公开(公告)号：US20120008295A1

公开(公告)日：2012-01-12

申请号：US13174837

申请日：2011-07-01

申请人： Shinji OUCHI ,  Shigeru Yamada ,  Makoto Terui ,  Yoshinori Shizuno

发明人： Shinji OUCHI ,  Shigeru Yamada ,  Makoto Terui ,  Yoshinori Shizuno

IPC分类号： H05K1/18 ,  H05K3/42 ,  H05K1/11

CPC分类号： H01L23/49811 ,  H01L21/76885 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/02377 ,  H01L2224/0346 ,  H01L2224/03831 ,  H01L2224/0401 ,  H01L2224/0501 ,  H01L2224/05016 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05147 ,  H01L2224/05555 ,  H01L2224/05556 ,  H01L2224/05568 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/131 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00

摘要： A wiring board has a first resin insulation layer, a first conductive pattern formed on the first resin insulation layer, a second resin insulation layer formed on the first conductive pattern and having an opening portion exposing at least a portion of the first conductive pattern, a second conductive pattern formed on the second resin insulation layer, and a via conductor formed in the opening portion of the second resin insulation layer and electrically connecting the first conductive pattern and the second conductive pattern. The via conductor has a side surface extending between the first conductive pattern and the second conductive pattern and a bent portion where an inclination of the side surface of the via conductor changes in a depth direction of the via conductor.

摘要翻译： 布线板具有第一树脂绝缘层，形成在第一树脂绝缘层上的第一导电图案，形成在第一导电图案上并具有露出第一导电图案的至少一部分的开口部分的第二树脂绝缘层， 形成在第二树脂绝缘层上的第二导电图案，以及形成在第二树脂绝缘层的开口部分中并电连接第一导电图案和第二导电图案的通孔导体。 通孔导体具有在第一导电图案和第二导电图案之间延伸的侧表面和通孔导体的侧表面的倾斜在通孔导体的深度方向上变化的弯曲部分。

公开(公告)号：US20120006592A1

公开(公告)日：2012-01-12

申请号：US13174811

申请日：2011-07-01

申请人： Shinji Ouchi ,  Shigeru Yamada ,  Makoto Terui ,  Yoshinori Shizuno

发明人： Shinji Ouchi ,  Shigeru Yamada ,  Makoto Terui ,  Yoshinori Shizuno

IPC分类号： H05K1/11 ,  H05K3/02

CPC分类号： H01L24/05 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/02377 ,  H01L2224/03828 ,  H01L2224/03831 ,  H01L2224/0401 ,  H01L2224/05555 ,  H01L2224/05556 ,  H01L2224/05557 ,  H01L2224/05569 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/13026 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81385 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/3512 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A wiring board including a first insulation layer, a conductive pattern formed on the first insulation layer, a second insulation layer formed on the conductive pattern and the first insulation layer and having an opening portion exposing at least a portion of the conductive pattern, and a connection conductor formed in the opening portion of the second insulation layer such that the connection conductor is positioned on the portion of the conductive pattern. The connection conductor has a tip portion which protrudes from a surface of the second insulation layer and which has a tapered side surface tapering toward an end of the tip portion.

摘要翻译： 一种布线板，包括第一绝缘层，形成在第一绝缘层上的导电图案，形成在导电图案上的第二绝缘层和第一绝缘层，并且具有暴露导电图案的至少一部分的开口部分，以及 连接导体形成在第二绝缘层的开口部分中，使得连接导体位于导电图案的部分上。 连接导体具有从第二绝缘层的表面突出并且具有朝向尖端部的端部逐渐变细的锥形侧表面的尖端部分。

公开(公告)号：US08008129B2

公开(公告)日：2011-08-30

申请号：US12759919

申请日：2010-04-14

申请人： Shinji Ohuchi ,  Shigeru Yamada ,  Yasushi Shiraishi

发明人： Shinji Ohuchi ,  Shigeru Yamada ,  Yasushi Shiraishi

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L24/81 ,  H01L23/13 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/6834 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/05548 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A method of manufacturing a semiconductor device and a semiconductor device including a first semiconductor element mounted on a first surface of a base plate, wherein solder balls are formed on a second opposite surface of the base plate-such that the second opposite surface includes an area without solder balls. At least one second semiconductor element is mounted to the base plate at the area of the second surface without solder balls. The at least one semiconductor element may be mounted to the base plate using low molecular adhesive, or in the alternative, high temperature solder.

