公开(公告)号：US09795031B2

公开(公告)日：2017-10-17

申请号：US14763074

申请日：2014-12-03

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Song Song ,  Kazuyoshi Nagayama

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K3/06 ,  G02F1/1345

CPC classification number: H05K1/0393 ,  G02F1/13452 ,  H05K1/0248 ,  H05K1/0296 ,  H05K1/09 ,  H05K1/115 ,  H05K3/06 ,  H05K2201/0391 ,  H05K2201/09227 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/09272 ,  H05K2201/10128 ,  H05K2201/10136

Abstract: The present disclosure discloses a wiring board used to connect a driving chip and a display panel, a flexible display panel and a display device. Signal output ends on the driving chip and signal input ends on the display panel may be arranged in pairs; and the wiring board may include fanout lines each of which is configured to connect a pair of signal output end and the signal input end. The wiring board may include a substrate; a plurality of segments of first connection lines having first resistivity is arranged on a first surface of the substrate; a plurality of segments of second connection lines having second resistivity is arranged on a second surface of the substrate opposite to the first surface. At least parts of the fanout lines are formed by connecting the first connection lines and the second connection lines.

公开(公告)号：US20170288349A1

公开(公告)日：2017-10-05

申请号：US15433399

申请日：2017-02-15

Applicant: CommScope Technologies LLC

Inventor： Bernard Harold Hammond, JR. ,  David Patrick Murray ,  Ian Robert George

IPC: H01R13/719

CPC classification number: H01R13/6466 ,  H01R4/2416 ,  H01R13/6658 ,  H01R13/719 ,  H01R24/64 ,  H01R2107/00 ,  H05K1/0228 ,  H05K1/162 ,  H05K3/4644 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/10189 ,  Y10S439/941 ,  Y10T29/49117 ,  Y10T29/49204 ,  Y10T29/49222

Abstract: The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes a multi-zone crosstalk compensation arrangement for reducing crosstalk at the jack.

公开(公告)号：US09713255B2

公开(公告)日：2017-07-18

申请号：US14184575

申请日：2014-02-19

Applicant: INTEL CORPORATION

Inventor： Adel A. Elsherbini ,  Ravindranath Mahajan ,  John S. Guzek ,  Nitin A. Deshpande

IPC: H01L23/13 ,  H05K1/14 ,  H01L23/552 ,  H01L25/00 ,  H01L25/065 ,  H01L23/498 ,  H05K1/02 ,  H05K3/36

CPC classification number: H05K1/147 ,  H01L23/13 ,  H01L23/49833 ,  H01L23/552 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/15192 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/361 ,  H05K2201/09245 ,  H05K2201/09681 ,  Y10T29/49126

Abstract: Embodiments of the present disclosure are directed towards electro-magnetic interference (EMI) shielding techniques and configurations. In one embodiment, an apparatus includes a first substrate, a die having interconnect structures coupled with the first substrate to route input/output (I/O) signals between the die and the first substrate and a second substrate coupled with the first substrate, wherein the die is disposed between the first substrate and the second substrate and at least one of the first substrate and the second substrate include traces configured to provide electro-magnetic interference (EMI) shielding for the die. Other embodiments may be described and/or claimed.

公开(公告)号：US20170102819A1

公开(公告)日：2017-04-13

申请号：US15384395

申请日：2016-12-20

Applicant: Japan Display Inc. ,  Panasonic Liquid Crystal Display Co., Ltd.

Inventor： Shinya HASHIMOTO

IPC: G06F3/041 ,  G02F1/1333 ,  G02F1/1343 ,  G06F3/044

CPC classification number: G06F3/0416 ,  G02F1/133345 ,  G02F1/13338 ,  G02F1/13439 ,  G06F1/16 ,  G06F3/0412 ,  G06F3/0418 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04107 ,  G06F2203/04111 ,  H05K1/0216 ,  H05K1/11 ,  H05K1/118 ,  H05K3/361 ,  H05K2201/09245 ,  H05K2201/09254

Abstract: A display device includes a display panel, and an electrostatic capacitive type touch panel which is formed in an overlapping manner with the display panel. A plurality of X electrodes and a plurality of Y electrodes intersecting with the X electrodes. A first signal line supplies signals to the X electrodes, a second signal line supplies signals to the Y electrodes, and the first signal line and the second signal line are formed on a flexible printed circuit board. A dummy electrode is formed adjacent to an electrode portion of each X electrode and electrode portion of each Y electrode, the dummy electrode does not overlap the X electrode and the Y electrode, and the dummy electrode does not electrically connect with the first and second signal lines.

公开(公告)号：US20170098911A1

公开(公告)日：2017-04-06

申请号：US15288259

申请日：2016-12-21

Applicant: Panduit Corp.

