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    WIRELESS IC DEVICE
    71.
    发明申请
    WIRELESS IC DEVICE 有权
    无线IC器件

    公开(公告)号：US20090278760A1

    公开(公告)日：2009-11-12

    申请号：US12510338

    申请日：2009-07-28

    Applicant: Mikiko Kimura ,  Noboru Kato

    Inventor： Mikiko Kimura ,  Noboru Kato

    IPC: H01Q1/50 ,  H01Q1/38

    CPC classification number: G06K19/07749 ,  G06K19/07756 ,  H01Q1/2208 ,  H05K1/0269 ,  H05K3/303 ,  H05K2201/09918 ,  H05K2201/09954 ,  H05K2201/10636 ,  H05K2201/10727 ,  H05K2203/166 ,  Y02P70/611 ,  Y02P70/613

    Abstract: A wireless IC device includes a wireless IC chip; a feeder circuit board which has the wireless IC chip located thereon, is magnetically coupled to a radiation plate, supplies electric power to the wireless IC chip, and relays signals between the wireless IC chip and the radiation plate; and a substrate on which the feeder circuit board is placed. On the substrate, there are formed a plurality of positioning markers indicating the boundaries of a plurality of positioning areas in which the feeder circuit board is selectively placed.

    Abstract translation: 无线IC器件包括无线IC芯片; 具有位于其上的无线IC芯片的馈电电路板磁耦合到辐射板，向无线IC芯片供电，并在无线IC芯片和辐射板之间中继信号; 以及放置有供电电路基板的基板。 在基板上，形成有多个定位标记，其指示多个定位区域的边界，馈电电路板选择放置在该定位区域中。

    CIRCUIT BOARD AND ELECTRONIC DEVICE USING THE SAME
    73.
    发明申请
    CIRCUIT BOARD AND ELECTRONIC DEVICE USING THE SAME 有权
    电路板和使用该电路的电子设备

    公开(公告)号：US20090263983A1

    公开(公告)日：2009-10-22

    申请号：US12189802

    申请日：2008-08-12

    Applicant: CHANG-TE LIAO

    Inventor： CHANG-TE LIAO

    IPC: H01R12/00

    CPC classification number: H05K1/0269 ,  H05K1/111 ,  H05K3/303 ,  H05K3/3421 ,  H05K2201/09063 ,  H05K2201/09381 ,  H05K2201/09918 ,  H05K2203/166 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49165

    Abstract: A circuit board includes four positioning pads placed on a surface of the circuit board, four positioning holes corresponding to the positioning pads, respectively, and a solder mask placed on the surface around the periphery of the positioning pads. An arc-shaped recess is defined at a side of each positioning pad near the corresponding positioning hole and the space between the edges of the positioning pad and the positioning hole ranges from 0.2 mm to 0.5 mm.

    Abstract translation: 电路板包括放置在电路板的表面上的四个定位焊盘，分别对应于定位焊盘的四个定位孔和放置在定位焊盘周围表面上的焊接掩模。 在相应定位孔附近的每个定位垫的一侧限定有弧形凹部，并且定位垫和定位孔的边缘之间的间隔在0.2mm至0.5mm的范围内。

    Ceramic substrate and method of breaking same
    74.
    发明授权
    Ceramic substrate and method of breaking same 有权
    陶瓷基材和破碎方法

    公开(公告)号：US07575954B2

    公开(公告)日：2009-08-18

    申请号：US11323269

    申请日：2005-12-30

    Applicant: Xiao-Hua Kong

    Inventor： Xiao-Hua Kong

    IPC: H01L21/44 ,  H01L21/48

    CPC classification number: H01L21/67132 ,  H01L21/786 ,  H05K1/0269 ,  H05K1/0306 ,  H05K3/0052 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09918 ,  H05K2203/1383 ,  H05K2203/302 ,  Y10T29/49135

    Abstract: A ceramic substrate (100) includes a top surface, a plurality of identification marks (104), a protective compound (110), a bottom surface, and a plurality of grooves (106). The top surface includes a first area and a second area. The first area is defined at one or more edges portions of the top surface. The second area is defined inside the first area. The identification marks are arranged on the first area. The protective compound is covered on the second area. The grooves are defined at the bottom surface, and corresponding to the identification marks. A related method for breaking a ceramic substrate includes: (a) pasting one or more tapes on the first area; (b) covering protective compound on the second area; (c) removing the tapes; (d) cutting the protective compound according to the identification marks; and (e) breaking the ceramic substrate into individual circuit unit pieces along the grooves.

    Abstract translation: 陶瓷基板（100）包括顶表面，多个识别标记（104），保护化合物（110），底表面和多个凹槽（106）。 顶表面包括第一区域和第二区域。 第一区域被限定在顶表面的一个或多个边缘部分。 第二个区域定义在第一个区域内。 识别标记布置在第一区域上。 保护性化合物覆盖在第二区域。 凹槽限定在底面，并与识别标记对应。 破坏陶瓷基板的相关方法包括：（a）在第一区域上粘贴一个或多个带; （b）在第二区覆盖保护化合物; （c）清除胶带; （d）根据识别标记切割保护性化合物; 和（e）沿着凹槽将陶瓷基板分解成单独的电路单元件。

    Method for determining position of reference point
    76.
    发明授权
    Method for determining position of reference point 有权
    确定参考点位置的方法

