公开(公告)号：US5563442A

公开(公告)日：1996-10-08

申请号：US449503

申请日：1995-05-24

Applicant: Deepak Mahulikar ,  Arvind Parthasarathi

Inventor： Deepak Mahulikar ,  Arvind Parthasarathi

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/495 ,  H01L23/50 ,  H05K3/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/32 ,  H01L23/49582 ,  H01L24/48 ,  H05K3/3426 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/73265 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L23/49579 ,  H01L24/45 ,  H01L24/73 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K2201/10689 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y02P70/613

Abstract: There is disclosed a leadframe for electrically interconnecting a semiconductor device to external circuitry. The leadframe has an electrically conductive substrate that is coated with an oxidation resistant external layer. An intervening layer is disposed between a portion of the substrate and the external layer. The intervening layer is absent from the outer lead ends of the leadframe. Subsequent removal of the external layer from the outer lead ends enables a solder to directly contact the leadframe substrate.

Abstract translation: 公开了一种用于将半导体器件电连接到外部电路的引线框架。 引线框架具有涂覆有抗氧化外层的导电基板。 在衬底的一部分和外部层之间设置中间层。 引线框的外引线端不存在中间层。 随后从外部引线端部移除外部层使得焊料能够直接接触引线框架基板。

公开(公告)号：US5540378A

公开(公告)日：1996-07-30

申请号：US126862

申请日：1993-09-27

Applicant: Deepak Mahulikar ,  Arvind Parthasarathi

Inventor： Deepak Mahulikar ,  Arvind Parthasarathi

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/495 ,  H01L23/50 ,  H05K3/34 ,  H01L21/58 ,  H01L23/532

CPC classification number: H01L24/32 ,  H01L23/49582 ,  H01L24/48 ,  H05K3/3426 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/73265 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L23/49579 ,  H01L24/45 ,  H01L24/73 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K2201/10689 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y02P70/613

Abstract: There is disclosed a process for the assembly of an electronic package in which the outer lead ends of a leadframe are solderable to external circuitry without the necessity of a tin or solder coat. An oxidation resistant layer is deposited on the leadframe prior to package assembly. The oxidation resistant layer is removed prior to outer lead soldering providing a clean, oxide free metallic surface for soldering.

Abstract translation: 公开了一种用于组装电子封装的方法，其中引线框的外引线端可焊接到外部电路，而不需要锡或焊料涂层。 在封装组装之前，在引线框架上沉积抗氧化层。 在外部引线焊接之前去除抗氧化层，提供清洁，无氧化的金属表面进行焊接。

公开(公告)号：US5534356A

公开(公告)日：1996-07-09

申请号：US427921

申请日：1995-04-26

Applicant: Deepak Mahulikar ,  Efraim Sagiv ,  Arvind Parthasarathi ,  Satish Jalota ,  Andrew J. Brock ,  Michael A. Holmes ,  Jeffrey M. Schlater ,  German J. Ramirez ,  Dexin Liang

Inventor： Deepak Mahulikar ,  Efraim Sagiv ,  Arvind Parthasarathi ,  Satish Jalota ,  Andrew J. Brock ,  Michael A. Holmes ,  Jeffrey M. Schlater ,  German J. Ramirez ,  Dexin Liang

IPC: C25D11/04 ,  H01L23/02 ,  H01L23/04 ,  H01L23/06 ,  H01L23/14 ,  H05K1/05 ,  B32B9/00

CPC classification number: H05K1/056 ,  H01L23/142 ,  H05K1/053 ,  H01L2224/16225 ,  H01L2924/01327 ,  Y10T428/12493 ,  Y10T428/12556 ,  Y10T428/12736 ,  Y10T428/24917

Abstract: There is provided an anodizable aluminum substrate having an increased breakdown voltage. The increase in breakdown voltage is achieved by selecting an appropriate aluminum alloy and appropriate processing parameters. Sealing the anodic film increases the breakdown voltage by decreasing corrosion. A preferred sealant is an epoxy cresol novolac having a low room temperature viscosity that cures to a highly cross-linked polymer.

