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公开(公告)号：US20240343647A1
公开(公告)日：2024-10-17
申请号：US18631760
申请日：2024-04-10
CPC分类号： C04B20/1033 , C04B14/48 , C04B20/123 , C09D5/002 , C09D7/20 , C09D127/16
摘要： A method of coating a surface of a concrete structure in situ, which comprises the step of applying to the surface of the concrete of the concrete structure a liquidous coating of a modified polyvinylidene fluoride (PVDF) or polyvinylidene difluoride (PVDF) material in an air dryable solution comprising: a PVDF or a PVDF co-polymer or a combination of PVDF and PVDF copolymer to form a blend with a compatible acrylic and/or other compatible polymer that is fluorinated to between about 30% to about 75% by weight excluding any solvent; the PVDF or PVDF co-polymer or blend thereof having at least about 45% PVDF molecular structure by weight when dried; the PVDF or PVDF co-polymer having a polymer crystallinity of at least about 30% by weight; and a solvent.
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公开(公告)号：US07743963B1
公开(公告)日：2010-06-29
申请号：US11364607
申请日：2006-02-28
IPC分类号： B32B3/06
CPC分类号： H01L23/10 , H01L23/047 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H05K3/341 , H01L2924/00
摘要： A solderable cover for solder attachment to an electronic substrate comprises a non-solderable cover defining an attachment pattern, a solderable metal layer in the shape of the attachment pattern, and a layer of adhesive bonding the solderable metal layer to the attachment pattern of the non-solderable cover, wherein the adhesive exhibits bond strength and resiliency sufficient to maintain the solderable metal layer attached to the non-solderable cover when raised in temperature to a melting temperature of a solder.
摘要翻译： 用于焊接附着到电子基板的可焊接盖包括限定附接图案的不可焊接盖，附接图案形状的可焊接金属层，以及将可焊接金属层粘合到非可焊接附着图案的粘合剂层， 其中当在温度升至焊料的熔化温度时，所述粘合剂表现出足够的粘结强度和弹性以将可焊接金属层保持在不可焊接的覆盖物上。
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公开(公告)号：US07458472B2
公开(公告)日：2008-12-02
申请号：US11217832
申请日：2005-09-01
IPC分类号： A47F7/00
CPC分类号： H01L21/6836 , B32B7/12 , H01L2221/68313 , H01L2221/68327 , Y10T428/1307 , Y10T428/14 , Y10T428/239
摘要： A re-usable carrier structure comprises a carrier frame and a removable stretchable carrier base supported thereby. A tacky adhesive layer is disposed on the carrier base, and semiconductor chips or other article(s) carried adhere to the adhesive layer. When it is desired to remove the article(s), an ejector displaces and stretches the carrier base. After the article(s) have been removed, the carrier base may be removed from the carrier frame which can be re-used to hold and transport article(s) after receiving a new carrier base.
摘要翻译： 可重复使用的载体结构包括载体框架和由其支撑的可移除的可拉伸载体基底。 在载体基底上设置粘性粘合剂层，并且将半导体芯片或其它物品附着在粘合剂层上。 当需要去除物品时，喷射器移动并延伸载体基座。 在物品被移除之后，载体基座可以从载体框架上移除，载体框架可以在接收到新的载体基底之后重新用于保持和运输物品。
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公开(公告)号：US06973716B2
公开(公告)日：2005-12-13
申请号：US10732984
申请日：2003-12-11
IPC分类号： G06K19/077 , H05K1/14 , H05K3/22 , H05K3/34 , H05K3/30
CPC分类号： G06K19/0775 , G06K19/07749 , H01L24/97 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H05K1/141 , H05K3/222 , H05K3/3442 , H05K2201/049 , H05K2201/10636 , H05K2201/10674 , Y02P70/611 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144
摘要： A method for making an electronic circuit arrangement comprises providing a substrate having an electrical conductor thereon, wherein the electrical conductor includes two contacts spaced apart substantially a predetermined distance; providing an electronic jumper having two contacts spaced apart substantially the predetermined distance; mounting an electronic device on the electronic circuit jumper and having two contacts respectively connected to the two contacts of the electronic circuit jumper and then mounting the electronic circuit jumper on the substrate.
摘要翻译： 一种用于制造电子电路装置的方法包括提供其上具有电导体的基板，其中所述电导体包括基本上预定距离间隔开的两个触点; 提供具有基本上预定距离间隔开的两个触头的电子跳线; 将电子设备安装在电子电路跳线上，并具有分别连接到电子电路跳线的两个触点的两个触点，然后将电子电路跳线安装在基板上。
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公开(公告)号：US20240342754A1
公开(公告)日：2024-10-17
申请号：US18631878
申请日：2024-04-10
IPC分类号： B05D7/16 , B05D1/02 , B05D1/28 , B05D3/10 , B05D3/12 , B05D7/00 , C09D7/20 , C09D127/16 , C09D127/22
CPC分类号： B05D7/16 , B05D1/02 , B05D1/28 , B05D3/102 , B05D3/12 , B05D7/54 , C09D7/20 , C09D127/16 , C09D127/22
摘要： A method of coating a surface of a metal structure in situ comprises the steps of applying an liquidous under coating of a modified polyvinylidene fluoride (PVDF) or polyvinylidene difluoride (PVDF) material in an air dryable solution, and then applying a liquidous over coating of a modified polyvinylidene fluoride (PVDF) or polyvinylidene difluoride (PVDF) material in an air dryable solution. The under coating has: a PVDF or a PVDF co-polymer or a combination thereof of less than about 75% blended with at least about 25% compatible acrylic and/or other compatible polymer; and the PVDF or PVDF co-polymer or blend thereof has a particular PVDF molecular structure and a polymer crystallinity. The over coating has: a PVDF or a PVDF co-polymer or a blend thereof that is fluorinated to at least about 70% and at least about 70% PVDF molecular structure.