Inventor： Jack E. Caveney ,  Masud Bolouri-Saransar ,  Scott M. Lesniak ,  Satish I. Patel ,  Paul W. Wachtel

IPC: H01R13/6461 ,  H01R24/64

CPC classification number: H01R13/6461 ,  H01R13/6466 ,  H01R24/64 ,  H01R2107/00 ,  H01R2201/04 ,  H05K1/0228 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/09245 ,  H05K2201/10189 ,  Y10S439/941 ,  Y10T29/49121 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49174 ,  Y10T29/49222

Abstract: An apparatus and method for crosstalk compensation in a jack of a modular communications connector includes connected to the plug interface contacts proximate the plug/jack interface. The structure configured to allow the current to flow generally orthogonal to the plug interface contact.

公开(公告)号：US09565751B2

公开(公告)日：2017-02-07

申请号：US14877424

申请日：2015-10-07

Applicant: NITTO DENKO CORPORATION

Inventor： Yuu Sugimoto ,  Hiroyuki Tanabe

IPC: G11B5/48 ,  H05K1/02 ,  H05K3/46 ,  H05K1/05

CPC classification number: H05K1/0271 ,  G11B5/484 ,  G11B5/4853 ,  H05K1/056 ,  H05K3/4685 ,  H05K2201/09245 ,  H05K2203/0323

Abstract: A suspension board with circuit includes a metal supporting board, a first insulating layer including a disposing portion formed at one side in a thickness direction of the metal supporting board, a first conductive layer including a first wire portion formed at the one side of the first insulating layer, a second insulating layer including a covering portion covering the first wire portion, and a second conductive layer including a second wire portion formed at the one side of the second insulating layer and a terminal portion connected to the first or second wire portion. The second insulating layer includes a second terminal supporting portion formed at the other of the terminal portion. The first insulating layer includes a first terminal supporting portion formed at the other side of the second terminal supporting portion. The metal supporting board is not formed at the other side thereof.

Abstract translation: 具有电路的悬挂板包括金属支撑板，第一绝缘层，包括形成在金属支撑板的厚度方向上的一侧的布置部分;第一导电层，包括形成在第一导电层的一侧的第一导线部分 绝缘层，包括覆盖第一导线部分的覆盖部分的第二绝缘层，以及包括形成在第二绝缘层一侧的第二导线部分和连接到第一或第二导线部分的端子部分的第二导电层。 第二绝缘层包括形成在端子部分另一端的第二端子支撑部分。 第一绝缘层包括形成在第二端子支撑部分的另一侧的第一端子支撑部分。 金属支撑板不形成在其另一侧。

公开(公告)号：US09560766B2

公开(公告)日：2017-01-31

申请号：US14621459

申请日：2015-02-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki Yosui

IPC: H05K1/18 ,  H05K3/46 ,  H05K3/10 ,  H05K1/02 ,  H05K1/03 ,  H05K3/36

CPC classification number: H05K1/183 ,  H01L2224/16227 ,  H01L2924/15313 ,  H01L2924/19105 ,  H05K1/0243 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/181 ,  H05K1/185 ,  H05K3/10 ,  H05K3/366 ,  H05K3/4623 ,  H05K3/4635 ,  H05K3/4644 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/09245 ,  H05K2201/09672 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10098 ,  H05K2203/06 ,  Y10T29/49155

Abstract: A circuit board includes a main portion obtained by stacking a plurality of base sheets made of a flexible material in a predetermined direction and bonding the base sheets under pressure, and at least one planar conductor pattern provided in the main portion and including a concave portion and a convex portion. The concave portion and the convex portion extend in a direction perpendicular or substantially perpendicular to the predetermined direction. The concave portion is sunken in a direction parallel or substantially parallel to the predetermined direction. The convex portion protrudes in an opposite direction to the direction in which the concave portion is sunken. The at least one planar conductor pattern includes a first planar conductor pattern with a concave portion and a convex portion extending in a first direction. The circuit board further includes a plurality of first auxiliary members provided on one principal surface of the first planar conductor pattern and extending in the first direction, the first auxiliary members being spaced apart in a third direction different from the first direction.

Abstract translation: 电路板包括主要部分，其通过在预定方向上堆叠由柔性材料制成的多个基片并且在压力下粘合基片而获得，并且至少一个平面导体图案设置在主体部分中并且包括凹部和 凸部。 凹部和凸部沿与预定方向垂直或大致垂直的方向延伸。 凹部在与规定方向平行或大致平行的方向凹陷。 凸部沿与凹部凹陷的方向相反的方向突出。 所述至少一个平面导体图案包括具有凹部的第一平面导体图案和在第一方向上延伸的凸部。 电路板还包括设置在第一平面导体图案的一个主表面上并沿第一方向延伸的多个第一辅助构件，第一辅助构件在与第一方向不同的第三方向上间隔开。

公开(公告)号：US20160309594A1

公开(公告)日：2016-10-20

申请号：US15194995

申请日：2016-06-28

Applicant: MC10, Inc.

