公开(公告)号：US20140024174A1

公开(公告)日：2014-01-23

申请号：US13997649

申请日：2011-12-19

申请人： Robert L. Sankman ,  Edward A. Zarbock

发明人： Robert L. Sankman ,  Edward A. Zarbock

IPC分类号： H01L25/03

CPC分类号： H01L25/03 ,  H01L21/6836 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/82005 ,  H01L2224/83104 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014

摘要： Electronic devices and methods for fabricating electronic devices are described. One method includes attaching an optically transparent solid material to a body of semiconducting material in which microelectronic devices are formed. The method also includes attaching a first surface of a body portion, comprising a portion of the body, to a substrate while a portion of the optically transparent solid material is attached to a second surface of the body portion. The method also includes removing the optically transparent solid material from the second surface of the body portion after the attaching the first surface of the body portion to the substrate.

摘要翻译： 描述了用于制造电子设备的电子设备和方法。 一种方法包括将光学透明固体材料附着到形成微电子器件的半导体材料体中。 该方法还包括将包括主体的一部分的主体部分的第一表面附接到基板，同时光学透明固体材料的一部分附接到主体部分的第二表面。 该方法还包括在将本体部分的第一表面附着到基底上之后从主体部分的第二表面去除光学透明的固体材料。

公开(公告)号：US20130106504A1

公开(公告)日：2013-05-02

申请号：US13282836

申请日：2011-10-27

申请人： Yvonne LIN

发明人： Yvonne LIN

IPC分类号： H01L25/03

CPC分类号： G05F3/247 ,  G05F3/30 ,  H01L25/03 ,  H01L2924/0002 ,  H03F1/223 ,  H01L2924/00

摘要： An integrated circuit includes an analog circuit including a first transistor. At least one cascode transistor is electrically coupled with the first transistor in a series fashion. A drain and a gate of the cascode transistor are electrically coupled with a gate of the first transistor of the analog circuit. The at least one cascode transistor is operated in a saturation mode or a sub-threshold mode.

摘要翻译： 集成电路包括包括第一晶体管的模拟电路。 至少一个共源共栅晶体管以串联方式与第一晶体管电耦合。 共源共栅晶体管的漏极和栅极与模拟电路的第一晶体管的栅极电耦合。 至少一个共源共栅晶体管以饱和模式或次阈值模式工作。

公开(公告)号：US20120241982A1

公开(公告)日：2012-09-27

申请号：US13441533

申请日：2012-04-06

申请人： Boon Suan Jeung ,  Eng Meow Koon ,  Chia Yong Poo

发明人： Boon Suan Jeung ,  Eng Meow Koon ,  Chia Yong Poo

IPC分类号： H01L25/03 ,  H01L21/60

CPC分类号： H01L23/5283 ,  H01L21/4853 ,  H01L21/76885 ,  H01L21/82 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/522 ,  H01L24/19 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/82 ,  H01L24/85 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45169 ,  H01L2224/4554 ,  H01L2224/45669 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48464 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/73267 ,  H01L2224/78 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2224/85909 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/1064 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18162 ,  H01L2924/19107 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Packaged semiconductor assemblies including interconnect structures and methods for forming such interconnect structures are disclosed herein. One embodiment of a packaged semiconductor assembly includes a support member having a first bond-site and a die carried by the support member having a second bond-site. An interconnect structure is connected between the first and second bond-sites and includes a wire that is coupled to at least one of the first and second bond-sites. The interconnect structure also includes a third bond-site coupled to the wire between the first and second bond-sites.

摘要翻译： 包括用于形成这种互连结构的互连结构和方法的封装半导体组件在本文中公开。 封装半导体组件的一个实施例包括具有第一结合位置的支撑构件和由具有第二结合位点的支撑构件承载的模具。 互连结构连接在第一和第二结合位点之间，并且包括耦合到第一和第二键合位置中的至少一个的导线。 互连结构还包括在第一和第二键合位点之间耦合到线的第三键位置。

公开(公告)号：US20120112360A1

公开(公告)日：2012-05-10

申请号：US13243638

申请日：2011-09-23

申请人： Ho Young SON

发明人： Ho Young SON

IPC分类号： H01L23/48 ,  H01L21/56 ,  H01L25/03 ,  H01L21/60

CPC分类号： H01L21/56 ,  H01L23/3114 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/83855 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2924/00

摘要： A semiconductor chip includes a semiconductor chip body including a peripheral region, a first region and a second region, and having a plurality of memory banks formed in each of the first region and the second region; a plurality of first through electrodes formed in the peripheral region; and a plurality of second through electrodes formed in the first and second regions along a direction parallel to a minor axis of the semiconductor chip body.

