公开(公告)号：US20100015362A1

公开(公告)日：2010-01-21

申请号：US12505560

申请日：2009-07-20

申请人： Joo-Han LEE ,  Dong-Chun LEE ,  Yong-Hyun KIM ,  Seong-Chan Han

发明人： Joo-Han LEE ,  Dong-Chun LEE ,  Yong-Hyun KIM ,  Seong-Chan Han

IPC分类号： B05D1/18

CPC分类号： H05K3/244 ,  C23C18/1673 ,  C23C18/32 ,  C23C18/42 ,  H05K2203/072 ,  H05K2203/104

摘要： An apparatus for electroless plating includes a plating bath containing an aqueous metal salt solution, and a magnetic field generator for generating a magnetic field. An object to be plated is immersed in the solution. The magnetic field generated by the magnetic field generator increases the level at which the metal ions are attracted to a surface of the object. Therefore, a layer of plating of good quality may be formed at a rapid rate.

摘要翻译： 无电镀装置包括含有金属盐水溶液的电镀液和用于产生磁场的磁场发生器。 将待镀物体浸入溶液中。 由磁场发生器产生的磁场增加金属离子被吸引到物体表面的水平。 因此，可以以快速的速度形成质量好的电镀层。

公开(公告)号：US20090257209A1

公开(公告)日：2009-10-15

申请号：US12385575

申请日：2009-04-13

申请人： Seong-Chan Han ,  Jin-Kyu Yang ,  Dong-Chun Lee ,  Kwang-Ho Chun

发明人： Seong-Chan Han ,  Jin-Kyu Yang ,  Dong-Chun Lee ,  Kwang-Ho Chun

IPC分类号： H01R9/00 ,  H01R12/04

CPC分类号： H05K1/112 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K3/429 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09572 ,  H05K2201/10666 ,  H05K2203/0455 ,  Y02P70/613

摘要： A semiconductor package and associated methods, the semiconductor package including a substrate including a socket, and connection terminals including a solder ball and a supporting portion extending from the solder ball into the socket.

摘要翻译： 一种半导体封装和相关方法，所述半导体封装包括包括插座的衬底以及包括焊球和从所述焊球延伸到所述插座中的支撑部分的连接端子。

公开(公告)号：US20080044951A1

公开(公告)日：2008-02-21

申请号：US11812145

申请日：2007-06-15

申请人： Hyo-jae Bang ,  Dong-chun Lee ,  Seong-chan Han ,  Chang-yong Park ,  Hun Han

发明人： Hyo-jae Bang ,  Dong-chun Lee ,  Seong-chan Han ,  Chang-yong Park ,  Hun Han

IPC分类号： H01L23/52 ,  H01L21/00

CPC分类号： H01L21/563 ,  H01L24/10 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor package may include a substrate having external contact terminals. A semiconductor chip having bonding pads may be formed on the substrate. Conductive bumps may connect the external contact terminals of the substrate to the bonding pads of the semiconductor chip. An underfill may be interposed between the substrate and the semiconductor chip. The underfill may include a first underfill region composed of a first material adjacent to the semiconductor chip and a second underfill region composed of a second material adjacent to the substrate, the first material having a higher glass transition temperature than the second material.

摘要翻译： 半导体封装可以包括具有外部接触端子的衬底。 具有接合焊盘的半导体芯片可以形成在基板上。 导电凸块可以将衬底的外部接触端子连接到半导体芯片的接合焊盘。 可以在基板和半导体芯片之间插入底部填充物。 底部填充物可以包括由与半导体芯片相邻的第一材料组成的第一底部填充区域和由与基底相邻的第二材料构成的第二底部填充区域，第一材料具有比第二材料更高的玻璃化转变温度。

公开(公告)号：US20080023812A1

公开(公告)日：2008-01-31

申请号：US11878084

申请日：2007-07-20

申请人： Hyo-jae Bang ,  Dong-chun Lee ,  Seong-chan Han ,  Kyung-du Kim ,  Sun-kyu Hwang

发明人： Hyo-jae Bang ,  Dong-chun Lee ,  Seong-chan Han ,  Kyung-du Kim ,  Sun-kyu Hwang

IPC分类号： H01L23/488

CPC分类号： H01L23/13 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/0231 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： Example embodiments relate to a semiconductor package. The semiconductor package may include a mounting substrate, a semiconductor chip mounted to the mounting substrate, at least one passive component passing therethrough and mounted to the mounting substrate, and a cover covering the mounting substrate, the semiconductor chip and the at least one passive component.