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公开(公告)号：US20130146122A1
公开(公告)日：2013-06-13
申请号：US13758361
申请日：2013-02-04
IPC分类号： H01L31/048 , H01L31/05 , H01L31/052
CPC分类号： H01L31/048 , B32B17/10018 , B32B17/10871 , H01L31/02013 , H01L31/0512 , H01L31/1876 , Y02E10/50 , Y02P70/521
摘要： A laminated module or panel of solar cells and a laminating method for making same comprise an optically transparent top layer and a thermally conductive rear sheet of melt flowable insulating thermoplastic. Solar cells are encapsulated between the top layer and the rear sheet, and electrical connections are provided between a front surface of one solar cell and the back surface of another solar cell. Light passing through the transparent top layer impinges upon the solar cells. Electrical connections may be provided by melt flowable electrically conductive molecularly flexible thermoplastic adhesive or by metal strips or by both. The laminated module in one embodiment may be molecularly flexible and/or may exhibit a particular flexural modulus.
摘要翻译： 太阳能电池的层叠模块或面板及其制造方法包括光学透明顶层和可熔融流动的绝热热塑性导热后片。 太阳能电池被封装在顶层和后片之间，并且在一个太阳能电池的前表面和另一个太阳能电池的背面之间提供电连接。 穿过透明顶层的光照射在太阳能电池上。 电连接可以由熔体流动的导电分子柔性热塑性粘合剂或金属条或两者提供。 一个实施例中的层压模块可以是分子柔性的和/或可以表现出特定的弯曲模量。
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7.发明授权公开(公告)号：US06973581B2
公开(公告)日：2005-12-06
申请号：US10348433
申请日：2003-01-21
IPC分类号： G06K7/10 , G06K17/00 , G06Q10/10 , G07C13/00 , H01Q1/22 , H04L29/06 , G06F11/30 , G06F12/14 , G06F17/60 , H04L9/00 , H04L9/32
CPC分类号： H04L63/0861 , G06K7/10346 , G06K2017/0045 , G06K2017/009 , G06Q10/10 , G07C13/00 , H04L63/12
摘要： Internet voting or other Internet transaction comprises transmitting three information packets via the Internet. At least one information packet includes an identifier that is authenticated, such as a key, a biometric digitized signature or other biometric identifier. Where an information packet may include transaction information in a predetermined form, information packets including information in another form may be processed separately.
摘要翻译： 互联网投票或其他互联网交易包括通过因特网传输三个信息包。 至少一个信息分组包括被认证的标识符，例如密钥，生物特征数字化签名或其他生物特征识别符。 在信息分组可以包括预定形式的交易信息的情况下，可以单独处理包括另一形式的信息的信息分组。
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公开(公告)号：US06943688B2
公开(公告)日：2005-09-13
申请号：US10784704
申请日：2004-02-23
IPC分类号： G06K7/08 , G06K7/10 , G06K17/00 , G06Q10/10 , G07C13/00 , G08B13/24 , H01Q1/12 , H01Q1/22 , H01Q7/00 , H01Q21/28 , H01Q21/29 , H04L29/06 , G08B13/14
CPC分类号： H01Q1/2216 , F25D2700/08 , G06K7/10316 , G06K7/10336 , G06K7/10346 , G06K2017/0045 , G06K2017/009 , G06Q10/10 , G07C13/00 , G08B13/2417 , G08B13/2462 , G08B13/2471 , G08B13/2474 , G08B13/2477 , G08B13/2482 , H01Q1/1221 , H01Q1/22 , H01Q7/00 , H01Q21/28 , H01Q21/29 , H04L63/0861 , H04L63/12
摘要： An antenna arrangement comprises at least two antenna loops disposed and overlapping in a plane to define a detection region adjacent thereto in which the antenna loops transmit and/or receive electromagnetic signals and through which a wireless article may pass. The antenna arrangement may be coupled to a processor and/or utilization system for performing a desired function.