摘要翻译： 半导体芯片包括半导体芯片本体，其包括周边区域，第一区域和第二区域，并且具有形成在第一区域和第二区域中的每一个中的多个存储体; 形成在周边区域的多个第一贯通电极; 以及沿着与半导体芯片主体的短轴平行的方向在第一和第二区域中形成的多个第二贯通电极。

公开(公告)号：US06946323B1

公开(公告)日：2005-09-20

申请号：US10831505

申请日：2004-04-22

申请人： Young Wook Heo

发明人： Young Wook Heo

IPC分类号： H01L21/48 ,  H01L21/50 ,  H01L25/03 ,  H01L25/065 ,  H01L25/10

CPC分类号： H01L25/0657 ,  H01L24/73 ,  H01L25/03 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06582 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor package and method for producing the same has a substrate. A prepackaged semiconductor device is coupled to the substrate. At least one die is coupled to a top surface of the prepackaged semiconductor device. An adhesive layer is laid between the prepackaged semiconductor device and the first die to coupled the two together. A mold compound is then used to encapsulate the semiconductor package.

摘要翻译： 半导体封装及其制造方法具有基板。 预包装半导体器件耦合到衬底。 至少一个管芯耦合到预包装半导体器件的顶表面。 在预包装的半导体器件和第一管芯之间铺设粘合剂层，以将两者结合在一起。 然后将模具化合物用于封装半导体封装。

公开(公告)号：US5391919A

公开(公告)日：1995-02-21

申请号：US141402

申请日：1993-10-22

申请人： Aldo Torti ,  Emilio Mattiuzzo

发明人： Aldo Torti ,  Emilio Mattiuzzo

IPC分类号： H01L23/24 ,  H01L23/495 ,  H01L29/91 ,  H01L21/52 ,  H01L21/60 ,  H01L25/03

CPC分类号： H01L23/49575 ,  H01L23/24 ,  H01L23/49562 ,  H01L24/37 ,  H01L2224/37147 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  Y10S257/925

摘要： A semiconductor device module is formed of four identical frame sections which each have a flat base and perpendicularly extending strap terminal. Semiconductor chips are soldered to the center of the top surfaces of each base, and the devices are interconnected by flat brass strips having one end soldered to the top of one chip and the other end soldered to the base of an adjacent section. The base sections lie in a common plane at the bottom of an insulative filled insulation cup. The terminals extend parallel and out of the top of the cup.

摘要翻译： 半导体器件模块由四个相同的框架部分形成，每个部分具有平坦的基部和垂直延伸的带端子。 半导体芯片被焊接到每个基座的顶表面的中心，并且这些器件通过扁平的黄铜条相互连接，其一端焊接到一个芯片的顶部，另一端焊接到相邻部分的基部。 基座部分位于绝缘填充绝缘杯底部的公共平面中。 端子平行延伸出杯子的顶部。

公开(公告)号：US4128870A

公开(公告)日：1978-12-05

申请号：US831086

申请日：1977-09-06

申请人： Johannes F. Knobloch ,  Ernst Brunner

发明人： Johannes F. Knobloch ,  Ernst Brunner

IPC分类号： H01L25/10 ,  H01L23/32 ,  H01L23/34 ,  H01L23/473 ,  H01L23/48 ,  H01L25/03 ,  H01L25/11 ,  H02M7/04 ,  H02M7/06

CPC分类号： H01L23/32 ,  H01L23/473 ,  H01L24/72 ,  H01L25/115 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/3011

摘要： A high current-rectifier arrangement comprising a movable contact body which is of substantially piston-like structure and arranged with radial play in a cylinder-like compartment or chamber formed in an associated contact element and surrounded at its periphery by a connection line which bridges the radial play to the inner wall of the compartment. Furthermore, cooling agent-channel means of such contact body are arranged in offset relationship at the periphery thereof with respect to the connection line and sealingly connected with cooling agent-channels provided in the connection element.