Inventor： Yung-Yu Hsu

IPC: H05K1/18 ,  H05K1/09 ,  H05K1/03 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/185 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/118 ,  H05K1/147 ,  H05K1/148 ,  H05K1/189 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/09245 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/2009

Abstract: Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.

Abstract translation: 提供缓冲结构，其可以用于减少适应电子系统中的应变，其包括与更刚性的装置部件电连通的顺应部件。 缓冲结构设置在适配电子系统上或至少部分嵌入适配电子系统中，使得缓冲结构与柔顺部件和更刚性的器件部件之间的连接区域的至少一部分重叠。 缓冲结构可以具有比适形电子系统的密封剂更高的杨氏模量值。

公开(公告)号：US20160255719A1

公开(公告)日：2016-09-01

申请号：US14763074

申请日：2014-12-03

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Song SONG ,  Kazuyoshi NAGAYAMA

IPC: H05K1/03 ,  H05K3/06 ,  H05K1/11 ,  H05K1/09 ,  H05K1/02

CPC classification number: H05K1/0393 ,  G02F1/13452 ,  H05K1/0248 ,  H05K1/0296 ,  H05K1/09 ,  H05K1/115 ,  H05K3/06 ,  H05K2201/0391 ,  H05K2201/09227 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/09272 ,  H05K2201/10128 ,  H05K2201/10136

Abstract: The present disclosure discloses a wiring board used to connect a driving chip and a display panel, a flexible display panel and a display device. Signal output ends on the driving chip and signal input ends on the display panel may be arranged in pairs; and the wiring board may include fanout lines each of which is configured to connect a pair of signal output end and the signal input end. The wiring board may include a substrate; a plurality of segments of first connection lines having first resistivity is arranged on a first surface of the substrate; a plurality of segments of second connection lines having second resistivity is arranged on a second surface of the substrate opposite to the first surface. At least parts of the fanout lines are formed by connecting the first connection lines and the second connection lines.

Abstract translation: 本公开公开了一种用于连接驱动芯片和显示面板的接线板，柔性显示面板和显示装置。 驱动芯片上的信号输出结束，显示面板上的信号输入端可以成对布置; 并且布线板可以包括扇出线，每个扇出线被配置为连接一对信号输出端和信号输入端。 布线基板可以包括基板; 在基板的第一表面上布置有具有第一电阻率的第一连接线的多个段; 具有第二电阻率的第二连接线的多个段布置在与第一表面相对的基板的第二表面上。 扇出线的至少一部分通过连接第一连接线和第二连接线而形成。

公开(公告)号：US09277641B2

公开(公告)日：2016-03-01

申请号：US13857022

申请日：2013-04-04

Applicant: QUALCOMM Incorporated

Inventor： Ahmed Abdel Monem Youssef ,  Li-Chung Chang ,  Ehab Ahmed Sobhy Abdel Ghany ,  Rui Xu ,  Wingching Vincent Leung ,  Allen He

IPC: H05K1/02 ,  H04B3/02 ,  H04B1/44 ,  H04B7/04 ,  H04B1/00

CPC classification number: H05K1/0228 ,  H04B1/005 ,  H04B1/44 ,  H04B3/02 ,  H04B7/04 ,  H05K1/0219 ,  H05K2201/09245 ,  Y10T307/74

Abstract: Techniques for routing and shielding signal lines to improve isolation between the signal lines are disclosed. In an exemplary design, an apparatus includes first, second, and third signal lines and a switch. The first, second, and third signal lines are configurable to carry first, second, and third signals, respectively. The switch is coupled between the second signal line and AC ground and is closed when the second signal line is not carrying the second signal. The second signal line isolates the first and third signal lines when the switch is closed. Adjacent signal lines are not active at the same time. A signal line may include positive and negative signal lines, which may have at least one cross over in order to cancel coupling between the positive and negative signal lines.

Abstract translation: 公开了用于路由和屏蔽信号线以改善信号线之间的隔离的技术。 在示例性设计中，装置包括第一，第二和第三信号线和开关。 第一，第二和第三信号线可配置为分别承载第一，第二和第三信号。 开关耦合在第二信号线和AC地之间，并且当第二信号线不携带第二信号时闭合。 当开关闭合时，第二信号线隔离第一和第三信号线。 相邻信号线同时不起作用。 信号线可以包括正和负信号线，其可以具有至少一个交叉以消除正和负信号线之间的耦合。