公开(公告)号：US09886074B2

公开(公告)日：2018-02-06

申请号：US14943472

申请日：2015-11-17

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Roberto Larosa ,  Daniele Mangano ,  Riccardo Condorelli ,  Giulio Zoppi ,  Natale Aiello

IPC: G06F1/32 ,  G06F1/26

CPC classification number: G06F1/3206 ,  G06F1/26

Abstract: An electronic device may include a transducer configured to generate an electrical output responsive to an input, and a data storage element configured to change state responsive to the transducer. The electronic device may include a power circuit configured to turn on and supply power responsive to the data storage element changing state, and a processing circuit configured to be powered by the power circuit.

公开(公告)号：US20180033895A1

公开(公告)日：2018-02-01

申请号：US15449655

申请日：2017-03-03

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Massimo Cataldo Mazzillo ,  Piero Fallica ,  Salvatore Lombardo

IPC: H01L31/0216 ,  G01J1/44 ,  H01L31/02 ,  H01L27/144 ,  H01L31/107

CPC classification number: H01L31/02164 ,  G01J1/44 ,  G01J2001/4466 ,  H01L27/1446 ,  H01L27/1462 ,  H01L27/14625 ,  H01L27/1463 ,  H01L27/14649 ,  H01L31/02027 ,  H01L31/107

Abstract: An array of Geiger-mode avalanche photodiodes is formed in a die and includes: an internal dielectric structure, arranged on the die; and an external dielectric region arranged on the internal dielectric structure. The external dielectric region is formed by an external material that absorbs radiation having a wavelength that falls in a stop-band with low wavelength and transmits radiation having a wavelength that falls in a pass-band with high wavelength, at least part of the pass-band including wavelengths in the infrared. The internal dielectric structure is formed by one or more internal materials that substantially transmit radiation having a wavelength that falls in the stop-band and in the pass-band and have refractive indices that fall in an interval having an amplitude of 0.4. In the stop-band and in the pass-band the external dielectric region has a refractive index with the real part that falls in the above interval.

公开(公告)号：US09881911B2

公开(公告)日：2018-01-30

申请号：US13801354

申请日：2013-03-13

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani

IPC: H01L23/48 ,  H01L21/60 ,  H05K7/20 ,  H05K1/00 ,  H01L25/11 ,  H01L27/02 ,  H01L21/768 ,  H01L25/065 ,  H01L23/31 ,  H01L23/66 ,  H01L23/00 ,  H01L21/683 ,  H01L25/10 ,  H05K1/18 ,  H01L21/66 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L27/0203 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/768 ,  H01L22/22 ,  H01L23/3128 ,  H01L23/48 ,  H01L23/49833 ,  H01L23/66 ,  H01L24/02 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/09 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/94 ,  H01L24/95 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/68304 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/6677 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/02319 ,  H01L2224/02321 ,  H01L2224/02371 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05569 ,  H01L2224/06187 ,  H01L2224/08137 ,  H01L2224/08146 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/14183 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2105 ,  H01L2224/211 ,  H01L2224/28105 ,  H01L2224/29024 ,  H01L2224/30183 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/45015 ,  H01L2224/45099 ,  H01L2224/48 ,  H01L2224/48091 ,  H01L2224/48175 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73251 ,  H01L2224/82106 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2225/06531 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06596 ,  H01L2225/1023 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15159 ,  H01L2924/207 ,  H05K1/181 ,  H05K1/189 ,  H05K2201/10515 ,  Y02P70/611 ,  H01L2224/02 ,  H01L2224/08 ,  H01L2224/16 ,  H01L2224/32 ,  H01L2224/19 ,  H01L2924/00

Abstract: An embodiment of an electronic system may be provided so as to have superior coupling by implementing a communication mechanism that provides at least for horizontal communication for example, on the basis of wired and/or wireless communication channels, in the system. Hence, by enhancing vertical and horizontal communication capabilities in the electronic system, a reduced overall size may be achieved, while nevertheless reducing complexity in PCBs coupled to the electronic system. In this manner, overall manufacturing costs and reliability of complex electronic systems may be enhanced.

公开(公告)号：US20180026618A1

公开(公告)日：2018-01-25

申请号：US15394472

申请日：2016-12-29

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Germano Nicollini ,  Roberto Modaffari

IPC: H03K5/24

CPC classification number: H03K5/2481 ,  G01R19/0038 ,  H03F3/45179 ,  H03F3/45273 ,  H03K3/0377 ,  H03K5/24

Abstract: A comparator circuit including: a first node and a second node, which receive a first current and a second current, respectively; a first current mirror, which includes a first load transistor and a first output transistor; and a second current mirror, which includes a second load transistor and a second output transistor. The comparator circuit further includes: a first feedback transistor and a second feedback transistor cross-coupled together, the control terminals of the first and second feedback transistors being connected to the first and second nodes, respectively; a first resistor, having a first terminal, which is connected to the control terminal of the first load transistor, and a second terminal, which is connected to the first node and to the control terminal of the first output transistor; and a second resistor, having a first terminal, connected to the control terminal of the second load transistor, and a second terminal, connected to the second node and to the control terminal of the second output transistor.

公开(公告)号：US20180026609A1

公开(公告)日：2018-01-25

申请号：US15437868

申请日：2017-02-21

Applicant: STMicroelectronics S.r.l.