摘要翻译： 一种高电流整流器装置，包括可移动接触体，其基本上为活塞状结构，并且在形成于相关联的接触元件中的圆柱形隔室或腔室中以径向游动的方式布置，并且在其周边通过连接线 径向播放到隔间的内壁。 此外，这种接触体的冷却剂通道装置相对于连接线在其周边处以偏移关系布置，并且与设置在连接元件中的冷却剂通道密封连接。

公开(公告)号：US3955122A

公开(公告)日：1976-05-04

申请号：US445987

申请日：1974-02-26

申请人： John T. Maynard ,  Gilbert A. Schwibinger

发明人： John T. Maynard ,  Gilbert A. Schwibinger

IPC分类号： H01L23/467 ,  H01L23/48 ,  H01L25/03 ,  H01L23/34

CPC分类号： H01L24/72 ,  H01L23/467 ,  H01L25/03 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/13034 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10S257/909

摘要： One layer of three heat sinks for conducting alternating current and a second layer of two heat sinks for conducting direct current sandwich twelve controlled rectifiers which are electrically arranged to provide a pair of gated rectifier bridge networks for changing from a current of one frequency to a current of another frequency. Six rod-like bolts are removably secured within threaded openings of certain heat sinks and pass through openings within other heat sinks and assist together with locking nuts in compressing the sandwiched assembly. Three of the bolts are electrically insulated from the direct current heat sinks for supplying alternating current to the rectifying devices through the alternating current heat sinks while two of the bolts are electrically insulated from the alternating current heat sinks for conducting direct current to the rectifying devices through the direct current heat sinks.An alternative embodiment employs two layers each comprising one heat sink for conducting direct current and a third layer of three heat sinks for conducting alternating current for sandwiching two layers of controlled rectifiers each including six rectifying devices. Three rod-like bolts are removably secured within threaded openings of one D. C. heat sink and pass through openings within the opposite D. C. heat sink and the A. C. heat sinks and assist together with locking nuts in compressing the sandwiched assembly. Two of the bolts conduct direct current to the rectifiers through the two D. C. heat sinks and are electrically insulated from the A. C. heat sinks. Alternating current is connected directly to the A. C. heat sinks.The bolts utilized in the invention further secure inductance cores, provide an electrical connection to an input-output circuit, provide an electrical connection to a printed circuit board, provide a connection to a cabinet, and provide a primary circuit for current sensing transformers. The plurality of heat sinks are oriented so that the cooling fins of all layers are in parallel alignment.

摘要翻译： 一层用于传导交流电流的三个散热器和用于传导直流三明治的十二个受控整流器的两个散热器的第二层，其被电气布置以提供一对门控整流桥网络，用于从一个频率的电流变为电流 的另一个频率。 六个杆状螺栓可拆卸地固定在某些散热器的螺纹开口内并穿过其它散热器内的开口，并与锁定螺母一起帮助压缩夹持的组件。 三个螺栓与直流散热器电绝缘，用于通过交流散热器向整流装置提供交流电流，而两个螺栓与交流散热片电绝缘，用于将直流电流传导到整流装置，通过 直流散热片。

公开(公告)号：US3927338A

公开(公告)日：1975-12-16

申请号：US53823075

申请日：1975-01-02

申请人： MOTOROLA INC

发明人： VIEILLERIBIERE HENRY

IPC分类号： H01L25/03 ,  H02K11/04 ,  H02K11/00

CPC分类号： H02K11/046 ,  H01L25/03 ,  H01L2924/0002 ,  H01L2924/00

摘要： An alternator rectifier bridge assembly is described. This assembly is made using all metal parts for the principal pieces of the bridges. The positive heat sink is made as a single piece and is used as the mounting member for a plurality of phase input plates and a plurality of negative heat sinks. The negative heat sinks are positioned on a first side of the positive heat sink. The phase input plates are positioned on the second side of the positive heat sink. The phase input plates carry a pair of diodes and each diode is positioned with the proper orientation in contact with either the positive heat sink or the negative heat sink by a sealing member.

摘要翻译： 描述了交流发电机整流桥组件。 该组件使用用于桥梁的主要部件的所有金属部件制成。 正型散热器制成单件，并用作多个相位输入板和多个负散热片的安装构件。 负散热器位于正散热器的第一侧。 相输入板位于正散热器的第二侧。 相位输入板载有一对二极管，并且每个二极管被定位成通过密封构件与正散热器或负散热器接触正确的方向。

公开(公告)号：US3913040A

公开(公告)日：1975-10-14

申请号：US46672474

申请日：1974-05-03

申请人： RCA CORP

发明人： ROSEN ARYE ,  REYNOLDS JAMES FRANCIS

IPC分类号： H01L23/36 ,  H01L23/66 ,  H01L25/03 ,  H03F3/10 ,  H01P1/30 ,  H01L23/12 ,  H01P5/00

CPC分类号： H03F3/10 ,  H01L23/36 ,  H01L23/66 ,  H01L25/03 ,  H01L2224/48472

摘要： An L-shaped thermally conductive substrate is adapted to be mounted in a microwave stripline circuit structure. Two semiconductor elements are mounted on the substrate, one on each leg of the L-shaped structure. The semiconductor elements are electrically interconnected in such a manner as to reduce parasitic reactances to a minimum.