摘要翻译： 一种制造半导体器件和半导体器件的方法，包括安装在基板的第一表面上的第一半导体元件，其中焊球形成在基板的第二相对表面上，使得第二相对表面包括区域 没有焊球。 至少一个第二半导体元件在没有焊球的第二表面的区域处安装到基板。 可以使用低分子粘合剂或替代的高温焊料将至少一个半导体元件安装到基板。

公开(公告)号：US20110168537A1

公开(公告)日：2011-07-14

申请号：US13063750

申请日：2009-06-16

申请人： Shigeru Yamada

发明人： Shigeru Yamada

IPC分类号： H01H13/50

CPC分类号： H01H13/83 ,  H01H3/125 ,  H01H2219/056 ,  H01H2219/06 ,  H01H2219/062

摘要： A key switch structure capable of reducing the height of a key switch, reducing the number of components, and reducing manufacturing costs.The key switch structure includes: a key top; first and second linking mechanisms and adapted to support the key top; a membrane sheet having a contact point portion; a back plate disposed below the membrane sheet and having a function to guide light; and an LED sheet having an LED as a light emitting element disposed thereon, wherein the LED is disposed to be adjacent to the back plate.

摘要翻译： 一种能够降低钥匙开关高度的钥匙开关结构，减少元件数量，降低制造成本。 钥匙开关结构包括：钥匙顶; 第一和第二连接机构，并适应于支撑键顶; 具有接触点部分的膜片; 设置在所述膜片下方并具有引导光的功能的背板; 以及具有设置在其上的发光元件的LED的LED片，其中所述LED设置成与所述背板相邻。

公开(公告)号：US07840240B2

公开(公告)日：2010-11-23

申请号：US11920126

申请日：2006-05-11

申请人： Kohtaro Ohba ,  Shigeru Yamada

发明人： Kohtaro Ohba ,  Shigeru Yamada

IPC分类号： H04B1/38

CPC分类号： H04W74/085 ,  H04W52/0225 ,  H04W72/02 ,  H04W88/02 ,  Y02D70/166

摘要： A communication procedure has been developed that allows even a low-rate CPU to perform stable communication so as to realized wireless network nodes, which have a long communication distance and also have a long battery life. Each wireless network node decides its own time slot number by use of random numbers and transmits it after delaying the transmission by the number of time slots. When receiving the unique number from the wireless network node, a master unit transmits, to the wireless network node, an ACK signal together with the unique number. When receiving its unique number, the wireless network node gets into a sleep state for a period of time. In this way, each time communication is established, the number of active wireless network nodes is reduced.

摘要翻译： 已经开发了一种甚至允许低速率CPU执行稳定通信的通信过程，以实现具有长通信距离并且具有长电池寿命的无线网络节点。 每个无线网络节点通过使用随机数来决定其自己的时隙号，并在延迟发送时间之后发送它。 当从无线网络节点接收唯一号码时，主单元将无线网络节点与唯一号码一起发送ACK信号。 当接收到其唯一号码时，无线网络节点进入休眠状态一段时间。 以这种方式，每次建立通信时，减少了活动无线网络节点的数量。

公开(公告)号：US07758700B2

公开(公告)日：2010-07-20

申请号：US11573787

申请日：2005-08-12

申请人： Akihiro Fuchigami ,  Toshiyuki Mutoh ,  Yoichi Okamoto ,  Shigeru Yamada ,  Tomoyasu Hirasawa

发明人： Akihiro Fuchigami ,  Toshiyuki Mutoh ,  Yoichi Okamoto ,  Shigeru Yamada ,  Tomoyasu Hirasawa

IPC分类号： B08B9/08 ,  B08B9/20 ,  A47L13/40

CPC分类号： G03G15/0894 ,  B08B9/08

摘要： A cleaning method for cleaning a powder container by introducing a cleaning medium into the powder container from a first opening part of the powder container for attaching powder in the powder container to the cleaning medium and discharging the cleaning medium together with the powder from a second opening part situated opposite from the first opening part is disclosed. The method includes a step of releasing the cleaning medium from a position higher than the first opening part of the powder container.

摘要翻译： 一种清洁方法，用于通过从粉末容器的第一开口部分将清洁介质引入粉末容器中，用于将粉末容器中的粉末附着到清洁介质上并将清洁介质与粉末一起从第二开口排出 公开了与第一开口部分相对的部分。 该方法包括从高于粉末容器的第一开口部分的位置释放清洁介质的步骤。

公开(公告)号：US20090224350A1

公开(公告)日：2009-09-10

申请号：US12372770

申请日：2009-02-18

申请人： Shigeru Yamada

发明人： Shigeru Yamada

IPC分类号： H01L31/02

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2224/13

摘要： A semiconductor device is provided which has a semiconductor element having an element forming surface at which a sensor element is formed, a back surface on the opposite side of the element forming surface, and a light transmissive protective member laminated over the element forming surface via an adhering portion. The semiconductor device includes a region exposed from the protective member at the outer peripheral end portion of the semiconductor element, when viewed from the protecting member in a laminating direction.

