摘要:
Embodiments of valves having adjustable hard stops and methods of use thereof are provided herein. The adjustable valve includes a valve body including an inlet and an outlet; a valve member that is moveable between a fully closed position and a fully open position to selectively allow or prevent flow from the inlet to the outlet; and an adjustable hard stop to limit the fully open position of the valve to an adjusted fully open position.
摘要:
Provided are: forming an oxycarbonitride film, an oxycarbide film or an oxide film on a substrate by alternately performing a specific number of times: forming a first layer containing the specific element, nitrogen and carbon, on the substrate, by alternately performing a specific number of times, supplying a first source containing the specific element and a halogen-group to the substrate in a processing chamber, and supplying a second source containing the specific element and an amino-group to the substrate in the processing chamber; and forming a second layer by oxidizing the first layer by supplying an oxygen-containing gas, and an oxygen-containing gas and a hydrogen-containing gas to the substrate in the processing chamber.
摘要:
Embodiments of the invention relate to apparatus and methods for depositing materials on substrates during atomic layer deposition processes. In one embodiment, a chamber lid assembly comprises a channel having an upper portion and a lower portion, wherein the channel extends along a central axis, a housing having an inner region and at least partially defining two or more annular channels, an insert disposed in the inner region and defining the upper portion, the upper portion fluidly coupled with the two or more annular channels, and a tapered bottom surface extending from the bottom portion of the channel to a peripheral portion of the chamber lid assembly.
摘要:
To provide a fluid control apparatus capable of reducing the space, while reducing the cost. A fluid control apparatus has a fluid controlling unit and a fluid introducing unit. The fluid introducing unit is divided into three parts: a first and a second inlet-side shutoff/open parts disposed on the inlet side, each made up of 2×N/2, disposed between the first and second inlet-side shutoff/open parts and the fluid controlling unit.
摘要:
A depositing arrangement for evaporation of a material including an alkali metal or alkaline earth metal, and for deposition of the material on a substrate (4) is described. The arrangement a first chamber (110) configured for liquefying the material, a valve (130) being in fluid communication with the first chamber, and being downstream of the first chamber, wherein the valve is configured for control of the flow rate of the liquefied material through the valve, an evaporation zone (114) being in fluid communication with the valve, and being downstream of the valve, wherein the evaporation zone is configured for vaporizing the liquefied material, and one or more outlets (116) for directing the vaporized material towards the substrate.
摘要:
A film forming apparatus, in which vaporized gas of liquid raw material not adequately vaporized in a vaporizer is completely vaporized passing through a pipe for feeding vaporized gas of liquid raw material arranged between the vaporizer and an film forming chamber, and applies in the film forming chamber, is provided. The apparatus includes a supplying system of liquid raw material for film forming; a vaporizer, which vaporizes the liquid raw material by mixing with carrier gas; a film forming chamber, which flows the vaporized gas of liquid raw material from the vaporizer on a base plate, and forms film; and a pipe feeding vaporized gas of liquid raw material, which supplies gas from the vaporizer to the film forming chamber. The pipe for feeding vaporized gas of liquid raw material has a spiral shape, and the axis as the spiral shape is arranged vertical direction to a floor plane.
摘要:
A method for performing uniform processing in multiple reaction chambers includes (a) conducting a cycle constituted by steps in each reaction chamber according to the order of the reaction chambers at which the steps are conducted; and then (b) conducting the steps in each reaction chamber after changing the immediately prior order of the reaction chambers at which the steps are conducted; and then (c) repeating process (b) until a target treatment is complete at the multiple reaction chambers. The target treatment conducted on a substrate in each reaction chamber is the same.
摘要:
Disclosed is a liquid-metal organic compound supply system which is applicable to a metal organic chemical vapor deposition (MOVCD) processing apparatus, including disposing a first bottle body in a thermostat, a second bottle body and a three-way valve in room temperature. Wherein a first connecting end of the three-way valve and a first outlet pipe of the first bottle body connect to the MOVCD processing apparatus, a second connecting end connects to a second inlet pipe of the second bottle body and a third connecting end connects to a first inlet pipe of the first bottle body and a second outlet pipe of the second bottle body. When the present invention is applied to the MOCVD manufacturing process, it prolongs usage period of trimethyl gallium, decreases replacement frequency and increases utilization ratio. Besides, the present invention also decreases the manufacturing and packing costs of trimethyl gallium.
摘要:
A film formation apparatus according to an embodiment includes a first chamber capable of accommodating a substrate therein and a second chamber capable of accommodating a substrate therein. A first oxygen supply system supplies oxygen to the first and second chambers simultaneously. A second oxygen supply system selectively switches a chamber, in which oxygen is supplied, at least between the first chamber and the second chamber.
摘要:
The embodiments of the disclosure may generally provide a method and apparatus for forming thin film transistor device that includes an indium gallium zinc oxide (IGZO) layer using a multi-component precursor gas. The embodiments of the disclosure may provide a plasma enhanced chemical vapor deposition system configured to form an IGZO layer on large area substrates. However, it should be understood that the disclosure has utility in other system configurations such other types of chemical vapor deposition systems and any other system in which distributing a multi-component precursor gas to and within a process chamber is desired.