摘要:
A module integrated circuit (IC) carrier is used to move module ICs through a testing machine. The module IC carrier has a housing with a pair of installation elements installed parallel to one another in a receiving space of the housing. A plurality of holding members are installed on each of the installation elements. Each holding member on one of the installation elements faces a corresponding holding member on the other of the installation elements. Module ICs are held between corresponding pairs of the holding members. The holding elements can be biased towards each other to help hold the module ICs. Each holding element may include a rotator with a grooved edge which helps to hold a module IC, and which allows the module ICs to be easily inserted into and removed from the carrier.
摘要:
A method for designing a reticle mask with a reduced pattern by use of another larger reticle mask having a circuit pattern and scribe line patterns on lower and right edges of the circuit pattern. In the method, the larger circuit pattern is modified by forming two dummy scribe line regions at upper and left edges of the larger circuit pattern. The modified mask pattern is then reduced. The reduced mask pattern is repeatedly copied on a reticle frame region, with at least one of the dummy scribe line regions overlapping at least one of the scribe line regions of an adjacent reduced mask pattern.
摘要:
Disclosed herein is an apparatus for collecting game data in order to test performance of a game server. The apparatus includes a capture and filtering module, a control module, and a data management module. The capture and filtering module captures packets, transmitted and received between the game server and each of a plurality of game clients, using the plurality of game clients, and extracts a plurality of necessary data by performing filtering on the results of the capturing. The control module determines the movement route of a game character in such a way as to correspond to the plurality of necessary data, and controls the plurality of game clients based on the movement route. The data management module stores and manages the plurality of necessary data.
摘要:
A semiconductor module and a method of manufacturing a semiconductor module including at least one chip package, at least one module board, at least one conductive element provided between the first chip package and the module board and a protector for applying pressure to the conductive element, the module board, and the first chip package and/or acting as a heat sink for the first chip package.
摘要:
Example embodiments of the present invention include a printed circuit board (PCB) capable of controlling the size and position of voids during a surface mounting process. To this end, the PCB includes: an insulating plate made of an insulating material; printed circuit patterns formed on the insulating plate; a plurality of lands to support a plurality of solder joints, each land coupled to one end of each of the printed circuit patterns; and anti-wetting layers mounted on a surface of each of the lands for solder joint therein. The anti-wetting layers allow a void produced during a surface mounting process to move to a central surface on a pad, so that the solder joint reliability between the solder ball and the land is increased. As a result, the reliability of a semiconductor device is enhanced.
摘要:
A semiconductor device includes a semiconductor package, a circuit board and an interval maintaining member. The semiconductor package has a body and a lead protruded from the body. The circuit board has a first land electrically connected to the lead. The interval maintaining member is interposed between the circuit board and the body. The interval maintaining member maintains an interval between the lead and the first land. Thus, an interval between the lead and the land is uniformly maintained, so that a thermal and/or mechanical reliability of the semiconductor device is improved.
摘要:
In the methods of compensating for an alignment error during fabrication of structures on semiconductor substrates, a conductive pattern structure is formed at a first position on a first semiconductor substrate. The conductive pattern structure includes a grid of first and second conductive patterns arranged as columns and intersecting rows with openings bounded therebetween. A first conductive contact structure overlaps the conductive pattern structure, and includes a plurality of spaced apart conductive contacts arranged as a grid of rows and columns that can be tilted at a non-zero angle relative to the grid of the conductive pattern structure. A determination is made as to whether the first conductive contact structure is electrically connected to the conductive pattern structure. A second conductive contact structure is formed at a position on a second semiconductor substrate that is determined in response to the determination of whether the first conductive contact structure is electrically connected to the conductive pattern structure.
摘要:
Example embodiments of the present invention may include a printed circuit board, a method of manufacturing the printed circuit board, and a memory module/socket assembly. Example embodiments of the present invention may increase the number of contact taps on a memory module, in addition, a force required to insert the memory module into a module socket may be decreased.
摘要:
An electronic component mounting apparatus that includes a demagnetizer used to demagnetize a head nozzle, and a method for demagnetizing an electronic component apparatus. The method may include setting conditions, mounting electronic components, and demagnetizing a head nozzle of the electronic component mounting apparatus based on the conditions.
摘要:
The present invention relates to a reception antenna structure of a tire pressure monitoring system. The reception antenna is implemented using a cable-type antenna connected to a receiver of the tire pressure monitoring system. The cable-type antenna enables a mounting position of the antenna to be freely changed and improves a reception rate for measured data about temperature and pressure of a tire, that is modulated into data in the UHF band and transmitted to the outside of the tire in a wireless manner by a transmitter. According to the present invention, the reception antenna of a tire pressure monitoring system is implemented using a radiating leakage coaxial cable so as to enable the position of the antenna to be freely changed, so that, when tire pressure data is measured by a temperature and pressure sensor included in the transmitter within the tire and then transmitted through a tire pressure monitoring transmitter in a wireless manner, the reception sensitivity for the measured data is improved, thus increasing the reliability of the data measured at the tire, and guaranteeing the stability of the tire on the basis of the reliability of the reception sensitivity for the measured data.