公开(公告)号：US6150614A

公开(公告)日：2000-11-21

申请号：US125183

申请日：1998-08-12

Applicant: Bernhard Miller ,  Friedbert Roether ,  Norbert Schneider

Inventor： Bernhard Miller ,  Friedbert Roether ,  Norbert Schneider

IPC: H05K1/02 ,  H05K1/00 ,  H05K1/11 ,  H05K1/14 ,  H05K3/00 ,  H05K3/34

CPC classification number: H05K1/118 ,  H05K1/0215 ,  H05K1/0281 ,  H05K2201/0715 ,  H05K2201/09063 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/2009 ,  H05K2201/2045 ,  H05K3/0058 ,  H05K3/3447

Abstract: In a conductor foil for conductively connecting electrical and/or electronic components, the conductor foil including printed circuit traces, insulated to the outside and applied on a non-conductive, elastically malleable carrier foil. The conductive foil also includes soldering surfaces connected to the printed circuit traces, for soldering to electric terminals of components, in addition, the conductor foil includes feed line segments through which the printed circuit traces are led to the soldering surfaces, in order, in response to shaking stresses, to avoid damage to the soldering points by vibrations transmitted by the feed line segments. Furthermore, the conductor foil has stiffening segments branching off from the feed line segments, the stiffening segments, in response to shaking stresses, causing a force diversion of the vibrations onto the stiffening segments via the feed line segment movable end, which is not connected to the soldering surfaces.

Abstract translation: PCT No.PCT / DE97 / 01995 Sec。 371日期1998年8月12日 102（e）1998年8月12日PCT PCT 1997年9月9日PCT公布。 WO98 / 28956 PCT公开号 日期1998年7月2日在用于导电连接电气和/或电子部件的导体箔中，导体箔包括印刷电路迹线，绝缘到外部并施加在不导电的，弹性可延展的载体箔上。 导电箔还包括连接到印刷电路迹线的焊接表面，用于焊接到部件的电端子，此外，导体箔包括馈送线段，印刷电路迹线通过引线段引导到焊接表面，以响应 振动应力，以避免由馈电线段传播的振动损坏焊接点。 此外，导体箔具有从进料线段分支出的加强段，加强段响应于振动应力，引起通过馈送线段可移动端将振动转移到加强段上的力，其不连接到 焊接面。

公开(公告)号：US6012223A

公开(公告)日：2000-01-11

申请号：US127290

申请日：1998-07-31

Applicant: Lee R. Hinze

Inventor： Lee R. Hinze

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K3/306 ,  H05K3/305 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/10568 ,  H05K2201/10977 ,  H05K2201/2036 ,  H05K2201/2045 ,  H05K2203/1327 ,  H05K3/3447 ,  Y02P70/613 ,  Y10T29/49139 ,  Y10T29/49149

Abstract: A process for mounting a surface-mount component(12), such as a stick-leaded device, to a circuit board (10) having a pair of plated through-holes and at least one additional through-hole (20), each of which extends through the circuit board (10). The leads (16) of the component (12) are then inserted into the plated through-holes so as to position the component (12) on a first side of the circuit board (10), after which a material (14) is applied to the second (opposite) side of the circuit board (10) so that the material (14) flows through the second through-hole (20), contacts the component (12), and bonds the component (12) to the first side of the circuit board (10). For this purpose, the material (14) preferably contacts the entire surface (18) of the component (12) facing a near surface region of the circuit board (10) and bonds the component surface (18) to the surface region.

Abstract translation: 一种用于将诸如棒状引线器件的表面安装部件（12）安装到具有一对电镀通孔和至少一个附加通孔（20）的电路板（10）的方法，每个通孔 其延伸穿过电路板（10）。 然后将组件（12）的引线（16）插入电镀通孔中，以将部件（12）定位在电路板（10）的第一侧上，之后施加材料（14） 到所述电路板（10）的第二（相对）侧，使得所述材料（14）流过所述第二通孔（20），与所述部件（12）接触，并将所述部件（12）与所述第一侧 的电路板（10）。 为此，材料（14）优选地接触面向电路板（10）的近表面区域的部件（12）的整个表面（18）并且将部件表面（18）粘合到表面区域。

公开(公告)号：US5955176A

公开(公告)日：1999-09-21

申请号：US972100

申请日：1997-11-17

Applicant: A. David Erpelding ,  Darrell D. Palmer ,  Surya Pattanaik ,  Oscar J. Ruiz

Inventor： A. David Erpelding ,  Darrell D. Palmer ,  Surya Pattanaik ,  Oscar J. Ruiz

