利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

217 条记录 (耗时 0.044 秒)

    Circuitized substrate with internal cooling structure and electrical assembly utilizing same
    53.
    发明授权
    Circuitized substrate with internal cooling structure and electrical assembly utilizing same 失效
    具有内部冷却结构的电路化基板和利用其的电气组件

    公开(公告)号：US07738249B2

    公开(公告)日：2010-06-15

    申请号：US11976468

    申请日：2007-10-25

    申请人： Benson Chan ,  Frank D. Egitto ,  How T. Lin ,  Roy H. Magnuson ,  Voya R. Markovich ,  David L. Thomas

    发明人： Benson Chan ,  Frank D. Egitto ,  How T. Lin ,  Roy H. Magnuson ,  Voya R. Markovich ,  David L. Thomas

    IPC分类号： H05K7/20

    CPC分类号： H05K1/0206 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K3/0061 ,  H05K3/44 ,  H05K2201/064 ,  H05K2201/09745 ,  H05K2201/10674 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T428/24917 ,  H01L2924/00

    摘要： An electrical assembly which includes a circuitized substrate including a first plurality of dielectric and electrically conductive circuit layers alternatively oriented in a stacked orientation, a thermal cooling structure bonded to one of the dielectric layers and at least one electrical component mounted on the circuitized substrate. The circuitized substrate includes a plurality of electrically conductive and thermally conductive thru-holes located therein, selected ones of the thermally conductive thru-holes thermally coupled to the electrical component(s) and extending through the first plurality of dielectric and electrically conductive circuit layers and being thermally coupled to the thermal cooling structure, each of these selected ones of thermally conductive thru-holes providing a thermal path from the electrical component to the thermal cooling structure during assembly operation. The thermal cooling structure is adapted for having cooling fluid pass there-through during operation of the assembly. A method of making the substrate is also provided.

    摘要翻译： 一种电气组件，其包括电路化衬底，其包括以层叠取向交替取向的第一多个电介质和导电电路层，结合到所述电介质层之一的热冷结构和安装在所述电路化衬底上的至少一个电气部件。 电路化衬底包括位于其中的多个导电和导热通孔，选择的导热通孔热耦合到电气部件并延伸穿过第一多个电介质和导电电路层，并且 热耦合到热冷却结构，这些选择的导热通孔中的每一个在组装操作期间提供从电气部件到热冷却结构的热路径。 热冷却结构适于在组件的操作期间使冷却流体通过。 还提供了制造基板的方法。

    Method of forming filled blind vias
    58.
    发明授权
    Method of forming filled blind vias 有权
    形成填充盲孔的方法

    公开(公告)号：US06924224B2

    公开(公告)日：2005-08-02

    申请号：US10729174

    申请日：2003-12-05

    申请人： Frank D. Egitto ,  Elizabeth Foster ,  Raymond T. Galasco ,  Voya R. Markovich ,  Manh-Quan Tam Nguyen

    发明人： Frank D. Egitto ,  Elizabeth Foster ,  Raymond T. Galasco ,  Voya R. Markovich ,  Manh-Quan Tam Nguyen

    IPC分类号： H01L21/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/46 ,  H01L21/4762 ,  H01L21/44

    CPC分类号： H05K1/115 ,  H01L21/486 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2203/0733 ,  H01L2924/00

    摘要： The density of electronic packaging and the electrical reliability of the sub-assemblies utilizing stacked blind vias are improved by providing a blind, landless via in a first dielectric layer laminated to a conductive metal core serving as a ground plane or a power plane. A hole is provided through the dielectric layer extending to the core. A metal, such as copper, is deposited electrolytically using the metal core as the cathode, or electrolessly without seeding into the hole. The metal is deposited on the core and progressively builds in the hole to the depth required for the via. A second dielectric layer is laminated to the first, and is provided with a second layer blind via aligned with the first via. This second via may be formed by conventional plating techniques. Multiple dielectric layers with stacked blind vias can be assembled in this manner.

    摘要翻译： 通过在层叠到用作接地平面或电源平面的导电金属芯的第一电介质层中提供盲目的无地通孔来改善电子封装的密度和利用堆叠盲孔的子组件的电可靠性。 通过延伸到芯的电介质层提供孔。 使用金属芯作为阴极电解沉积诸如铜的金属，或者化学镀而不接合到孔中。 金属沉积在芯上并逐渐建立在孔中以达到通孔所需的深度。 第二电介质层被层压到第一电介质层，并且具有与第一通孔对准的第二层盲孔。 该第二通孔可以由常规电镀技术形成。 可以以这种方式组装具有堆叠的盲孔的多个电介质层。

    MODULAR, DETACHABLE COMPUTE LEAF FOR USE WITH COMPUTING SYSTEM
    60.
    发明申请
    MODULAR, DETACHABLE COMPUTE LEAF FOR USE WITH COMPUTING SYSTEM 审中-公开
    具有计算机系统的模块化，可分离的计算机叶片

    公开(公告)号：US20120260063A1

    公开(公告)日：2012-10-11

    申请号：US13082599

    申请日：2011-04-08

    申请人： Voya R. Markovich ,  How T. Lin ,  Benson Chan ,  Frank D. Egitto

    发明人： Voya R. Markovich ,  How T. Lin ,  Benson Chan ,  Frank D. Egitto

    IPC分类号： G06F15/76 ,  G06F9/02

    CPC分类号： H05K3/365 ,  H01L2924/0002 ,  H05K1/148 ,  H05K2201/047 ,  H05K2201/10159 ,  H05K2201/209 ,  H01L2924/00

    摘要： A detachable, logic leaf module having dendritic projections on a surface is connected to a recessed area on the surface of a cluster interface board. The projections are used for electrically connecting the logic module device to the cluster interface board or the like, the projections on the surface of the logic leaf being flexibly and conductively wired to the receiving area on the surface of the cluster interface board. The logic leaf connector is removable without the need for solder softening thermal cycles or special tools, and permits the simple removal or replacement of an individual leaf at any time.

    摘要翻译： 在表面上具有树状突起的可拆卸的逻辑叶片模块连接到集群接口板的表面上的凹陷区域。 突起用于将逻辑模块设备电连接到集群接口板等，逻辑叶片的表面上的突起被灵活地和导电地连接到集群接口板的表面上的接收区域。 逻辑叶片连接器是可移动的，不需要焊料软化热循环或特殊工具，并且允许在任何时间简单地移除或更换单个叶片。