公开(公告)号：US09773750B2

公开(公告)日：2017-09-26

申请号：US13749647

申请日：2013-01-24

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  John A. Higginson ,  Hsin-Hua Hu ,  Hung-Fai Stephen Law

IPC: B23K5/22 ,  B23K31/02 ,  H01L23/00 ,  H01L21/67

CPC classification number: H01L24/83 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/95 ,  H01L2224/29105 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29183 ,  H01L2224/75261 ,  H01L2224/75281 ,  H01L2224/75282 ,  H01L2224/75283 ,  H01L2224/75725 ,  H01L2224/7598 ,  H01L2224/83 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83805 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/83948 ,  H01L2224/95001 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01031 ,  H01L2924/01051 ,  H01L2924/01029 ,  H01L2924/01048 ,  H01L2924/01082 ,  H01L2924/0103

Abstract: Electrostatic transfer head array assemblies and methods of transferring and bonding an array of micro devices to a receiving substrate are described. In an embodiment, a method includes picking up an array of micro devices from a carrier substrate with an electrostatic transfer head assembly supporting an array of electrostatic transfer heads, contacting a receiving substrate with the array of micro devices, transferring energy from the electrostatic transfer head assembly to bond the array of micro devices to the receiving substrate, and releasing the array of micro devices onto the receiving substrate.

公开(公告)号：US09741286B2

公开(公告)日：2017-08-22

申请号：US14294494

申请日：2014-06-03

Applicant: LuxVue Technology Corporation

Inventor： Kapil V. Sakariya ,  Mohammad Hendijanifard ,  Tore Nauta

IPC: G09G5/10 ,  G09G3/3233 ,  G09G3/20

CPC classification number: G09G3/3233 ,  G09G3/2092 ,  G09G2300/0814 ,  G09G2300/0819 ,  G09G2300/0842 ,  G09G2320/0626 ,  G09G2360/141 ,  G09G2360/142 ,  G09G2360/144 ,  G09G2360/145 ,  G09G2360/148

Abstract: Exemplary methods and systems use a micro light emitting diode (LED) in an active matrix display to emit and sense light. Display panels, systems, and methods of operation are described in which LEDs may be used for both emission and sensing.

公开(公告)号：US09583533B2

公开(公告)日：2017-02-28

申请号：US14210295

申请日：2014-03-13

Applicant: LuxVue Technology Corporation

Inventor： Hsin-Hua Hu ,  Andreas Bibl

IPC: H01L29/06 ,  H01L27/15 ,  H01L33/18 ,  H01L25/075 ,  H01L33/08 ,  H01L33/16 ,  H01L23/00 ,  H01L33/00 ,  H01L33/24

CPC classification number: H01L27/153 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L25/0753 ,  H01L29/0669 ,  H01L29/0676 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/08 ,  H01L33/16 ,  H01L33/18 ,  H01L33/24

Abstract: A nanowire device and a method of forming a nanowire device that is poised for pick up and transfer to a receiving substrate are described. In an embodiment, the nanowire device includes a base layer and a plurality of nanowires on and protruding away from a first surface of the base layer. An encapsulation material laterally surrounds the plurality of nanowires in the nanowire device, such that the nanowires are embedded within the encapsulation material.

Abstract translation: 描述了纳米线器件和形成用于拾取和转移到接收衬底的纳米线器件的方法。 在一个实施例中，纳米线器件包括基底层和在基底层的第一表面上并远离基底层的多个纳米线。 封装材料横向围绕纳米线装置中的多个纳米线，使得纳米线嵌入封装材料内。

公开(公告)号：US09570002B2

公开(公告)日：2017-02-14

申请号：US14307336

申请日：2014-06-17

Applicant: LuxVue Technology Corporation

Inventor： Kapil V. Sakariya ,  Tore Nauta

IPC: G09G3/3225 ,  G09G3/32 ,  G06F3/041 ,  G06F3/042

CPC classification number: G09G3/3225 ,  G06F3/0412 ,  G06F3/042 ,  G09G2300/04 ,  G09G2300/0809 ,  G09G2320/0626 ,  G09G2320/0686 ,  G09G2358/00 ,  G09G2360/144 ,  G09G2360/148 ,  G09G2370/08

Abstract: Exemplary methods and systems use a micro light emitting diode (LED) in an active matrix display to emit light and a sensing IR diode to sense light. A display panel includes a display substrate having a display region, an array of subpixel circuits, and an array of selection devices. Each subpixel circuit includes a driving circuit to operate a corresponding infrared (IR) emitting LED in a light emission mode. Each selection device may be coupled to a corresponding sensing IR diode to operate the corresponding sensing IR diode in a light sensing mode.

Abstract translation: 示例性方法和系统使用有源矩阵显示器中的微型发光二极管（LED）发光并感测IR二极管来感测光。 显示面板包括具有显示区域，子像素电路阵列和选择装置阵列的显示基板。 每个子像素电路包括用于在发光模式下操作相应的红外（IR）发射LED的驱动电路。 每个选择装置可以耦合到对应的感测IR二极管，以在光感测模式下操作相应的感测IR二极管。

公开(公告)号：US09559142B2

公开(公告)日：2017-01-31

申请号：US14931695

申请日：2015-11-03

Applicant: LuxVue Technology Corporation

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L27/15 ,  H01L27/12 ,  H01L25/075 ,  H01L33/20 ,  H01L33/42 ,  H01L23/00 ,  H01L33/62 ,  G09G3/32

CPC classification number: H01L27/156 ,  G09G3/32 ,  H01L24/95 ,  H01L25/0753 ,  H01L27/124 ,  H01L33/20 ,  H01L33/42 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. A ground line is located in the non-pixel area and an array of ground tie lines run between the bank openings in the pixel area and are electrically connected to the ground line in the non-pixel area.