摘要翻译： 天线装置包括至少两个天线环路，其布置并重叠在一个平面中以限定与其相邻的检测区域，天线回路在其中发射和/或接收电磁信号，并且无线物品可以经过该检测区域。 天线布置可以耦合到用于执行期望功能的处理器和/或利用系统。
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公开(公告)号：US06886246B2
公开(公告)日：2005-05-03
申请号：US10140245
申请日：2002-05-07
IPC分类号： B42D15/10 , B32B3/08 , B32B7/12 , B32B33/00 , B32B37/20 , G06K19/077 , H01L23/055 , H01L23/498 , H01L23/538 , H01Q1/22 , H01Q1/36 , H01Q1/38 , H01Q7/00 , H01Q23/00 , H05K1/00 , H05K1/11 , H05K1/16 , H05K3/40 , H05K3/42 , H05K3/30 , H01K23/02
CPC分类号： B32B37/203 , B32B3/08 , B32B7/12 , B32B33/00 , B32B2309/02 , B32B2309/12 , B32B2425/00 , B32B2519/02 , G06K19/07743 , G06K19/07745 , G06K19/07747 , G06K19/07749 , G06K19/0775 , H01L23/055 , H01L23/49838 , H01L23/4985 , H01L23/49855 , H01L23/5387 , H01L24/45 , H01L24/48 , H01L24/97 , H01L2224/05001 , H01L2224/05644 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/16237 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2225/0651 , H01L2225/06517 , H01L2225/0652 , H01L2225/06541 , H01L2225/06572 , H01L2225/06579 , H01L2225/06582 , H01L2225/06586 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01021 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/07802 , H01L2924/14 , H01L2924/15174 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01Q1/22 , H01Q1/2225 , H01Q1/36 , H01Q1/38 , H01Q7/00 , H01Q7/005 , H01Q23/00 , H05K1/0393 , H05K1/113 , H05K1/165 , H05K3/4069 , H05K3/423 , H05K2201/0355 , H05K2201/0394 , H05K2201/10674 , H05K2203/1453 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49149 , Y10T29/49169 , Y10T29/53174 , H01L2924/00014 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/05624 , H01L2224/05647 , H01L2924/013 , H01L2224/05147 , H01L2224/05124
摘要： A method for making an article having an electronic device embedded therein comprises providing a substrate having first and second opposing broad planar surfaces; mounting an electronic device on the first broad planar surface of the substrate; and applying a layer of melt-flowable adhesive of substantially uniform thickness on the first broad planar surface of the substrate to cover the electronic device. The article produced thereby has the electronic device encapsulated by the layer of melt-flowable adhesive.
摘要翻译： 制造具有嵌入其中的电子器件的制品的方法包括提供具有第一和第二相对的宽平坦表面的衬底; 将电子器件安装在所述衬底的所述第一宽平坦表面上; 以及将基本均匀厚度的可熔融流动的粘合剂层施加在所述基底的所述第一宽平坦表面上以覆盖所述电子器件。 由此生产的制品具有由可熔融流动的粘合剂层包封的电子装置。
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公开(公告)号：US6108210A
公开(公告)日：2000-08-22
申请号：US166633
申请日：1998-10-05
CPC分类号： H01L24/83 , H01L24/29 , H01L24/81 , H05K3/321 , H01L2224/05001 , H01L2224/05026 , H01L2224/0508 , H01L2224/05155 , H01L2224/05171 , H01L2224/05571 , H01L2224/05573 , H01L2224/05639 , H01L2224/05644 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81801 , H01L2224/8319 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H05K2201/0129 , H05K2201/0133 , H05K2201/10636 , H05K2201/10674 , H05K2201/10977 , H05K2201/10984 , H05K3/244 , Y02P70/611
摘要： An electronic device includes one or more semiconductor chips interconnected to a next level substrate in a flip chip mode using flexible conductive adhesive having a low modulus of elasticity. The flexible conductive adhesive is applied as conductive bumps on the contact pads of the substrate or on the contact pads of the semiconductor chips and is a flexible thermoplastic or thermosetting resin filled with electrically-conductive particles. Other electronic devices, such as packaged components including resistors, capacitors and the like, are bonded with the same flexible conductive adhesive bump approach as is employed for the semiconductor chips. The contact pads of both the chip and the next level substrate are preferably passivated with a metallic coating, preferably a precious metal, prior to interconnection to inhibit oxidation of the pads. A flexible insulating organic underfill may be used, preferably one having substantially the same low modulus of elasticity as that of the flexible conductive adhesive.
摘要翻译： 电子装置包括以倒装芯片模式互连到下一级衬底的一个或多个半导体芯片，使用具有低弹性模量的柔性导电粘合剂。 柔性导电粘合剂作为导电凸起施加在衬底的接触焊盘或半导体芯片的接触焊盘上，并且是填充有导电颗粒的柔性热塑性或热固性树脂。 诸如包括电阻器，电容器等的封装元件的其它电子器件用与半导体芯片所采用的相同的柔性导电粘合剂凸块接合方式结合。 在互连之前，芯片和下一级衬底的接触焊盘优选用金属涂层，优选贵金属钝化，以抑制衬垫的氧化。 可以使用柔性绝缘的有机底部填充物，优选具有与柔性导电粘合剂基本相同的低弹性模量的柔性绝缘有机底部填充物。
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