CRYSTAL GROWTH USING NON-THERMAL ATMOSPHERIC PRESSURE PLASMAS
    51.
    发明申请
    CRYSTAL GROWTH USING NON-THERMAL ATMOSPHERIC PRESSURE PLASMAS 审中-公开
    使用非热大气压力等级的水晶生长

    公开(公告)号:US20130183225A1

    公开(公告)日:2013-07-18

    申请号:US13744854

    申请日:2013-01-18

    CPC classification number: C30B30/02 C30B9/00 C30B29/403

    Abstract: A method and apparatus for bulk crystal growth using non-thermal atmospheric pressure plasmas. This method and apparatus pertains to growth of any compound crystal involving one or more crystal components in a liquid phase (also known as the melt or solution), in communication with a non-thermal atmospheric pressure plasma source comprised of one or more other crystal components.

    Abstract translation: 使用非热大气压等离子体的体晶生长的方法和装置。 该方法和装置涉及包含一种或多种在液相(也称为熔体或溶液)中的一种或多种晶体组分的化合物晶体与包含一种或多种其它晶体组分的非热大气压等离子体源的连通 。

    SELECTIVE DRY ETCHING OF N-FACE (Al,In,Ga)N HETEROSTRUCTURES
    52.
    发明申请
    SELECTIVE DRY ETCHING OF N-FACE (Al,In,Ga)N HETEROSTRUCTURES 审中-公开
    选择性干燥N面(Al,In,Ga)N异构体的干蚀刻

    公开(公告)号:US20130099277A1

    公开(公告)日:2013-04-25

    申请号:US13660782

    申请日:2012-10-25

    CPC classification number: H01L21/30621 H01L29/2003 H01L33/007 H01L33/0079

    Abstract: A method of selective dry etching of N-face (Al,In,Ga)N heterostructures through the incorporation of an etch-stop layer into the structure, and a controlled, highly selective, etch process. Specifically, the method includes: (1) the incorporation of an easily formed, compatible etch-stop layer in the growth of the device structure, (2) the use of a laser-lift off or similar process to decouple the active layer from the original growth substrate, and (3) the achievement of etch selectivity higher than 14:1 on N-face (Al,In,Ga)N.

    Abstract translation: 通过将蚀刻停止层结合到结构中以及受控的高选择性蚀刻工艺,选择性地干蚀刻N面(Al,In,Ga)N异质结构的方法。 具体地说,该方法包括:(1)在器件结构的生长中结合容易形成的兼容的蚀刻停止层,(2)使用激光剥离或类似工艺来将活性层与 原始生长衬底,和(3)在N面(Al,In,Ga)N上实现高于14:1的蚀刻选择性。

Patent Agency Ranking