IPC: G11B21/16 ,  H05K1/05 ,  H05K1/09 ,  B32B3/14 ,  B32B15/08 ,  B32B15/18 ,  B32B15/20

CPC classification number: H05K1/09 ,  G11B21/16 ,  H05K1/056 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/09781 ,  H05K2201/2045 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/26 ,  Y10T428/265 ,  Y10T428/266 ,  Y10T428/269 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: A slider suspension system for use in a magnetic recording disk file comprised of a laminated suspension positioned between an actuator arm and a read/write slider. The laminated suspension is comprised of a conductor layer, a dielectric layer and a support layer. The conductor layer is comprised of a high strength conductive copper alloy selected from the group consisting of Cu--Ni--Si--Mg alloy, Be--Cu--Ni alloy, and Cu--Ti alloy, wherein the conductive layer has a thickness less than or equal to eighteen microns. The dielectric layer is comprised of an electrically insulating material such as a polyimide. The support layer is comprised of a rigid material such as stainless steel.

Abstract translation: 一种用于磁记录盘文件的滑块悬挂系统，包括位于致动器臂和读/写滑块之间的层叠悬架。 层压悬浮液由导体层，电介质层和支撑层构成。 导体层由选自Cu-Ni-Si-Mg合金，Be-Cu-Ni合金和Cu-Ti合金的高强度导电铜合金构成，其中导电层的厚度小于或等于 等于十八微米。 介电层由电绝缘材料如聚酰亚胺组成。 支撑层由诸如不锈钢的刚性材料组成。

公开(公告)号：US5426568A

公开(公告)日：1995-06-20

申请号：US171473

申请日：1993-12-23

Applicant: Johannes Lamers ,  Norbert von der Lippe ,  Peter Sommer ,  Dietmar Stoffels

Inventor： Johannes Lamers ,  Norbert von der Lippe ,  Peter Sommer ,  Dietmar Stoffels

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H05K3/28 ,  H05K3/30 ,  H05K7/02 ,  H05K1/00 ,  H05K1/11

CPC classification number: H05K3/303 ,  H05K1/0271 ,  H05K3/0058 ,  H05K1/036 ,  H05K2201/0133 ,  H05K2201/0195 ,  H05K2201/09872 ,  H05K2201/10727 ,  H05K2201/2045 ,  H05K3/284 ,  H05K3/305 ,  Y02P70/613

Abstract: A launch-protected electronic assembly including a printed circuit board having several conductor paths. An electronic component is provided that is secured to the printed circuit board. The electronic component has several electrical connections each contacting a corresponding conductor path. The assembly further includes a support and at least one of a flexible adhesive layer and a dot-shaped flexible adhesive location connecting the printed circuit board to the support.

Abstract translation: 发射保护的电子组件，其包括具有多个导体路径的印刷电路板。 提供固定到印刷电路板的电子部件。 电子部件具有多个电连接，每个接触相应的导体路径。 组件还包括支撑件和将印刷电路板连接到支撑件的柔性粘合剂层和点状柔性粘合剂位置中的至少一个。

公开(公告)号：US4053943A

公开(公告)日：1977-10-11

申请号：US651654

申请日：1976-01-22

Applicant: Lee Robert Galvin

Inventor： Lee Robert Galvin

IPC: H05K1/02 ,  H05K1/18 ,  H05K7/00

CPC classification number: H05K7/00 ,  H05K1/0271 ,  H05K1/18 ,  H05K2201/0133 ,  H05K2201/2009 ,  H05K2201/2045

Abstract: A vibration damping system for a printed circuit board in which laminated damping elements are remotely positioned from the printed circuit board.The laminated damping elements are connected to the printed circuit board by post structural means fastened rigidly at each end to the printed circuit board and to the laminated damping element, respectively, for the purpose of transferring vibration energy from the printed circuit board to the damping element. The laminated damping elements comprise a high hysteresis bonding agent for bonding the laminate and for absorbing the vibration energy. The high hysteresis bonding agent is stressed in a shear mode for greatest energy absorption efficiency.