Abstract translation: 描述显示面板和形成显示面板的方法。 显示面板可以包括包括像素区域和非像素区域的薄膜晶体管基板。 像素区域包括堤开口的阵列和堤开口阵列内的一组底部电极。 接地线位于非像素区域中，并且阵列阵列在像素区域中的堤开口之间延伸并且电连接到非像素区域中的接地线。

公开(公告)号：US09484504B2

公开(公告)日：2016-11-01

申请号：US13894255

申请日：2013-05-14

Applicant: LuxVue Technology Corporation

Inventor： Andreas Bibl ,  Kelly McGroddy

IPC: H01L33/50 ,  H01L33/06 ,  H01L27/15

CPC classification number: H01L33/504 ,  H01L27/156 ,  H01L33/06 ,  H01L33/502 ,  H01L2224/18 ,  H01L2224/24 ,  H01L2224/82

Abstract: A light emitting device and method of manufacture are described. In an embodiment, the light emitting device includes a micro LED device bonded to a bottom electrode, a top electrode in electrical contact with the micro LED device, and a wavelength conversion layer around the micro LED device. The wavelength conversion layer includes phosphor particles. Exemplary phosphor particles include quantum dots that exhibit luminescence due to their size, or particles that exhibit luminescence due to their composition.

Abstract translation: 描述了一种发光器件及其制造方法。 在一个实施例中，发光器件包括结合到底部电极的微型LED器件，与微型LED器件电接触的顶部电极以及围绕微型LED器件的波长转换层。 波长转换层包括磷光体颗粒。 示例性荧光体颗粒包括由于其尺寸而显示发光的量子点或由于其组成而显示发光的颗粒。

公开(公告)号：US09343448B2

公开(公告)日：2016-05-17

申请号：US14860185

申请日：2015-09-21

Applicant: LuxVue Technology Corporation

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L25/16 ,  H01L33/06 ,  H01L33/38 ,  H01L33/54 ,  H01L33/62 ,  H01L33/42

CPC classification number: H01L25/167 ,  H01L24/24 ,  H01L24/29 ,  H01L24/75 ,  H01L24/82 ,  H01L24/83 ,  H01L24/95 ,  H01L27/1214 ,  H01L33/06 ,  H01L33/38 ,  H01L33/42 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29118 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/73267 ,  H01L2224/75281 ,  H01L2224/75282 ,  H01L2224/75725 ,  H01L2224/7598 ,  H01L2224/83193 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/92244 ,  H01L2924/01322 ,  H01L2924/10156 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. An array of micro LED devices are bonded to the corresponding array of bottom electrodes within the array of bank openings. An array of top electrode layers are formed electrically connecting the array of micro LED devices to a ground line in the non-pixel area.

公开(公告)号：US09308649B2

公开(公告)日：2016-04-12

申请号：US13776158

申请日：2013-02-25

Applicant: LuxVue Technology Corporation

Inventor： Dariusz Golda ,  John A. Higginson ,  Andreas Bibl ,  Paul Argus Parks ,  Stephen Paul Bathurst

IPC: B25J7/00 ,  B25J15/00 ,  B25J9/00 ,  B25J17/02 ,  H01L21/67 ,  H01L23/00

CPC classification number: B25J9/1015 ,  B25J7/00 ,  B25J9/0015 ,  B25J15/0052 ,  B25J15/0085 ,  B25J17/0208 ,  H01L21/67144 ,  H01L21/67721 ,  H01L21/68 ,  H01L21/6833 ,  H01L24/75 ,  H01L24/95 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75282 ,  H01L2224/7565 ,  H01L2224/75723 ,  H01L2224/75725 ,  H01L2224/75823 ,  H01L2224/759 ,  H01L2224/75901 ,  H01L2224/7592 ,  H01L2224/7598 ,  H01L2224/75984 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.

Abstract translation: 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，质量传递工具操纵器组件允许在微拾取阵列上的静电转印头阵列和载体衬底上的微器件阵列之间的主动对准。 可以检测质量传递工具操纵器组件的柔性元件的位移，以控制静电转印头阵列与微器件阵列之间的对准。

公开(公告)号：US20160086837A1

公开(公告)日：2016-03-24

申请号：US14957331

申请日：2015-12-02

Applicant: LuxVue Technology Corporation

Inventor： Dariusz Golda ,  Andreas Bibl

IPC: H01L21/683 ,  H02N13/00

CPC classification number: H01L21/6833 ,  B32B38/18 ,  B81C99/002 ,  H01L21/266 ,  H01L21/3083 ,  H01L21/76264 ,  H01L24/75 ,  H01L29/06 ,  H01L29/0619 ,  H01L29/0692 ,  H01L29/0696 ,  H01L29/407 ,  H01L29/66143 ,  H01L29/66348 ,  H01L29/7806 ,  H01L29/7813 ,  H01L29/872 ,  H01L29/8725 ,  H01L2224/7598 ,  H01L2924/1461 ,  H02N13/00 ,  Y10T156/17

Abstract: A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes.

公开(公告)号：US20160056204A1

公开(公告)日：2016-02-25

申请号：US14931695

申请日：2015-11-03

Applicant: LuxVue Technology Corporation

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L27/15 ,  H01L33/62 ,  H01L33/42

CPC classification number: H01L27/156 ,  G09G3/32 ,  H01L24/95 ,  H01L25/0753 ,  H01L27/124 ,  H01L33/20 ,  H01L33/42 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. A ground line is located in the non-pixel area and an array of ground tie lines run between the bank openings in the pixel area and are electrically connected to the ground line in the non-pixel area.