Inventor： Giuseppe Scilla

IPC: H03K3/011 ,  G01B7/16

CPC classification number: H03K3/011 ,  G01B7/18 ,  G01L1/00 ,  G01R17/12 ,  H01L22/34 ,  H01L23/34

Abstract: A semiconductor substrate includes a first portion and a second portion. The first portion of the substrate has a first deformation-stress sensor capable of supplying a first stress signal. The second portion of the substrate has a second deformation-stress sensor capable of supplying a second stress signal. The first stress signal and second stress signal are processed by a circuit to produce a compensation signal. The compensation signal is applied in feedback to one of the first and second stress signals to compensate for variations induced in said one of the first and second stress signals by stresses in the semiconductor substrate.

公开(公告)号：US09875377B2

公开(公告)日：2018-01-23

申请号：US14661862

申请日：2015-03-18

Applicant: STMicroelectronics S.r.l.

Inventor： Filippo Melzani

IPC: G06F21/72 ,  H04L9/00 ,  H04L9/06

CPC classification number: G06F21/72 ,  H04L9/002 ,  H04L9/0631 ,  H04L2209/046

Abstract: A device of the Substitution-Box (S-Box) type, which is suitable for operating in a symmetric-key encryption apparatus, in particular an AES (Advanced Encryption Standard) encryption apparatus, and includes at least one module configured for carrying out a non-linear operation in a finite field (GF(28)) of an encryption method implemented by the above encryption apparatus, the module including at least one reprogrammable look-up table to, for example, implement countermeasures against side-channel attacks. When no countermeasures are employed, the tables may be set to fixed values, instead of being reprogrammable. The above module includes a plurality of composite look-up tables that implement the non-linear operation in a composite field of finite subfields (GF(24)2; GF((22)2)2) deriving from the finite field (GF(28)), each of the above composite look-up tables being smaller than a look-up table that is able to implement autonomously the non-linear operation in a finite field (GF(28)).

公开(公告)号：US09874598B2

公开(公告)日：2018-01-23

申请号：US14827796

申请日：2015-08-17

Applicant: STMicroelectronics S.r.l.

Inventor： Alberto Pagani

IPC: G01R31/26 ,  H01L21/66 ,  H01L21/768 ,  G01R31/27 ,  H01L23/48 ,  G01R31/28

CPC classification number: G01R31/275 ,  G01R31/2853 ,  H01L21/76898 ,  H01L22/34 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A testing system for carrying out electrical testing of at least one first through via forms an insulated via structure extending only part way through a substrate of a first body of semiconductor material. The testing system has a first electrical test circuit integrated in the first body and electrically coupled to the insulated via structure. The first electrical test circuit enables detection of at least one electrical parameter of the insulated via structure.

公开(公告)号：US09869550B2

公开(公告)日：2018-01-16

申请号：US14964347

申请日：2015-12-09

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Daniele Prati ,  Carlo Valzasina ,  Luca Giuseppe Falorni ,  Matteo Fabio Brunetto

IPC: G01C19/5747 ,  G01C19/5733

CPC classification number: G01C19/5733 ,  G01C19/5747 ,  G01C19/5762

Abstract: A microelectromechanical gyroscope includes: a substrate; a stator sensing structure fixed to the substrate; a first mass elastically constrained to the substrate and movable with respect to the substrate in a first direction; a second mass elastically constrained to the first mass and movable with respect to the first mass in a second direction; and a third mass elastically constrained to the second mass and to the substrate and capacitively coupled to the stator sensing structure, the third mass being movable with respect to the substrate in the second direction and with respect to the second mass in the first direction.

公开(公告)号：US20180012827A1

公开(公告)日：2018-01-11

申请号：US15677578

申请日：2017-08-15

Applicant: STMicroelectronics S.r.l.

Inventor： Federico Giovanni Ziglioli

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L21/48

Abstract: An electronic component includes one or more circuits having electrical connections coupled therewith. The electrical connections include a lead frame as well as electrical wires coupling the circuit or circuits to respective portions of the lead frame. The electrical wires may be formed as one piece with the respective portion of the lead frame without joints therebetween, e.g., by 3D printing.

公开(公告)号：US09865356B2

公开(公告)日：2018-01-09

申请号：US15275362

申请日：2016-09-24

Applicant: STMicroelectronics S.r.l

Inventor： Giovanni Campardo ,  Salvatore Polizzi

IPC: G11C11/34 ,  G11C16/26 ,  G11C16/04 ,  G11C16/08

CPC classification number: G11C16/26 ,  G11C7/12 ,  G11C7/18 ,  G11C16/0408 ,  G11C16/08 ,  G11C16/24 ,  G11C16/28 ,  G11C2207/002 ,  G11C2207/12

Abstract: A circuit for reading a memory cell of a non-volatile memory device provided with a memory array with cells arranged in wordlines and bitlines, among which a first bitline, associated to the memory cell, and a second bitline, has: a first circuit branch associated to the first bitline and a second circuit branch associated to the second bitline, each with a local node, coupled to which is a first dividing capacitor, and a global node, coupled to which is a second dividing capacitor; a decoder stage for coupling the local node to the first or second bitlines and coupling the global node to the local node; and a differential comparator stage supplies an output signal indicative of the datum stored; and a control unit for controlling the decoder stage, the coupling stage, and the differential comparator stage for generation of the output signal.