支撑基板的装置，具有带有用于支撑基板并将基板限制在预定位置的基座的晶片载体。 内部掩模被配置为放置在基板的顶部上，内部掩模具有开口图案以掩蔽基板的未处理部分，但是暴露基板的剩余部分以进行处理。 外掩模被配置为放置在内掩模的顶部上，外掩模具有露出具有开口图案的内掩模的一部分，但覆盖内掩模的周边的开口。

公开(公告)号：US20130149075A1

公开(公告)日：2013-06-13

申请号：US13708751

申请日：2012-12-07

申请人： INTEVAC, INC.

发明人： Vinay Shah ,  William Runstadler, JR. ,  Kevin P. Fairbairn ,  Terry Bluck ,  Richard Henry Cooke

IPC分类号： H01L21/677

CPC分类号： H01L21/67736 ,  H01L21/67126 ,  H01L21/67201 ,  H01L21/67271 ,  H01L21/67288

摘要： A system for transporting substrates from an atmospheric pressure to high vacuum pressure and comprising: a rough vacuum chamber having an entry valve and an exit opening; a high vacuum chamber having an entry opening, the high vacuum chamber coupled to the rough vacuum chamber such that the exit opening and the entry opening are aligned; a valve situated between the exit opening and the entry opening; a first conveyor belt provided in the rough vacuum chamber; a second conveyor provided in the high vacuum chamber; a sensing element provided in the high vacuum chamber to enable detection of broken substrates on the second conveyor; and, a mechanism provided on the second conveyor belt enabling dumping of broken substrates onto the bottom of the high vacuum chamber.

摘要翻译： 一种用于将基板从大气压输送到高真空压力的系统，包括：具有入口阀和出口的粗真空室; 具有进入开口的高真空室，所述高真空室联接到所述粗真空室，使得所述出口和入口开口对齐; 位于出口和入口之间的阀; 设置在粗糙真空室中的第一传送带; 设置在高真空室中的第二传送器; 设置在所述高真空室中以便能够检测所述第二输送机上的破裂的基板的感测元件; 以及设置在第二传送带上的机构，其能够将破碎的基板倾倒到高真空室的底部上。

公开(公告)号：US20130115764A1

公开(公告)日：2013-05-09

申请号：US13672652

申请日：2012-11-08

申请人： Intevac, Inc.

发明人： Terry Pederson ,  Henry Hieslmair ,  Moon Chun ,  Vinay Prabhakar ,  Babak Adibi ,  Terry Bluck

IPC分类号： H01L21/677 ,  H01L21/265

CPC分类号： H01L21/6833 ,  H01L21/26506 ,  H01L21/67745 ,  H01L21/6776 ,  H01L21/681 ,  H01L21/6831 ,  H01L31/1876 ,  H02N13/00 ,  Y02E10/50 ,  Y02P70/521

摘要： A system for processing substrates has a vacuum enclosure and a processing chamber situated to process wafers in a processing zone inside the vacuum enclosure. Two rail assemblies are provided, one on each side of the processing zone. Two chuck arrays ride, each on one of the rail assemblies, such that each is cantilevered on one rail assemblies and support a plurality of chucks. The rail assemblies are coupled to an elevation mechanism that places the rails in upper position for processing and at lower position for returning the chuck assemblies for loading new wafers. A pickup head assembly loads wafers from a conveyor onto the chuck assemblies. The pickup head has plurality of electrostatic chucks that pick up the wafers from the front side of the wafers. Cooling channels in the processing chucks are used to create air cushion to assist in aligning the wafers when delivered by the pickup head.

摘要翻译： 用于处理衬底的系统具有真空外壳和位于处理真空外壳内的处理区中的晶片的处理室。 提供两个轨道组件，一个在处理区域的每一侧。 两个卡盘阵列，每个在一个导轨组件上，使得每个卡盘阵列悬挂在一个导轨组件上并支撑多个卡盘。 轨道组件联接到升降机构，其将轨道放置在用于处理的上部位置，并且在较低位置处返回用于装载新晶片的卡盘组件。 拾取头组件将晶片从传送器装载到卡盘组件上。 拾取头具有从晶片的前侧拾取晶片的多个静电卡盘。 处理卡盘中的冷却通道用于产生气垫，以在由拾取头传送时帮助对准晶片。

公开(公告)号：US20040169248A1

公开(公告)日：2004-09-02

申请号：US10795040

申请日：2004-03-05

申请人： INTEVAC, INC.

发明人： Kenneth A. Costello ,  Kevin P. Fairbairn ,  David W. Brown ,  Yun Chung ,  Patricia Gober ,  Edward Yin

IPC分类号： H01L021/00

CPC分类号： H01J31/26 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14629 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14643

摘要： Backthinning in an area selective manner is applied to imaging sensors 12 for use in electron bombarded devices. A further arrangement results in an array of collimators 51 aligned with pixels 42 or groups of pixels providing improved image contrast of such image sensor. Provision of a thin P-doped layer 52 on the illuminated rear surface provides both a diffusion barrier resulting in improved resolution and a functional shield for reference pixels. A gradient in concentration of P-doped layer 52 optimizes electron collection at the pixel array.

摘要翻译： 以区域选择性的方式进行反向应用于用于电子轰击装置的成像传感器12。 进一步的布置导致准直器51的阵列与像素42或像素组对齐，从而提供这种图像传感器的改善的图像对比度。 在照明的后表面上提供薄的P掺杂层52提供了扩散屏障，从而提供改进的分辨率和用于参考像素的功能屏蔽。 P掺杂层52的浓度梯度优化了像素阵列处的电子收集。