公开(公告)号：US09963542B2

公开(公告)日：2018-05-08

申请号：US15300645

申请日：2015-03-25

申请人： Shin-Etsu Chemical Co., Ltd. ,  Nippon Kayaku Kabushiki Kaisha

发明人： Toshio Shiobara ,  Junichi Sawada ,  Miyuki Wakao ,  Tsutomu Kashiwagi ,  Naofusa Miyagawa ,  Yoshihiro Kawada ,  Chie Sasaki ,  Naosuke Taniguchi

IPC分类号： C08G59/38 ,  C08G59/32 ,  C08G59/42

CPC分类号： C08G59/3281 ,  C08G59/20 ,  C08G59/38 ,  C08G59/4238 ,  C08G59/4269 ,  C08G59/4284

摘要： A silicone-modified epoxy resin which yields a cured product having low gas permeability and excellent strength; a composition of the silicone-modified epoxy resin; and an epoxy resin cured product obtainable by curing the composition, are provided.An epoxy resin represented by the following Formula (1): wherein R1 represents a hydrocarbon group having 1 to 6 carbon atoms; X represents an organic group having a norbornane epoxy structure, or a hydrocarbon group having 1 to 6 carbon atoms; n represents an integer from 1 to 3; plural R1s and plural Xs present in the formula may be respectively identical or different; and two or more of plural Xs represent an organic group having a norbornane epoxy structure.

公开(公告)号：US09963541B2

公开(公告)日：2018-05-08

申请号：US15108804

申请日：2015-01-27

申请人： NITTO DENKO CORPORATION

发明人： Tomoyuki Hirayama ,  Naoya Sugimoto

IPC分类号： G02B6/12 ,  G02B6/138 ,  C08G59/32 ,  C08G59/38 ,  C09D163/00 ,  C09D171/00 ,  G02B6/10 ,  C08L63/00 ,  C08G59/40 ,  C08G65/22 ,  G02B6/122 ,  C08G59/24 ,  C08G59/68 ,  C08G65/18

CPC分类号： C08G59/3218 ,  C08G59/24 ,  C08G59/38 ,  C08G59/4007 ,  C08G59/687 ,  C08G65/18 ,  C08G65/22 ,  C08L63/00 ,  C09D163/00 ,  C09D171/00 ,  G02B6/10 ,  G02B6/12 ,  G02B6/1221 ,  G02B6/138 ,  G02B2006/1219

摘要： According to the present invention, a photosensitive resin composition for an optical waveguide contains a resin component and a photopolymerization initiator. The resin component has an absorbance of less than 0.03 as measured at 2960 cm−1 by an attenuated total reflection measurement (ATR) method by means of a Fourier transform infrared spectrophotometer (FT-IR), and includes a polymerizable substituent-containing resin as a main component. Where the inventive optical waveguide photosensitive resin composition is used as a material for the optical waveguide, particularly as a core layer formation material for the optical waveguide, it is possible to reduce a loss, for example, by avoiding vibrational absorption occurring at an optical waveguide transmission light wavelength of 850 nm due to a resin skeleton.

公开(公告)号：US20180118876A1

公开(公告)日：2018-05-03

申请号：US15799790

申请日：2017-10-31

申请人： Seagate Technology LLC

发明人： Michael John Peterson ,  Michael R. Fabry

IPC分类号： C08G59/32 ,  G11B33/02 ,  G11B25/04 ,  C08L63/10 ,  C09J163/10 ,  C08G59/18 ,  G11B5/48 ,  G11B33/14

CPC分类号： C08G59/3209 ,  B32B2037/1253 ,  C08G59/184 ,  C08G59/50 ,  C08L63/10 ,  C09D163/00 ,  C09J163/10 ,  G11B5/4826 ,  G11B25/043 ,  G11B33/02 ,  G11B33/1446 ,  H01L21/56 ,  H01L21/563 ,  H01L23/295 ,  H05K3/285 ,  H05K2203/013 ,  C08K3/00

摘要： The present disclosure relates to encapsulant compositions for use with hard disk drive devices.