Abstract translation: 提供了具有增加的击穿电压的可阳极氧化的铝基板。 通过选择适当的铝合金和适当的加工参数来实现击穿电压的增加。 密封阳极膜通过减少腐蚀增加击穿电压。 优选的密封剂是具有低固化至高度交联的聚合物的低室温粘度的环氧甲酚酚醛清漆。

公开(公告)号：US5477008A

公开(公告)日：1995-12-19

申请号：US33919

申请日：1993-03-19

Applicant: Anthony M. Pasqualoni ,  Deepak Mahulikar ,  Francis S. Jewell ,  Paul R. Hoffman ,  George Brathwaite ,  Richard McNabb ,  German Ramirez

Inventor： Anthony M. Pasqualoni ,  Deepak Mahulikar ,  Francis S. Jewell ,  Paul R. Hoffman ,  George Brathwaite ,  Richard McNabb ,  German Ramirez

IPC: H01L23/04 ,  H01L23/10 ,  H05K5/06

CPC classification number: H01L23/10 ,  H01L23/04 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01025 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/16151 ,  H01L2924/16152 ,  Y10T29/49146

Abstract: There are provided polymer plugs for sealing the vent hole of an adhesively sealed electronic package. The polymer vent hole plug is selected to be either an ultraviolet curable polymer or a thermosetting polymer resin. One effective vent hole plug is a cylindrical plug having a diameter under 1.4 millimeters formed from a UV-curable epoxy.

Abstract translation: 提供了用于密封粘合密封电子封装的通气孔的聚合物塞。 聚合物排气孔塞被选择为紫外线固化聚合物或热固性聚合物树脂。 一个有效的通气孔塞是由UV可固化环氧树脂形成的直径小于1.4毫米的圆柱塞。

公开(公告)号：US5449951A

公开(公告)日：1995-09-12

申请号：US270064

申请日：1994-07-01

Applicant: Arvind Parthasarathi ,  Deepak Mahulikar

Inventor： Arvind Parthasarathi ,  Deepak Mahulikar

IPC: C23C30/00 ,  C22C9/00 ,  C22C9/06 ,  H01L21/56 ,  H01L23/28 ,  H01L23/48 ,  H01L23/495 ,  H01L23/50 ,  H01L23/043 ,  H01L23/544

CPC classification number: H01L23/10 ,  H01L23/3107 ,  H01L23/49582 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48618 ,  H01L2224/73265 ,  H01L2224/85201 ,  H01L2224/85418 ,  H01L2224/85871 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/20752

Abstract: There is provided a lead frame with enhanced adhesion to a polymer resin. The lead frame is coated with a thin layer of containing chromium, zinc or a mixture of chromium and zinc. A mixture of chromium and zinc with the zinc-to-chromium ratio in excess of about 4:1 is most preferred. The coated lead frames exhibit improved adhesion to a polymeric resin.

Abstract translation: 提供了对聚合物树脂具有增强粘附性的引线框架。 引线框架涂有含有铬，锌或铬和锌的混合物的薄层。 锌与铬的比例超过约4:1的铬和锌的混合物是最优选的。 涂覆的引线框架对聚合树脂的粘附性提高。

公开(公告)号：US5399187A

公开(公告)日：1995-03-21

申请号：US125946

申请日：1993-09-23

Applicant: Brian Mravic ,  Deepak Mahulikar ,  Gerald N. Violette ,  Eugene Shapiro ,  Henry J. Halverson

Inventor： Brian Mravic ,  Deepak Mahulikar ,  Gerald N. Violette ,  Eugene Shapiro ,  Henry J. Halverson

IPC: F42B7/00 ,  B22F1/00 ,  C22C1/05 ,  C22C27/04 ,  C22C29/08 ,  C22C32/00 ,  C22C38/00 ,  C22C38/12 ,  F42B7/04 ,  F42B12/72 ,  F42B12/74 ,  F42B30/02 ,  F42B1/00 ,  F42B8/14

CPC classification number: F42B7/046 ,  B22F1/0003 ,  C22C32/0094 ,  F42B12/74 ,  F42B12/745

Abstract: A composite lead-free bullet is disclosed comprising a heavy constituents selected from the group of tungsten, tungsten carbide, carballoy, and ferro-tungsten and a second binder constituent consisting of either a metal alloy or a plastic blend.

Abstract translation: 公开了一种复合无铅子弹，其包括选自钨，碳化钨，碳合金和铁 - 钨的重质成分和由金属合金或塑性共混物组成的第二粘合剂成分。

公开(公告)号：US5315155A

公开(公告)日：1994-05-24

申请号：US912535

申请日：1992-07-13

Applicant: Brian E. O'Donnelly ,  Brian Mravic ,  Jacob Crane ,  Deepak Mahulikar

Inventor： Brian E. O'Donnelly ,  Brian Mravic ,  Jacob Crane ,  Deepak Mahulikar

IPC: H01L21/52 ,  H01L23/00 ,  H01L23/047 ,  H01L23/433 ,  H01L23/02 ,  H01L23/12

CPC classification number: H01L24/32 ,  H01L21/52 ,  H01L23/047 ,  H01L23/433 ,  H01L23/562 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195

Abstract: There is provided an electronic package assembly having a leadframe and buffer bonded to a metallic base. To reduce the stress generated by the coefficient of thermal expansion mismatch, the buffer is mounted on a pedestal. The cross sectional area of the pedestal is less than that of the buffer, such that the at least a portion of the buffer overhangs the pedestal.

