公开(公告)号：US6025258A

公开(公告)日：2000-02-15

申请号：US516284

申请日：1995-08-17

申请人： Masayuki Ochiai ,  Hidefumi Ueda ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Koki Otake ,  Junichi Kasai ,  Nobuo Kamehara ,  Yasuo Yamagishi ,  Masataka Mizukoshi

发明人： Masayuki Ochiai ,  Hidefumi Ueda ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Koki Otake ,  Junichi Kasai ,  Nobuo Kamehara ,  Yasuo Yamagishi ,  Masataka Mizukoshi

IPC分类号： B23K3/06 ,  H01L21/48 ,  H01L21/60 ,  H01L21/68 ,  H05K3/34 ,  H01L21/283

CPC分类号： H01L24/742 ,  B23K3/0623 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H05K3/3484 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/11002 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/016 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/087 ,  H05K2203/1105 ,  H05K2203/1157 ,  H05K2203/1476 ,  H05K3/3463 ,  H05K3/3489

摘要： A method for fabricating solder bumps onto a semiconductor chip. A solder ball forming member having a flat surface and a plurality of cavities arranged on the flat surface in a predetermined pattern is prepared. The cavities are then filled with a solder paste, and the solder ball forming member is heated to a temperature higher than the melting point of the solder so that the molten solder powder in the solder paste form solder balls due to surface tension. The semiconductor chip is then moved toward the solder ball forming member to transfer the heated solder balls from the solder ball forming member to the semiconductor chip.

摘要翻译： 一种用于在半导体芯片上制造焊料凸块的方法。 制备具有平坦表面的焊球形成构件和以预定图案布置在平坦表面上的多个空腔。 然后用焊膏填充空腔，并将焊球形成构件加热到高于焊料熔点的温度，使得焊膏中的熔融焊料粉由于表面张力而形成焊球。 然后将半导体芯片移动到焊球形成部件，以将加热的焊球从焊球形成部件转移到半导体芯片。

公开(公告)号：US5773313A

公开(公告)日：1998-06-30

申请号：US547616

申请日：1995-10-24

申请人： Mitsutaka Sato ,  Junichi Kasai

发明人： Mitsutaka Sato ,  Junichi Kasai

IPC分类号： H01L21/56 ,  H01L21/48 ,  H01L23/12 ,  H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H05K3/34 ,  H01L21/60

CPC分类号： H01L24/06 ,  H01L21/4835 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/4951 ,  H01L23/49537 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49555 ,  H01L24/05 ,  H05K3/3426 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/18165 ,  H01L2924/19107 ,  H05K2201/10689 ,  H05K2201/1084 ,  Y02P70/613 ,  Y10T29/49121

摘要： A semiconductor device includes a semiconductor chip (11) having a top surface and a bottom surface, a plurality of leads (14) arranged under the bottom surface of the semiconductor chip (11), where the leads (14) have first ends (14a) electrically coupled to the semiconductor chip (11) and second ends which form external terminals (16) and each of the external terminals have a bottom surface, and a package (17, 31) encapsulating the semiconductor chip (11) and the leads (14) so that the bottom surface of each of the external terminals (16) is exposed at a bottom surface (17a, 31a) of the package (17, 31) and remaining portions of the leads (14) are embedded within the package (17, 31), where the package (17, 31) has a size which is approximately the same as that of the semiconductor chip (11) in a plan view viewed from above the top surface of the semiconductor chip (11).

公开(公告)号：US5750421A

公开(公告)日：1998-05-12

申请号：US789625

申请日：1997-01-27

申请人： Junichi Kasai ,  Kazuto Tsuji ,  Norio Taniguchi ,  Takashi Mashiko ,  Masao Sakuma ,  Yukio Saigo ,  Yoshiyuki Yoneda ,  Masashi Takenaka

发明人： Junichi Kasai ,  Kazuto Tsuji ,  Norio Taniguchi ,  Takashi Mashiko ,  Masao Sakuma ,  Yukio Saigo ,  Yoshiyuki Yoneda ,  Masashi Takenaka

IPC分类号： G01R1/04 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/433 ,  H01L23/495 ,  H01L23/58 ,  H01L21/60

CPC分类号： G01R1/0433 ,  G01R1/04 ,  H01L21/565 ,  H01L21/6835 ,  H01L22/32 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49572 ,  H01L2221/68313 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3011

摘要： A semiconductor device including a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.