公开(公告)号：US09944760B2

公开(公告)日：2018-04-17

申请号：US15120482

申请日：2015-02-18

申请人： Shin-Etsu Chemical Co., Ltd. ,  Nippon Kayaku Kabushiki Kaisha

发明人： Toshio Shiobara ,  Junichi Sawada ,  Miyuki Wakao ,  Tsutomu Kashiwagi ,  Naofusa Miyagawa ,  Yoshihiro Kawada ,  Chie Sasaki ,  Naosuke Taniguchi

IPC分类号： C08G77/50 ,  C08G77/14 ,  C08G77/38 ,  C08G59/34 ,  C08G59/40 ,  C08G59/02 ,  C08G59/30 ,  C08G59/32 ,  C09J183/14 ,  C08G59/42 ,  C08G59/68 ,  C08G77/20

CPC分类号： C08G77/50 ,  C08G59/027 ,  C08G59/306 ,  C08G59/3281 ,  C08G59/34 ,  C08G59/40 ,  C08G59/4215 ,  C08G59/4276 ,  C08G59/4284 ,  C08G59/50 ,  C08G59/688 ,  C08G77/14 ,  C08G77/20 ,  C08G77/38 ,  C09J183/14 ,  C08K5/11 ,  C08K5/12 ,  C08K5/17

摘要： The purpose of the present invention is to provide a silicone-modified epoxy resin which produces a cured product having excellent low gas permeability and strength; a composition of the resin; and an epoxy resin cured product obtainable by curing the composition.Disclosed is an epoxy resin represented by the following Formula (1): wherein R1 independently represents a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; R2 independently represents a monovalent aliphatic hydrocarbon group having 1 to 12 carbon atoms; R3 independently represents a monovalent aliphatic hydrocarbon group having 1 to 12 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; R4 represents an oxygen atom or a divalent hydrocarbon group having an aliphatic cyclic structure; R5 represents silicone chain having a norbornane epoxy structure at either end; and X represents an organic group having a norbornane epoxy group.

公开(公告)号：US20180086895A1

公开(公告)日：2018-03-29

申请号：US15515230

申请日：2016-09-14

申请人： SHENGYI TECHNOLOGY CO., LTD.

发明人： Jiang YOU ,  Tianhui HUANG ,  Yongjing XU ,  Zhongqiang YANG

IPC分类号： C08K3/32 ,  C08L63/00 ,  C08G59/40 ,  C08L79/04 ,  C08G59/32 ,  C08K5/49

CPC分类号： C08K3/32 ,  B32B15/092 ,  B32B27/38 ,  C08G59/1477 ,  C08G59/3236 ,  C08G59/4014 ,  C08J5/24 ,  C08J2363/00 ,  C08K5/49 ,  C08L63/00 ,  C08L79/04 ,  C08L2201/02 ,  C08L2203/206 ,  H05K1/024 ,  H05K1/0346 ,  H05K1/0373 ,  H05K3/38 ,  H05K2201/012

摘要： The present invention provides a halogen-free thermosetting resin composition, a prepreg, a laminate and a printed circuit board comprising the same. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free thermosetting resin, (B) from 10 to 35 parts by weight of a phenolic curing agent, and (C) a phosphorus-containing flame retardant. The prepregs, laminates and printed circuit boards prepared from the halogen-free thermosetting resin composition of the present invention have excellent dimensional stability and dielectric properties, high adhesive force, high heat resistance, low water absorption and better processability, and can achieve halogen-free flame retardancy and reach UL94 V-0.

