公开(公告)号：US07671436B2

公开(公告)日：2010-03-02

申请号：US12151108

申请日：2008-05-02

申请人： Ahmed Nur Amin ,  Mark Adam Bachman ,  David Lee Crouthamel ,  John William Osenbach ,  Brian Thomas Vaccaro

发明人： Ahmed Nur Amin ,  Mark Adam Bachman ,  David Lee Crouthamel ,  John William Osenbach ,  Brian Thomas Vaccaro

IPC分类号： H01L31/00

CPC分类号： H05K1/0271 ,  H01L23/49811 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/1132 ,  H01L2224/11849 ,  H01L2224/13016 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/10674 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2224/13099 ,  H01L2924/00

摘要： Assemblies involving integrated circuit dies (e.g. packaged integrated circuits) and packaged dies electrically connected to circuit boards at times mechanically fail at conducting pads used for electrical interconnection. Such failure is mitigated by underlying appropriate pads with a compliant region having specific characteristics.

摘要翻译： 涉及集成电路管芯（例如封装的集成电路）和与电路板电连接的封装模具的组件有时在用于电互连的导电焊盘处机械故障。 这种故障由具有具有特定特征的柔顺区域的下层适当的垫减轻。

公开(公告)号：US20090298286A1

公开(公告)日：2009-12-03

申请号：US12154794

申请日：2008-05-27

申请人： Ahmed Nur Amin ,  Mark Adam Bachman ,  Frank A. Baiocchi ,  John Michael DeLucca ,  John William Osenbach

发明人： Ahmed Nur Amin ,  Mark Adam Bachman ,  Frank A. Baiocchi ,  John Michael DeLucca ,  John William Osenbach

IPC分类号： H01L21/44

CPC分类号： H01L22/12 ,  H01L21/4846 ,  H01L22/20 ,  H01L23/49866 ,  H01L24/13 ,  H01L2224/81444 ,  H01L2224/85444 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/244

摘要： Many electronic entities such as integrated circuits and discrete power devices have contact pads formed from successively deposited layers of nickel and a second metal such as gold. The resulting pad structure is used to make external electrical connection such as solder connection. Problems associated with failure of such connections are avoidable by inspecting the surface of the nickel layer for excessive small particle formation.

摘要翻译： 诸如集成电路和分立功率器件的许多电子实体具有由连续沉积的镍层和诸如金的第二金属形成的接触焊盘。 所得到的焊盘结构用于形成诸如焊接连接的外部电连接。 通过检查镍层的表面以避免过度的小颗粒形成，可避免与这种连接的故障有关的问题。

公开(公告)号：US20090072393A1

公开(公告)日：2009-03-19

申请号：US11884328

申请日：2006-02-24

申请人： Mark Adam Bachman ,  Donald Stephen Bitting ,  Daniel Patrick Chesire ,  Taeho Kook ,  Sailesh Mansinh Merchant

发明人： Mark Adam Bachman ,  Donald Stephen Bitting ,  Daniel Patrick Chesire ,  Taeho Kook ,  Sailesh Mansinh Merchant

IPC分类号： H01L23/488 ,  H01L21/44

CPC分类号： H01L24/11 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05558 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/10126 ,  H01L2224/11912 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0001 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/05552 ,  H01L2924/00

摘要： A solder bump structure and an under bump metallurgical structure. An upper surface of a semiconductor substrate comprises a first conductive pad (200) disposed thereon. A passivation layer (202) overlies the upper surface. A second conductive pad (212) is disposed in an opening (204) in the passivation layer and in contact with the first conductive pad. The under bump metallurgical structure (300) encapsulates the second conductive pad, covering an upper surface and sidewalls surfaces of the second conductive pad, protecting both the first and the second conductive pads from environmental and processing effects. According to the present invention, the conventional second passivation layer is not required. Methods for forming the various structures are also presented.