Abstract translation: 提供了一种电子封装组件，其具有接合到金属基底的引线框架和缓冲器。 为了减少由热膨胀失配系数产生的应力，将缓冲器安装在基座上。 基座的横截面面积小于缓冲器的横截面面积，使得缓冲器的至少一部分突出于基座。

公开(公告)号：US5098864A

公开(公告)日：1992-03-24

申请号：US640794

申请日：1991-01-14

Applicant: Deepak Mahulikar

Inventor： Deepak Mahulikar

IPC: H01L23/055 ,  H01L23/057 ,  H01L23/10 ,  H01L23/498

CPC classification number: H01L23/49827 ,  H01L23/055 ,  H01L23/057 ,  H01L23/10 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01025 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19107 ,  H01L2924/3025 ,  Y10T29/49139

Abstract: A metal pin grid array package and a process for the assembly of the package is provided. The package includes a metal or metal alloy base component having an ordered array of holes. Terminal pins are electrically interconnected to a desired circuit and extend through the ordered array of holes. A dielectric polymer sealant bonds a cover component to both the circuit and to the base component. During package assembly, the polymer sealant flows into the holes comprising the ordered array of holes electrically isolating the terminal pins from the base component.

Abstract translation: 提供了一种金属针格栅阵列封装和用于组装封装的工艺。 该封装包括具有有序阵列的孔的金属或金属合金基底部件。 端子引脚电连接到所需的电路并延伸穿过有序阵列的孔。 电介质聚合物密封剂将覆盖组分粘合到电路和基底组分上。 在包装组装过程中，聚合物密封剂流入包括有序排列的孔的孔，使端子销与基座部件电隔离。

公开(公告)号：US5066368A

公开(公告)日：1991-11-19

申请号：US568818

申请日：1990-08-17

Applicant: Anthony M. Pasqualoni ,  Deepak Mahulikar ,  Satish K. Jalota ,  Andrew J. Brock

Inventor： Anthony M. Pasqualoni ,  Deepak Mahulikar ,  Satish K. Jalota ,  Andrew J. Brock

IPC: C25D11/04 ,  C25D11/06 ,  C25D11/14 ,  H01L23/06 ,  H05K3/44

CPC classification number: C25D11/14 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01025 ,  H01L2924/01039 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16152 ,  H05K3/44

Abstract: A process for producing electronic package components from an aluminum alloy is disclosed. The components have a black color through integral color anodization. The desired color, thickness and surface finish are achieved by regulation of amperage during anodization. The amperage is rapidly raised to in excess of 70 amps per square foot and then allowed to gradually decrease as a function of oxide growth while the voltage is maintained in excess of 70 volts.

Abstract translation: 公开了一种从铝合金制造电子封装部件的方法。 这些组件通过整体颜色阳极氧化处理具有黑色。 所需的颜色，厚度和表面光洁度是通过在阳极氧化期间调节电流强度来实现的。 电流强度迅速提高到每平方英尺超过70安培，然后随着电压保持在70伏以上，随着氧化物生长而逐渐减小。

公开(公告)号：US4978052A

公开(公告)日：1990-12-18

申请号：US399687

申请日：1989-08-28

Applicant: Julius C. Fister ,  Satyam C. Cherukuri ,  Deepak Mahulikar ,  Brian E. O'Donnelly

Inventor： Julius C. Fister ,  Satyam C. Cherukuri ,  Deepak Mahulikar ,  Brian E. O'Donnelly

IPC: H01L21/58 ,  H01L21/60 ,  H01L23/498

CPC classification number: H01L24/83 ,  H01L23/49866 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/29 ,  H01L2224/29083 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/29288 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/8389 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/157 ,  H01L2924/16152 ,  H01L2924/351 ,  Y10T29/4913

Abstract: A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component is disposed between the substrate and the semiconductor die to withstand stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed to the substrate with a layer of solder. The layer of solder is provided to dissipate stresses created by thermal cycling of the substrate and the die. The die is sealed to the buffer with a silver-glass adhesive.

Abstract translation: 提供了一种用于将半导体管芯附接到衬底的半导体管芯附接系统。 金属缓冲部件设置在基板和半导体管芯之间以承受由基板和模具的热循环产生的应力。 金属缓冲部件用一层焊料密封到基板上。 提供焊料层以消散由基板和模具的热循环产生的应力。 模具用银玻璃粘合剂密封到缓冲液。