摘要翻译： 示例实施例涉及半导体封装。 半导体封装可以包括安装基板，安装到安装基板的半导体芯片，穿过其中并安装到安装基板的至少一个无源部件，以及覆盖安装基板，半导体芯片和至少一个无源部件 。

公开(公告)号：US20070161224A1

公开(公告)日：2007-07-12

申请号：US11723086

申请日：2007-03-16

申请人： Chang-Yong Park ,  Byung-Man Kim ,  Dong-Chun Lee ,  Yong-Hyun Kim ,  Kwang-Seop Kim ,  Dong-Woo Shin ,  Kwang-Ho Chun

发明人： Chang-Yong Park ,  Byung-Man Kim ,  Dong-Chun Lee ,  Yong-Hyun Kim ,  Kwang-Seop Kim ,  Dong-Woo Shin ,  Kwang-Ho Chun

IPC分类号： H01L21/44

CPC分类号： H05K3/303 ,  H01L2224/13 ,  H01L2224/16225 ,  H05K3/3457 ,  H05K2201/09781 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/613

摘要： In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the board. Furthermore, at least one supporting solder bump is formed on one of the dummy pads and disposed under a portion of the semiconductor chip package. For example, the supporting solder bump may be disposed under a peripheral area of the semiconductor chip package.

公开(公告)号：US20070072467A1

公开(公告)日：2007-03-29

申请号：US11525971

申请日：2006-09-25

申请人： Young-Soo Lee ,  Dong-Chun Lee ,  Seong-Chan Han ,  Hyo-Jae Bang

发明人： Young-Soo Lee ,  Dong-Chun Lee ,  Seong-Chan Han ,  Hyo-Jae Bang

IPC分类号： H01R29/00

CPC分类号： G01R31/046

摘要： A method of testing a substrate may involve photographing a first chip on a first face of the substrate to obtain a first image of the first chip, and photographing a second chip on a second face of the substrate opposite to the first face without reversing the substrate to obtain a second image of the second chip. The normality of the first and the second chips may be determined based on the first and the second images.

摘要翻译： 测试衬底的方法可以涉及拍摄衬底的第一面上的第一芯片以获得第一芯片的第一图像，并且在与第一面相对的基板的第二面上拍摄第二芯片而不使基板反转 以获得第二芯片的第二图像。 可以基于第一和第二图像来确定第一和第二码片的正常性。

公开(公告)号：US20060231949A1

公开(公告)日：2006-10-19

申请号：US11246303

申请日：2005-10-11

申请人： Chang-Yong Park ,  Byung-Man Kim ,  Dong-Chun Lee ,  Yong-Hyun Kim ,  Kwang-Seop Kim ,  Dong-Woo Shin ,  Kwang-Ho Chun

发明人： Chang-Yong Park ,  Byung-Man Kim ,  Dong-Chun Lee ,  Yong-Hyun Kim ,  Kwang-Seop Kim ,  Dong-Woo Shin ,  Kwang-Ho Chun

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L23/49811 ,  H01L23/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1403 ,  H01L2224/141 ,  H01L2224/16 ,  H01L2224/81192 ,  H01L2924/00014 ,  H01L2924/01079 ,  H05K3/303 ,  H05K3/3457 ,  H05K2201/09781 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the board. Furthermore, at least one supporting solder bump is formed on one of the dummy pads and disposed under a portion of the semiconductor chip package. For example, the supporting solder bump may be disposed under a peripheral area of the semiconductor chip package.

摘要翻译： 在一个实施例中，半导体模块包括至少一个半导体芯片封装，具有功能焊盘和虚拟焊盘的板，以及将半导体芯片封装和板的功能焊盘之一电连接的至少一个焊点。 此外，在一个虚拟焊盘上形成至少一个支撑焊料凸块并且设置在半导体芯片封装的一部分之下。 例如，支撑焊料凸块可以设置在半导体芯片封装的外围区域的下方。

公开(公告)号：US07027638B2

公开(公告)日：2006-04-11

申请号：US09949111

申请日：2001-09-07

申请人： Chung-sam Jun ,  Sang-mun Chon ,  Hyoung-jin Kim ,  Dong-chun Lee ,  Sang-bong Choi ,  Sung-gon Ryu

发明人： Chung-sam Jun ,  Sang-mun Chon ,  Hyoung-jin Kim ,  Dong-chun Lee ,  Sang-bong Choi ,  Sung-gon Ryu

IPC分类号： G06K9/00

CPC分类号： G06T5/008 ,  G06T7/90 ,  G06T2207/20021 ,  G06T2207/30148

摘要： A method for correcting color variations on the surface of a wafer, a method for selectively detecting a defect from different patterns, and computer readable recording media for the same are provided. Color variations in images of different parts of a wafer can be corrected using the mean and standard deviation of grey level values for the pixels forming each of the different parts of the wafer. In addition, different threshold values are applied to metal interconnect patterns and spaces of the wafer so that a defect can be selectively detected from the different patterns. Thus, a bridge known as a fatal, or killing defect to a semiconductor device can be detected without also falsely detecting grains as fatal defects. Due to increased defect screening capacity of the methods, the defect detecting method can be further efficiently managed.