公开(公告)号：US09920160B2

公开(公告)日：2018-03-20

申请号：US15305090

申请日：2015-04-29

申请人： ZHEJIANG UNIVERSITY

发明人： Chao Gao ,  Yaochen Zheng ,  Li Peng ,  Shengying Cai ,  Zhulin Weng

IPC分类号： C08G59/02 ,  C08G59/32

CPC分类号： C08G59/022 ,  C08G59/3209 ,  C08G59/3263

摘要： A method for a synthesis of a polymer containing multiple epoxy groups includes steps of: under protection of nitrogen or argon, with a photosensitive free radical initiator under an ultraviolet light irradiation, initiating a mixture of a dithiol compound and alkynyl glycidyl ether or other alkynyl-containing compounds to proceed a thiol-yne polymerization, so as to obtain the polymer. The number of the epoxy groups is able to be adjusted through changing a type of a dithiol monomer, a mixing ratio of the dithiol monomer, and a mixing ratio between the alkynyl glycidyl ether and other alkynyl compounds. The present invention has advantages of: fast reaction, convenient process, easy post-processing, a large number of the epoxy groups, and adjustable and controllable content. The obtained polymer has a wide potential application in fields of coating, adhesive, ink, encapsulating material, resin for composite material, additive, high performance material, function material, and so on.

公开(公告)号：US09862805B2

公开(公告)日：2018-01-09

申请号：US14469630

申请日：2014-08-27

申请人： CYTEC TECHNOLOGY CORP.

发明人： Yi Wei ,  Alexandre Baidak ,  James Senger

IPC分类号： C08J3/24 ,  C08J3/12 ,  C08G59/32 ,  C08G59/50 ,  C08G73/10 ,  C08L63/00 ,  C08L71/12 ,  C08L79/08 ,  C08L81/06

CPC分类号： C08J3/246 ,  C08G59/3227 ,  C08G59/5086 ,  C08G73/106 ,  C08J3/12 ,  C08J2300/24 ,  C08J2371/12 ,  C08J2379/08 ,  C08J2409/02 ,  C08J2463/00 ,  C08J2481/06 ,  C08L63/00 ,  C08L71/12 ,  C08L71/126 ,  C08L79/08 ,  C08L81/06 ,  C08L2205/03 ,  C08L2205/22 ,  C08L2207/04 ,  C08L2312/02 ,  C08L2312/04 ,  Y10T428/2982 ,  C08L2666/14 ,  C08L81/00 ,  C08L2666/22

摘要： Thermoplastic polymer particles directly cross-linked together or cross-linked via a separate and independent polymer network to form an inter-penetrating network are disclosed herein, along with methods of manufacturing and use as interleaf tougheners of pre-pregs and composite articles.

公开(公告)号：US20170365756A1

公开(公告)日：2017-12-21

申请号：US15619185

申请日：2017-06-09

申请人： Shin-Etsu Chemical Co., Ltd.

发明人： Yoshihiro TSUTSUMI ,  Tadashi TOMITA

IPC分类号： H01L33/56 ,  C08K3/36 ,  C08K9/02 ,  C08K7/18 ,  C08G59/32 ,  C08G59/24 ,  C08K3/22 ,  C08G59/68 ,  C08G59/42 ,  H01L33/60 ,  C08K5/527

CPC分类号： H01L33/56 ,  C08G59/226 ,  C08G59/24 ,  C08G59/3245 ,  C08G59/42 ,  C08G59/4238 ,  C08G59/5073 ,  C08G59/686 ,  C08K3/00 ,  C08K3/013 ,  C08K3/014 ,  C08K3/22 ,  C08K3/36 ,  C08K5/527 ,  C08K7/18 ,  C08K9/02 ,  C08K2003/2241 ,  C08L63/00 ,  H01L33/60

摘要： Provided are a white heat-curable epoxy resin composition capable of yielding a cured product that is tough and superior in initial reflection rate and heat resistance; and a semiconductor device with a light receiving element and other semiconductor elements being encapsulated by such cured product. The white heat-curable epoxy resin composition contains: (A) a prepolymer as a molten mixture of (A-1) an epoxy resin: a triazine derivative epoxy resin and/or an alicyclic epoxy compound having an epoxy group and an alicyclic structure in one molecule and being non-fluid at 25° C., (A-2) an acid anhydride having no carbon-carbon double bond and (A-3) an acrylic resin-based modifier having an epoxy group and a weight-average molecular weight of 1,000 to 30,000; (B) a white pigment containing a titanium oxide; (C) an inorganic filler; (D) a curing accelerator; and (E) an antioxidant.