摘要翻译： 一种半导体器件，包括分别由内部引线和外部引线构成的多个引线，与内部引线电连接的半导体芯片，以及至少封装引线和半导体芯片的内部引线的封装， 引线从封装外部延伸。 该包装具有上部和下部，它们具有相互不同的尺寸，使得通过不同的尺寸在上部和下部之间形成阶梯部分，并且每个外部引线具有比其他部分宽的部分 外部引线仅在封装的阶梯部分内延伸到封装的外侧。

公开(公告)号：US5679978A

公开(公告)日：1997-10-21

申请号：US330848

申请日：1994-10-24

申请人： Toshimi Kawahara ,  Shinya Nakaseko ,  Mitsunada Osawa ,  Shinichirou Taniguchi ,  Mayumi Osumi ,  Hiroyuki Ishiguro ,  Yoshitugu Katoh ,  Junichi Kasai

发明人： Toshimi Kawahara ,  Shinya Nakaseko ,  Mitsunada Osawa ,  Shinichirou Taniguchi ,  Mayumi Osumi ,  Hiroyuki Ishiguro ,  Yoshitugu Katoh ,  Junichi Kasai

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  H01L23/24 ,  H01L23/31 ,  H01L23/498 ,  H01L23/10

CPC分类号： H01L21/568 ,  H01L21/4853 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/49 ,  H01L2224/11003 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/3011 ,  Y10T29/49146 ,  Y10T29/49171

摘要： A semiconductor device includes a substrate having top and bottom surfaces, a semiconductor element mounted on the top surface of the substrate, and a resin package made of a resin and encapsulating the semiconductor element. The substrate includes at least one resin gate hole enabling the resin to be introduced from the bottom surface of the substrate via the resin gate hole when encapsulating the semiconductor element by the resin.

摘要翻译： 半导体器件包括具有顶表面和底表面的衬底，安装在衬底的顶表面上的半导体元件和由树脂制成并封装半导体元件的树脂封装。 衬底包括至少一个树脂门孔，当通过树脂封装半导体元件时，能够通过树脂门孔从衬底的底表面引入树脂。

公开(公告)号：US5643831A

公开(公告)日：1997-07-01

申请号：US547532

申请日：1995-10-24

申请人： Masayuki Ochiai ,  Hidefumi Ueda ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Koki Otake ,  Junichi Kasai ,  Nobuo Kamehara ,  Yasuo Yamagishi ,  Masataka Mizukoshi ,  Yutaka Yamada ,  Susumu Abe

发明人： Masayuki Ochiai ,  Hidefumi Ueda ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Koki Otake ,  Junichi Kasai ,  Nobuo Kamehara ,  Yasuo Yamagishi ,  Masataka Mizukoshi ,  Yutaka Yamada ,  Susumu Abe

IPC分类号： B23K3/06 ,  H01L21/48 ,  H01L21/60 ,  H01L21/68 ,  H05K3/34 ,  H01L21/283

CPC分类号： H05K3/3484 ,  B23K3/0623 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/016 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/1476 ,  H05K3/3463 ,  H05K3/3489

摘要： A method for fabricating a semiconductor device using a solder ball forming plate having cavities. The plate is made from a silicon plate having a flat surface in a crystallographic plane, and an orientation flat in a crystallographic plane. The cavities are formed on the flat surface of the plate by etching, using a mask having openings in the shape of rhombus arranged such that one side of the rhombus is generally parallel to the crystallographic plane. As a result, the cavities having wedge-shaped bottom are formed. The cavities are then filled with a solder paste and are heated to form solder balls in the cavities while the plate in an inclined position. The solder balls are then transferred from the plate to a semiconductor chip.