    公开(公告)号：US07522262B2

    公开(公告)日：2009-04-21

    申请号：US11141393

    申请日：2005-06-01

    Applicant: Hiroyuki Sugawara ,  Takeshi Goto ,  Kounosuke Kitamura ,  Hiroshi Aoyama

    Inventor： Hiroyuki Sugawara ,  Takeshi Goto ,  Kounosuke Kitamura ,  Hiroshi Aoyama

    IPC: G03B27/42 ,  G01B11/00

    CPC classification number: G03B27/32 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0026 ,  H05K2201/09781 ,  H05K2201/09918

    Abstract: A method for determining a position of a reference point in which there is no influence of aberration of a camera lens or the like, but an error caused by a failure in shape of an alignment mark can be reduced. An alignment mark consisting of a plurality of pattern portions (and background portions) centering at a design reference point is provided in advance. Positions of centers of border lines of the patterns are calculated. Obtained coordinate values of the centers are averaged in each axial direction. The averaged coordinate values are regarded as coordinate values of a machining reference point. Thus, even when a defect occurs in any pattern portion, an error caused by the defect is reduced so that the accuracy in machining can be improved.

    Abstract translation: 用于确定不影响照相机镜头等的像差的参考点的位置的方法，但是可以减少由对准标记的形状的故障引起的误差。 预先设置由以设计基准点为中心的多个图案部分（和背景部分）构成的对准标记。 计算模式边界线中心的位置。 获得的中心坐标值在每个轴向平均。 平均坐标值被认为是加工参考点的坐标值。 因此，即使当在任何图案部分发生缺陷时，由缺陷引起的误差降低，从而可以提高加工精度。

    WORK POSITION INFORMATION OBTAINING METHOD AND APPARATUS
    78.
    发明申请
    WORK POSITION INFORMATION OBTAINING METHOD AND APPARATUS 审中-公开
    工作位置信息获取方法和设备

    公开(公告)号：US20090035669A1

    公开(公告)日：2009-02-05

    申请号：US11912580

    申请日：2006-04-26

    Applicant: Hiroshi Uemura ,  Kazuhiro Terada ,  Takashi Fukui

    Inventor： Hiroshi Uemura ,  Kazuhiro Terada ,  Takashi Fukui

    IPC: G03F9/00 ,  G03B27/42

    CPC classification number: G03F7/70791 ,  G03F7/70775 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0082 ,  H05K2201/09918

    Abstract: A work position information obtaining apparatus capable of obtaining a position of a work with respect to a table with high accuracy. Moving a table with a work placed thereon relative to an imaging section. Obtaining work position information representing a position of the work with respect to the table based on imaged information obtained by imaging table and work reference marks by the imaging section and moving direction positions of the table at the time of imaging the table and work reference marks. Obtaining the positional deviations of the table at the time of imaging the table and work reference marks, with reference to a positional deviation of the table obtained in advance in association with each of the moving direction positions of the table. Then, eliminating an error included in the work position information arising from the difference between each imaged positional deviation.

    Abstract translation: 一种工作位置信息获取装置，其能够高精度地获得工作相对于工作台的位置。 移动桌子，放置在其上的工件相对于成像部分。 基于通过成像部分的成像表和工件参考标记获得的成像信息和在成像表和工件参考标记时的工作台的移动方向位置，获取表示工作相对于工作台的位置的工作位置信息。 参照表中的每个移动方向位置预先获得的表的位置偏差来获取桌子和工件参考标记成像时的桌子的位置偏差。 然后，消除由每个成像位置偏差之间的差引起的工作位置信息中包含的错误。

    Wired circuit board and production method thereof
    79.
    发明申请
    Wired circuit board and production method thereof 有权
    有线电路板及其制作方法

    公开(公告)号：US20090025963A1

    公开(公告)日：2009-01-29

    申请号：US12068501

    申请日：2008-02-07

    Applicant: Yuichi Takayoshi ,  Kazushi Ichikawa ,  Toshiki Naito

    Inventor： Yuichi Takayoshi ,  Kazushi Ichikawa ,  Toshiki Naito

    IPC: H05K1/03

    CPC classification number: H05K1/0269 ,  H05K1/111 ,  H05K3/303 ,  H05K3/3452 ,  H05K2201/094 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/163 ,  H05K2203/166 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155

    Abstract: A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a production method thereof. After a conductive pattern 3 including terminal portions 6 to connect with external terminals 22 of an electronic component 21 and criterion marks 8 to determine presence or absence of an inhibitory portion 23 that may be formed due to formation of an insulating cover layer 4 to inhibit connection between the terminal portions 6 and the external terminals 22 are formed on the insulating base layer 2 simultaneously, the insulating cover layer 4 to cover the conductive pattern 3 and an opening 7 from which the terminal portions 6 and the criterion marks 8 are exposed is formed. Thereafter, the presence or absence of the inhibitory portion 23 is determined with reference to the criterion marks 8 exposed from the opening 7 of the insulating cover layer 4.

    Abstract translation: 一种能够在确保高生产率和成本降低的同时，在端子部与外部端子之间的连接方面提高可靠性的布线电路板及其制造方法。 在包括与电子部件21的外部端子22连接的端子部分6的导电图案3和标准标记8之间以确定由于形成绝缘覆盖层4而形成的抑制部分23的存在或不存在以禁止连接 在绝缘基底层2上同时形成端子部分6和外部端子22之间，覆盖导电图案3的绝缘覆盖层4和端子部分6和标准标记8暴露的开口7形成 。 此后，参照从绝缘覆盖层4的开口部7露出的基准标记8来确定抑制部23的有无。

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