公开(公告)号：US06815236B2

公开(公告)日：2004-11-09

申请号：US10694882

申请日：2003-10-29

申请人： Tae-Kyoung Kim ,  Sun-Yong Choi ,  Chung-Sam Jun ,  Kwang-Soo Kim ,  Koung-Su Shin ,  Jeong-Hyun Choi ,  Dong-Chun Lee

发明人： Tae-Kyoung Kim ,  Sun-Yong Choi ,  Chung-Sam Jun ,  Kwang-Soo Kim ,  Koung-Su Shin ,  Jeong-Hyun Choi ,  Dong-Chun Lee

IPC分类号： H01L2166

CPC分类号： G01N21/3563 ,  G01N21/8422

摘要： A method of measuring a concentration of a material includes irradiating an infrared light onto a substrate having a layer including a first material and dopants, wherein the infrared light is partially absorbed by and partially transmitted through the substrate including the layer. Intensities of the infrared light absorbed in the first material and the dopants are computed according to light wave numbers by utilizing a difference between intensities of the infrared light before and after transmitting the substrate and layer and by utilizing a difference between intensities of the infrared light absorbed in the substrate and layer and absorbed in only the substrate. Concentrations of the dopants are obtained by utilizing a ratio of light wave number regions corresponding to predetermined intensities of infrared light absorbed in the dopants relative to light wave number regions corresponding to the predetermined intensity of infrared light absorbed in the first material.

公开(公告)号：US06687011B1

公开(公告)日：2004-02-03

申请号：US09469756

申请日：1999-12-22

申请人： Jung Ju Lee ,  San Hoon Kim ,  Dong Chun Lee ,  Il Bum Kwon

发明人： Jung Ju Lee ,  San Hoon Kim ,  Dong Chun Lee ,  Il Bum Kwon

IPC分类号： G01B902

CPC分类号： G01B11/161 ,  G01B2290/25 ,  G01D5/266 ,  G01D5/268 ,  G01K5/486 ,  G01K11/32 ,  G01K11/3206

摘要： A transmission-type extrinsic Fabry-Perot interferometric optical fiber sensor and a method used for integrity monitoring of structures and measuring strain and temperature are provided. The transmission-type extrinsic Fabry-Perot interferometric optical fiber sensor includes first single-mode optical fiber and second single-mode optical fiber, laser device, and optical detector. The first single-mode optical fiber is inserted into an end of a capillary quartz-glass tube and the second single-mode optical fiber is inserted into the other end of the capillary quartz-glass tube. Air gap is formed between the first single-mode optical fiber and the second single-mode optical fiber in the capillary quartz-glass tube. Gap length of the air gap changes in response to magnitude and direction of transformation of the capillary quartz-glass tube. The laser device launches light into an end of the first single-mode optical fiber. The end of the first single-mode optical fiber is not inserted into the capillary quartz-glass tube. The optical detector detects interferometric fringe of light. The light is launched from the laser device and passed through the first single-mode optical fiber, the air gap, and the second single-mode optical fiber. The number of occurrence of the interferometric fringe and trend of signal level are determined by change of the gap length.

摘要翻译： 提供了透射型外部法布里 - 珀罗干涉光纤传感器和用于结构的完整性监测和测量应变和温度的方法。 透射型外部法布里 - 珀罗干涉光纤传感器包括第一单模光纤和第二单模光纤，激光器件和光检测器。 将第一单模光纤插入毛细管石英玻璃管的一端，将第二单模光纤插入毛细管石英玻璃管的另一端。 在毛细管石英玻璃管中的第一单模光纤与第二单模光纤之间形成气隙。 气隙的间隙长度随着毛细管石英玻璃管的转变的大小和方向而变化。 激光装置将光线发射到第一单模光纤的一端。 第一单模光纤的末端未插入毛细管石英玻璃管中。 光学检测器检测干涉光线条纹。 光从激光装置发射并通过第一单模光纤，气隙和第二单模光纤。 干涉条纹的发生次数和信号电平的趋势由间隙长度的变化决定。