摘要翻译： 一种使用具有空腔的焊球形成板制造半导体器件的方法。 该板由具有<110>结晶平面中的平坦表面的硅板制成，并且在<1-11>晶面中平行取向。 通过蚀刻在板的平坦表面上形成空腔，使用具有菱形形状的开口的掩模，其布置成使得菱形的一侧大致平行于<1-11>晶面。 结果，形成了具有楔形底部的空腔。 然后用焊膏填充空腔，并在板中处于倾斜位置的同时加热以在空腔中形成焊球。 然后将焊球从板转移到半导体芯片。

公开(公告)号：US5637923A

公开(公告)日：1997-06-10

申请号：US455909

申请日：1995-05-31

申请人： Junichi Kasai ,  Kazuto Tsuji ,  Norio Taniguchi ,  Takashi Mashiko ,  Masao Sakuma

发明人： Junichi Kasai ,  Kazuto Tsuji ,  Norio Taniguchi ,  Takashi Mashiko ,  Masao Sakuma

IPC分类号： G01R1/04 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/433 ,  H01L23/495 ,  H01L23/58 ,  H01L23/04

CPC分类号： G01R1/0433 ,  G01R1/04 ,  H01L21/565 ,  H01L21/6835 ,  H01L22/32 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49572 ,  H01L2221/68313 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3011

摘要： A semiconductor device including a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.

摘要翻译： 一种半导体器件，包括分别由内部引线和外部引线构成的多个引线，与内部引线电连接的半导体芯片，以及至少封装引线和半导体芯片的内部引线的封装， 引线从封装外部延伸。 该包装具有上部和下部，它们具有相互不同的尺寸，使得通过不同的尺寸在上部和下部之间形成阶梯部分，并且每个外部引线具有比其他部分宽的部分 外部引线仅在封装的阶梯部分内延伸到封装的外侧。

公开(公告)号：US5475259A

公开(公告)日：1995-12-12

申请号：US961161

申请日：1992-10-16

申请人： Junichi Kasai ,  Kazuto Tsuji ,  Norio Taniguchi ,  Takashi Mashiko ,  Masao Sakuma ,  Yukio Saigo ,  Yoshiyuki Yoneda ,  Masashi Takenaka

发明人： Junichi Kasai ,  Kazuto Tsuji ,  Norio Taniguchi ,  Takashi Mashiko ,  Masao Sakuma ,  Yukio Saigo ,  Yoshiyuki Yoneda ,  Masashi Takenaka

IPC分类号： G01R1/04 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/433 ,  H01L23/495 ,  H01L23/58 ,  H01L23/02 ,  H01L23/12 ,  H01L23/48 ,  H01L29/40

CPC分类号： G01R1/0433 ,  G01R1/04 ,  H01L21/565 ,  H01L21/6835 ,  H01L22/32 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49572 ,  H01L2221/68313 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3011

摘要： A semiconductor device comprises a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads of the leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.

摘要翻译： 半导体器件包括分别由内部引线和外部引线构成的多个引线，与引线的内部引线电连接的半导体芯片，以及至少封装引线和半导体芯片的内部引线的封装 外引线延伸到封装外面。 该包装具有上部和下部，它们具有相互不同的尺寸，使得通过不同的尺寸在上部和下部之间形成阶梯部分，并且每个外部引线具有比其他部分宽的部分 外部引线仅在封装的阶梯部分内延伸到封装的外侧。

公开(公告)号：US5463253A

公开(公告)日：1995-10-31

申请号：US246567

申请日：1994-05-20

申请人： Masaki Waki ,  Junichi Kasai ,  Tsuyoshi Aoki ,  Toshiyuki Honda ,  Hirotaka Sato

发明人： Masaki Waki ,  Junichi Kasai ,  Tsuyoshi Aoki ,  Toshiyuki Honda ,  Hirotaka Sato

IPC分类号： H01L23/495 ,  H01L23/28 ,  H01L23/16

CPC分类号： H01L23/49524 ,  H01L23/4951 ,  H01L23/49575 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/181

摘要： A semiconductor device includes lead frames (21) respectively having first main surfaces and second main surfaces opposite to each other, bonding being able to be performed on the first and second main surfaces, a first semiconductor chip (22) arranged on first main surface sides of the lead frames, first tape leads (23) electrically connecting the first main surfaces of the lead frames to the first semiconductor chip, a second semiconductor chip (24) arranged on second main surface sides of the lead frames, and second tape leads (25) electrically connecting the second main surfaces of the lead frames to the second semiconductor.

