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176 条记录 (耗时 0.029 秒)

    Method for selective activation and metallization of materials
    82.
    发明授权
    Method for selective activation and metallization of materials 失效
    材料选择性活化和金属化的方法

    公开(公告)号：US06524663B1

    公开(公告)日：2003-02-25

    申请号：US09333325

    申请日：1999-06-15

    申请人： Patrick V. Kelly ,  Gabriel M. Crean ,  Daniel J. Macauley

    发明人： Patrick V. Kelly ,  Gabriel M. Crean ,  Daniel J. Macauley

    IPC分类号： B05D132

    CPC分类号： C23C18/30 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/00844 ,  C23C18/1605 ,  C23C18/1608 ,  C23C18/1612 ,  H05K3/185 ,  C04B35/10 ,  C04B41/0045 ,  C04B41/4535 ,  C04B41/4554 ,  C04B41/4572 ,  C04B41/5122 ,  C04B41/4541 ,  C04B41/5127

    摘要： An activated substrate surface suitable for electronics and microsystems preparation is prepare by contacting the surface with a surface activation compound, e.g. organometallic based on palladium, platinum, rhodium or iridium. The photo labile ligand has an optical absorption band which overlaps with the wavelength of the UV. A UV lamp is used, in combination with a mask, to selectively irradiate the contacted surface. Irradiation of the surface with light of a suitable wavelength decomposes the organometallic compound to the activating metal. The surface is then ready for electroless plating with the desired conducting material. The mask is patterned to delineate areas where surface activation is not to occur. The organometallic compound absorbs ultraviolet radiation in the wavelength range 210-260 nm, or in the wavelength range 290-330 nm, in the solid state if the compound exists as a solid at 25° C. or in the liquid state if the compound exists as a liquid at 25° C.

    摘要翻译： 适用于电子和微系统制备的活化的基底表面通过使表面与表面活化化合物接触来制备，例如， 基于钯，铂，铑或铱的有机金属。 照片不稳定配体具有与UV的波长重叠的光吸收带。 使用UV灯与掩模组合以选择性地照射接触表面。 用合适波长的光照射表面将有机金属化合物分解成活化金属。 然后，表面准备好用所需的导电材料进行化学镀。 掩模被图案化以描绘不发生表面激活的区域。 有机金属化合物在固体状态下吸收波长范围210-260nm或波长范围290-330nm的紫外线，如果该化合物在25℃下以固体形式存在，或者如果化合物存在，则以液态存在 作为液体在25°C

    Thermally-sprayed composite selective emitter
    86.
    发明授权
    Thermally-sprayed composite selective emitter 失效
    热喷涂复合选择性发射极

    公开(公告)号：US06379789B1

    公开(公告)日：2002-04-30

    申请号：US09678904

    申请日：2000-10-04

    申请人： Christopher J. Crowley ,  Nabil A. Elkouh ,  Patrick J. Magari

    发明人： Christopher J. Crowley ,  Nabil A. Elkouh ,  Patrick J. Magari

    IPC分类号： B32B1800

    CPC分类号： C04B41/009 ,  C04B41/5045 ,  C04B41/52 ,  C04B41/87 ,  C04B41/89 ,  H02S10/30 ,  Y10T428/265 ,  C04B41/4527 ,  C04B41/5046 ,  C04B41/522 ,  C04B41/4529 ,  C04B41/4574 ,  C04B41/5122 ,  C04B35/10 ,  C04B35/565 ,  C04B35/505

    摘要： A composite emitter (100) for a thermophotovoltaic cell and other applications, and a method of forming the composite emitter. The composite emitter includes a substrate (102) and a selective emitter layer (104) composed of at least one substantially pure ceramic oxide selective emitter material applied to the substrate using a thermal spraying method. The substrate is preferably made of a durable material such as a silicon-based material or a refractory metal oxide. In one embodiment, the selective emitter layer may be composed of two or more selective emitter materials. In another embodiment, the composite emitter may further include a reflective metal layer (106). The method includes providing a substrate and plasma spraying one or more selective emitter materials onto the substrate to a thickness of between about 10 microns and about 400 microns to form the selective emitter layer. Preferably, the selective emitter layer has an in situ density of between 80% and 95% of the bulk density of the selective emitter material used.