Abstract translation: 一种用于印刷电路板的振动阻尼系统，其中层压阻尼元件远离印刷电路板定位。

公开(公告)号：US3007997A

公开(公告)日：1961-11-07

申请号：US74602658

申请日：1958-07-01

Applicant: GEN ELECTRIC

Inventor： PANARITI VIKTOR M

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H05K3/34

CPC classification number: H05K1/036 ,  H05K1/0271 ,  H05K3/0058 ,  H05K3/3447 ,  H05K2201/0133 ,  H05K2201/096 ,  H05K2201/2045 ,  Y10T29/49142 ,  Y10T428/24322

公开(公告)号：US20190244755A1

公开(公告)日：2019-08-08

申请号：US16240860

申请日：2019-01-07

Applicant: AVX Corporation

Inventor： Andrew P. Ritter ,  Carl L. Eggerding

IPC: H01G2/06 ,  H01G4/232 ,  H01G4/224 ,  H01G4/30 ,  H05K3/34

CPC classification number: H01G2/065 ,  H01G4/12 ,  H01G4/224 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/613 ,  Y10T29/51

Abstract: Relatively low noise capacitors are provided for surface mounted applications. Electro-mechanical vibrations generate audible noise, which are otherwise relatively reduced through modifications to MLCC device structures, and/or their mounting interfaces on substrates such as printed circuit boards (PCBs). Different embodiments variously make use of flexible termination compliance so that surface mounting has reduced amplitude vibrations transmitted to the PCB. In other instances, side terminal and transposer embodiments effectively reduce the size of the mounting pads relative to the case of the capacitor, or a molded enclosure provides standoff, termination compliance and clamping of vibrations.

公开(公告)号：US20180268996A1

公开(公告)日：2018-09-20

申请号：US15724047

申请日：2017-10-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Young NA

IPC: H01G4/01 ,  H01G2/06 ,  H01G4/232 ,  H01G4/30 ,  H05K1/18 ,  H05K3/34

CPC classification number: H01G4/01 ,  H01G2/06 ,  H01G4/232 ,  H01G4/30 ,  H05K1/181 ,  H05K3/301 ,  H05K3/303 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10946 ,  H05K2201/2045

Abstract: An electronic component, a board having the same, and a method of manufacturing a metal frame for the electronic component. The electronic component includes a multilayer ceramic capacitor including a plurality of external electrodes formed on opposing surfaces of a capacitor body, respectively; and metal frames bonded to the external electrodes, respectively, wherein each of the metal frames includes an inner support portion, an outer support portion disposed on an outer surface of the inner support portion, and a connecting portion connecting portions of the inner support portion and the outer support portion to each other.

公开(公告)号：US20180263121A1

公开(公告)日：2018-09-13

申请号：US15913094

申请日：2018-03-06

Applicant: BorgWarner Ludwigsburg GmbH

Inventor： Sisay Tadele ,  Helmut Hoppe ,  Alexander Dauth ,  Gerd Bräuchle

IPC: H05K3/30

CPC classification number: H05K3/306 ,  H01G2/06 ,  H01G2/106 ,  H01G9/06 ,  H01G9/08 ,  H01G9/26 ,  H05K1/18 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/09027 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10265 ,  H05K2201/10272 ,  H05K2201/10522 ,  H05K2201/10606 ,  H05K2201/10628 ,  H05K2201/10651 ,  H05K2201/10901 ,  H05K2201/2018 ,  H05K2201/2045

Abstract: What is described is a mounting aid for mounting electrical components, in particular electrolytic capacitors or chokes, on a printed circuit board, said mounting aid comprising a body, which has compartments for receiving the electrical components, wherein the compartments have a base with openings for the insertion of connection wires of the electrical components, and metal parts fastened to the body, which metal parts each form at least one contact pin on the underside of the body and each from a busbar for connection to electrical components in a plurality of compartments of the body.

公开(公告)号：US20180197682A1

公开(公告)日：2018-07-12

申请号：US15832903

申请日：2017-12-06

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadateru YAMADA ,  Kazuo HATTORI ,  Isamu FUJIMOTO

IPC: H01G4/30 ,  H01G2/06 ,  H01G4/232 ,  H01G4/12 ,  H01G4/005

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/005 ,  H01G4/12 ,  H01G4/224 ,  H01G4/232 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/2045

Abstract: A multilayer ceramic capacitor includes a stacked body and first and second external electrodes. When a dimension of the stacked body in a length direction is L0, a dimension of the stacked body in a width direction is W0, a dimension of the stacked body in a stacking direction is T0, a dimension of the first outer layer portion in the stacking direction is T1, a dimension of the second outer layer portion in the stacking direction is T2, a dimension of the first side margin in the width direction is W1, a dimension of the second side margin in the width direction is W2, a dimension of the first end margin in the length direction is L1, and a dimension of the second end margin in the length direction is L2, conditions of (L1+L2)/L0>(W1+W2)/W0 and (L1+L2)/L0>(T1+T2)/T0 are satisfied, and a condition of 0.244≤(L1+L2)/L0≤0.348 is satisfied.