摘要翻译： PCT No.PCT / JP91 / 00348 Sec。 371日期：1991年11月14日 102（e）1991年11月14日PCT PCT 1991年3月14日PCT。 出版物WO91 / 14282 日期：1991年9月19日。半导体器件包括分别具有彼此相对的第一主表面和第二主表面的引线框架（21），能够在第一和第二主表面上进行接合的第一半导体芯片（22 ），布置在引线框架的第一主表面侧上的第一引线（23）将引线框架的第一主表面电连接到第一半导体芯片，第二半导体芯片（24）布置在引线的第二主表面侧上 框架和将引线框架的第二主表面电连接到第二半导体的第二带引线（25）。

公开(公告)号：US5424251A

公开(公告)日：1995-06-13

申请号：US120437

申请日：1993-09-14

申请人： Michio Sono ,  Junichi Kasai

发明人： Michio Sono ,  Junichi Kasai

IPC分类号： H01L23/36 ,  H01L21/56 ,  H01L23/31 ,  H01L23/373 ,  H01L21/60

CPC分类号： H01L23/3121 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/3737 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10T29/49121

摘要： A semiconductor device includes a stage having top and bottom surfaces, a semiconductor element which is mounted on the top surface of the stage, a package part which is made of a first resin and encapsulates the semiconductor element so that a surface of the package part and the bottom surface of the stage lie on substantially the same plane, and a radiation part which is made of a second resin and is provided directly on the bottom surface of the stage and the surface of the package part. The second resin includes a filler material selected from a group consisting of metal powders and insulator powders so that a thermal conduction of the second resin is greater than that of the first resin.

摘要翻译： 半导体器件包括具有顶表面和底表面的平台，安装在平台的顶表面上的半导体元件，由第一树脂制成并封装半导体元件的封装部分，使得封装部分的表面和 台的底面位于基本上相同的平面上，辐射部分由第二树脂制成，并且直接设置在舞台的底表面和包装部分的表面上。 第二树脂包括从由金属粉末和绝缘体粉末组成的组中选择的填充材料，使得第二树脂的导热大于第一树脂的热传导。

公开(公告)号：US5409866A

公开(公告)日：1995-04-25

申请号：US996589

申请日：1992-12-24

申请人： Mitsutaka Sato ,  Junichi Kasai ,  Masanori Yoshimoto ,  Kouichi Takeshita

发明人： Mitsutaka Sato ,  Junichi Kasai ,  Masanori Yoshimoto ,  Kouichi Takeshita

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L23/495 ,  H01L21/58 ,  H01L21/603

CPC分类号： H01L24/83 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49544 ,  H01L23/49551 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/85181 ,  H01L2224/92147 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/181

摘要： A process for manufacturing semiconductor device including a semiconductor chip having top and bottom surfaces, upper leads electrically coupled to the semiconductor chip, where a first gap is formed between the upper leads and the top surface of the semiconductor chip, lower leads electrically coupled to the semiconductor chip, where a second gap is formed between the lower leads and the bottom surface of the semiconductor chip, and an encapsulating resin which encapsulates the semiconductor chip so as to maintain the first and second gaps.

摘要翻译： 一种制造半导体器件的方法，该半导体器件包括具有顶表面和底表面的半导体芯片，电连接到半导体芯片的上引线，其中在上引线和半导体芯片的顶表面之间形成第一间隙， 半导体芯片，其中在下引线和半导体芯片的底表面之间形成第二间隙，以及封装树脂，其封装半导体芯片以保持第一和第二间隙。