    摘要翻译： 用于热光伏电池的复合发射器（100）和其它应用，以及形成复合发射极的方法。 复合发射器包括基板（102）和选择性发射极层（104），其由至少一个基本上纯的陶瓷氧化物选择性发射体材料构成，该材料使用热喷涂法施加到基板。 衬底优选由诸如硅基材料或难熔金属氧化物的耐用材料制成。 在一个实施例中，选择性发射极层可以由两个或更多个选择性发射极材料组成。 在另一个实施例中，复合发射器还可以包括反射金属层（106）。 该方法包括提供衬底和等离子体将一种或多种选择性发射体材料喷射到衬底上至约10微米至约400微米的厚度以形成选择性发射极层。 优选地，选择性发射极层的原位密度为所使用的选择性发射极材料的体积密度的80％至95％。

    METHOD OF PREPARING A CATALYTIC DEVICE AND AFTER-TREATING APPARATUS OF EXHAUST GAS USING THE CATALYTIC DEVICE
    88.
    发明申请
    METHOD OF PREPARING A CATALYTIC DEVICE AND AFTER-TREATING APPARATUS OF EXHAUST GAS USING THE CATALYTIC DEVICE 审中-公开
    催化装置的制备方法和使用催化装置的排气装置的后处理装置

    公开(公告)号：US20010001646A1

    公开(公告)日：2001-05-24

    申请号：US09348563

    申请日：1999-07-07

    发明人： MOON-CHAN KIM

    IPC分类号： F01N003/28 ,  B01D053/94

    CPC分类号： B01D53/9454 ,  C04B41/009 ,  C04B41/52 ,  C04B41/89 ,  C04B2111/0081 ,  F01N3/2828 ,  Y02T10/22 ,  C04B41/4539 ,  C04B41/5031 ,  C04B41/5033 ,  C04B41/4535 ,  C04B41/455 ,  C04B41/51 ,  C04B41/5122 ,  C04B41/5144 ,  C04B35/195 ,  C04B38/0006

    摘要： An after-treating apparatus of exhaust gas and a catalyst device installed therein is disclosed. The after-treating apparatus of exhaust gas primarily removes the exhaust gas in a first filtering device and a second filtering device, and secondarily purifies within the catalyst device. The first filtering device and the second filtering device are controlled by opening and closing a valve through a time control part. That is, when particulate of the exhaust gas is collected in the first filtering device, the second filtering device burns the collected particulate by means of an electric heater. Also, the catalyst device is prepared by wash-coating an active substrate on a honeycomb, the active substrate being produced by supporting platinum, nickel, and promoter on a supporter of alumina and chromic oxide.

    摘要翻译： 公开了一种废气后处理装置和安装在其中的催化剂装置。 废气的后处理装置主要去除第一过滤装置和第二过滤装置中的排气，并在催化装置内二次净化。 第一过滤装置和第二过滤装置通过时间控制部分打开和关闭阀来控制。 也就是说，当废气的颗粒被收集在第一过滤装置中时，第二过滤装置通过电加热器燃烧收集的颗粒。 而且，催化剂装置是通过在蜂窝状物上洗涤活性基材来制备的，活性基材是通过在氧化铝和氧化铬的载体上负载铂，镍和助催化剂制备的。

    Method for applying metal catalyst patterns onto ceramic for electroless copper deposition
    90.
    发明授权
    Method for applying metal catalyst patterns onto ceramic for electroless copper deposition 失效
    将金属催化剂图案用于无电镀铜沉积的方法

    公开(公告)号：US5139818A

    公开(公告)日：1992-08-18

    申请号：US710864

    申请日：1991-06-06

    申请人： Andrew M. Mance

    发明人： Andrew M. Mance

    IPC分类号： C04B41/51 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  C23C18/16 ,  C23C18/18 ,  C23C18/30 ,  H05K3/18

    CPC分类号： C04B41/009 ,  C04B41/5122 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  C23C18/14 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1865 ,  C23C18/1868 ,  C23C18/1879 ,  C23C18/30 ,  H05K3/185 ,  C04B2111/00844 ,  C23C18/1653

    摘要： Photochemical and electroless metallization techniques have been combined to create high resolution circuits with line widths and spaces of about one mil on alumina substrates. In this process, small amounts of a xylene-soluble platinum metallo-organic compound are first applied to the surface of the alumina substrate. A mask is then used to selectively expose the platinum metallo-organic compound to ultraviolet light in the areas that are to be metallized, so as to transform the platinum metallo-organic compound into a xylene-insoluble form. After a xylene rinse removes the original soluble platinum compound from the unexposed areas, the substrate is fired in air at about 450.degree. C. for about five minutes, so as to pyrolize the insoluble, irradiated platinum metallo-organic compound into catalytically active platinum. This is followed by electroless deposition of copper onto the ultraviolet-treated regions where the catalytically active platinum resides.

    摘要翻译： 光化学和无电镀金属化技术已经被组合起来以产生线路宽度和氧化铝基底上约1密耳空间的高分辨率电路。 在该方法中，首先将少量二甲苯可溶的铂金属有机化合物施加到氧化铝基材的表面。 然后使用掩模选择性地将铂金属有机化合物暴露于要金属化的区域中的紫外光，以将铂金属有机化合物转化为二甲苯不溶性形式。 在二甲苯冲洗后，从未曝光区域除去原始的可溶性铂化合物，将底物在约450℃的空气中焙烧约5分钟，以将不溶性的被照射的铂金属有机化合物热解成催化活性铂。 然后将铜无电沉积到紫外线处理的区域，其中催化活性铂所在的区域。