摘要翻译： 提供一种半导体器件，其具有半导体元件，其具有形成有传感器元件的元件形成表面，元件形成表面的相对侧上的后表面，以及透光保护元件，其经由元件形成表面经由 粘附部分。 半导体器件包括从保护部件沿着层叠方向观察时从半导体元件的外周端部的保护部件露出的区域。

公开(公告)号：US20090103964A1

公开(公告)日：2009-04-23

申请号：US12232837

申请日：2008-09-25

申请人： Yasushi Takagi ,  Shigeru Yamada

发明人： Yasushi Takagi ,  Shigeru Yamada

IPC分类号： B41J5/00

CPC分类号： H01H3/125 ,  H01H13/83 ,  H01H2209/038 ,  H01H2209/06 ,  H01H2209/082 ,  H01H2215/006 ,  H01H2219/03 ,  H01H2219/06 ,  H01H2219/062 ,  H01H2221/07

摘要： A key switch arrangement is able to accomplish the compatibility with a normal keyboard in respect of profile without increasing the height of the keyboard and reduce the cost without adding new members for a light source. The key switch arrangement includes a key-top having an optically transparent key-top having a cutout letter part formed thereon, an optically transparent membrane sheet having a contact, an optically transparent plate member arranged under the membrane sheet, and a light source arranged in the membrane sheet. The light source emits light to pass the plate member and the membrane sheet to illuminate the cutout letter part on the key-top.

摘要翻译： 钥匙开关装置能够在不增加键盘的高度的情况下实现与普通键盘的兼容性，而不增加新的光源成员。 钥匙开关装置包括具有形成有切口字母部分的光学透明键盘的键盘，具有触点的光学透明膜片，布置在膜片下面的光学透明板状物和布置在其中的光源 膜片。 光源发光，使板件和膜片通过以照亮键顶上的切口字母部分。

公开(公告)号：US07401232B2

公开(公告)日：2008-07-15

申请号：US10482846

申请日：2003-03-18

申请人： Takatoshi Ono ,  Yoji Kumazaki ,  Shigeru Yamada ,  Hiroki Murakami ,  Tetsuya Inoue ,  Motoji Ohmori

发明人： Takatoshi Ono ,  Yoji Kumazaki ,  Shigeru Yamada ,  Hiroki Murakami ,  Tetsuya Inoue ,  Motoji Ohmori

IPC分类号： G06F12/14

CPC分类号： H04N21/42684 ,  H04N5/913 ,  H04N7/163 ,  H04N7/1675 ,  H04N21/4334 ,  H04N21/4623 ,  H04N21/63345

摘要： A key management apparatus which can be used to encrypt/decrypt content data in a content playback device includes a storing unit for storing a secret key, a key information decrypting unit for decrypting encrypted key information and an updating unit operable to update the secret key with an algorithm stored therein, when the decrypted key information is key-updating information. Seed information can be received for use with the algorithm to provide a new secret key, and preliminary trigger information can be used to poll a group of appliances to request key information to determine any duplication of appliances.

摘要翻译： 可以用于对内容再现装置中的内容数据进行加密/解密的密钥管理装置包括存储秘密密钥的存储单元，用于解密加密的密钥信息的密钥信息解密单元和可更新密钥的更新单元， 当解密的密钥信息是密钥更新信息时，存储其中的算法。 可以接收种子信息以与算法一起使用以提供新的秘密密钥，并且可以使用初步触发信息来轮询一组设备以请求密钥信息来确定任何重复的设备。

公开(公告)号：US06841853B2

公开(公告)日：2005-01-11

申请号：US10364373

申请日：2003-02-12

申请人： Shigeru Yamada

发明人： Shigeru Yamada

IPC分类号： H01L23/12 ,  H01L21/60 ,  H01L23/31 ,  H01L23/485 ,  H01L23/48 ,  H01L23/52

CPC分类号： H01L24/05 ,  H01L23/3114 ,  H01L24/03 ,  H01L24/13 ,  H01L2224/02351 ,  H01L2224/02375 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/05559 ,  H01L2224/05571 ,  H01L2224/06 ,  H01L2224/11334 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05552

摘要： A semiconductor device including a semiconductor chip having an electric circuit on a surface thereof, and an electrode pad formed on the surface of the semiconductor chip and which is electrically connected to the electric circuit. A conductive pattern is electrically connected to the pad, and a sealing resin covers the electric circuit and the conductive pattern. A part of the conductive pattern is exposed from the sealing resin, and a plurality of grooves are formed on the part of the conductive pattern. The plurality of grooves are disposed apart from each other and along a direction of stress of the expanding semiconductor chip. An external electrode is electrically connected to the conductive pattern. Stress of the external electrodes is thus relieved and as a result, reliability of the semiconductor device can be improved, because deterioration of the connecting quality can be prevented.

摘要翻译： 一种半导体器件，包括其表面上具有电路的半导体芯片和形成在半导体芯片的表面上并且与电路电连接的电极焊盘。 导电图形电连接到焊盘，并且密封树脂覆盖电路和导电图案。 导电图案的一部分从密封树脂露出，并且在导电图案的一部分上形成多个凹槽。 多个槽彼此分开并且沿着膨胀半导体芯片的应力方向分开设置。 外部电极电连接到导电图案。 因此外部电极的应力得以缓解，结果可以提高半导体器件的可靠性，因为可以防止连接质量的劣化。