公开(公告)号：US20170327629A1

公开(公告)日：2017-11-16

申请号：US15581171

申请日：2017-04-28

申请人： Chang Chun Plastics Co., Ltd.

发明人： Yu-Jen CHEN ,  Sung-Kuang CHUNG ,  Chang-Lin HUNG ,  An-Pang TU ,  Kuen-Yuan HWANG

IPC分类号： C08G59/08 ,  C08L61/14 ,  C08G59/32 ,  C08G8/04 ,  C08G59/18 ,  C08G14/12 ,  C08L63/00 ,  C08G59/62

CPC分类号： C08G59/08 ,  C08G8/04 ,  C08G8/36 ,  C08G14/12 ,  C08G59/186 ,  C08G59/3218 ,  C08G59/625 ,  C08L61/14 ,  C08L63/00

摘要： Polyphenolic condensates and epoxidized products prepared from said condensates are prepared by a reaction utilizing multi catalysts to control the weight average molecular weight (Mw) and the number average molecular weight (Mn). Improved color and ultraviolet absorbance are possessed by the condensates described herein.

公开(公告)号：US20170313809A1

公开(公告)日：2017-11-02

申请号：US15520508

申请日：2014-10-27

申请人： ZEON CORPORATION

发明人： Makoto Fujimura ,  Takeshi Sakano

IPC分类号： C08G59/32 ,  C08J5/18 ,  C08L63/10 ,  B32B27/38 ,  C08J5/24 ,  B32B27/42

CPC分类号： C08G59/3272 ,  B32B5/024 ,  B32B7/04 ,  B32B7/12 ,  B32B15/085 ,  B32B15/092 ,  B32B15/14 ,  B32B15/20 ,  B32B17/00 ,  B32B27/08 ,  B32B27/12 ,  B32B27/20 ,  B32B27/26 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/38 ,  B32B27/42 ,  B32B2255/205 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0261 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2262/10 ,  B32B2262/101 ,  B32B2270/00 ,  B32B2307/21 ,  B32B2307/304 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/538 ,  B32B2307/712 ,  B32B2307/732 ,  B32B2307/746 ,  B32B2457/00 ,  B32B2457/20 ,  B32B2457/208 ,  C08G59/20 ,  C08G59/304 ,  C08G59/4284 ,  C08G59/5086 ,  C08G59/621 ,  C08J5/18 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/10 ,  C08L63/00 ,  C08L63/10 ,  C08L2203/20 ,  C08L2205/02 ,  H05K1/0326 ,  H05K1/0353

摘要： A curable epoxy composition comprising a polyvalent epoxy compound (A) having a biphenyl structure and/or condensed polycyclic structure, a phosphorus-containing epoxy compound (B) having a structure shown by the following formula (1) or (2), and a triazine structure-containing phenol resin (C) and a film, laminated film, prepreg, laminate, cured article, and composite article obtained using the same are provided. Where, in the formula (1), each of R1 and R2 respectively independently represents a hydrocarbon group having 1 to 6 carbon atoms, the pluralities of R1 and R2 may be the same or different, and each of “m” and “n” respectively independently represents an integer of 0 to 4, and where, in the formula (2), each of R1 and R2 respectively independently represents a hydrocarbon group having 1 to 6 carbon atoms, the pluralities of R1 and R2 may be the same or different, and each of “m” and “n” respectively independently represents an integer of 0 to 5.