摘要翻译： 焊料凸块结构和凹凸金属结构。 半导体衬底的上表面包括设置在其上的第一导电焊盘（200）。 钝化层（202）覆盖在上表面上。 第二导电焊盘（212）设置在钝化层中的开口（204）中并与第一导电焊盘接触。 凸块下金属结构（300）封装第二导电焊盘，覆盖第二导电焊盘的上表面和侧壁表面，保护第一和第二导电焊盘免受环境和处理的影响。 根据本发明，不需要传统的第二钝化层。 还提出了形成各种结构的方法。

公开(公告)号：US07479695B2

公开(公告)日：2009-01-20

申请号：US11375302

申请日：2006-03-14

申请人： Mark Adam Bachman ,  David L. Crouthamel

发明人： Mark Adam Bachman ,  David L. Crouthamel

IPC分类号： H01L23/34

CPC分类号： H01L21/563 ,  H01L23/36 ,  H01L23/4334 ,  H01L24/17 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

摘要： An assembly comprises a stiffener, a circuit substrate and an integrated circuit (IC) chip. The stiffener has a surface with a first region and a second region. The circuit substrate covers the first region, while the IC chip overlies at least a portion of each of the first and second regions. Moreover, the assembly further comprises a plurality of first solder bumps and a plurality of second solder bumps. The first solder bumps contact both the IC chip and the circuit substrate. The second solder bumps are larger than the first solder bumps, contact the IC chip and are disposed above the second region of the stiffener.

摘要翻译： 组件包括加强件，电路基板和集成电路（IC）芯片。 加强件具有带有第一区域和第二区域的表面。 电路基板覆盖第一区域，而IC芯片覆盖第一和第二区域中的每一个的至少一部分。 此外，组件还包括多个第一焊料凸块和多个第二焊料凸块。 第一焊料凸块与IC芯片和电路基板接触。 第二焊料凸块大于第一焊料凸块，与IC芯片接触并设置在加强件的第二区域之上。

公开(公告)号：US07328830B2

公开(公告)日：2008-02-12

申请号：US10741155

申请日：2003-12-19

申请人： Mark Adam Bachman ,  Daniel Patrick Chesire ,  Sailesh Mansinh Merchant

发明人： Mark Adam Bachman ,  Daniel Patrick Chesire ,  Sailesh Mansinh Merchant

IPC分类号： B23K31/02

CPC分类号： H01L21/02063 ,  H01L21/31116 ,  H01L21/32136 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/45 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05022 ,  H01L2224/05093 ,  H01L2224/05096 ,  H01L2224/05554 ,  H01L2224/05558 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11901 ,  H01L2224/13006 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/8501 ,  H01L2924/0001 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/00014 ,  H01L2224/05552 ,  H01L2924/00

摘要： An integrated circuit structure and a method for fabricating the structure. The method comprises forming a copper bond pad for attaching the integrated circuit to a package. Copper oxide is removed from the pad by reduction in a hydrogen ion atmosphere. For attaching the integrated circuit to a bump-bonding package an under-bump metallization layer is formed over the reduced copper pad and a solder bump formed thereover. The process can also be employed in a wire bonding process by forming an aluminum layer overlying the cleaned copper pad. The structure of the present invention comprises a copper pad formed in a substrate. A passivation layer defining an opening therein overlies the copper pad. A under-bump metallization layer is disposed in the opening and a solder bump overlies the metallization layer. Alternatively, the structure further comprises an aluminum pad disposed overlying the reduced copper pad.

摘要翻译： 集成电路结构及其制造方法。 该方法包括形成用于将集成电路附接到封装的铜焊盘。 通过在氢离子气氛中还原，将铜氧化物从垫中除去。 为了将集成电路连接到凸块焊接封装，在减小的铜焊盘上形成凸起下金属化层，并在其上形成焊料凸块。 该方法也可以通过形成覆盖在清洁的铜垫上的铝层在引线接合工艺中使用。 本发明的结构包括形成在基板中的铜焊盘。 限定其中的开口的钝化层覆盖在铜焊盘上。 凸起下金属化层设置在开口中，并且焊料凸块覆盖在金属化层上。 或者，该结构还包括设置在还原铜垫上的铝垫。

公开(公告)号：US06960836B2

公开(公告)日：2005-11-01

申请号：US10675260

申请日：2003-09-30

申请人： Mark Adam Bachman ,  Daniel Patrick Chesire ,  Sailesh Mansinh Merchant ,  John William Osenbach ,  Kurt George Steiner

发明人： Mark Adam Bachman ,  Daniel Patrick Chesire ,  Sailesh Mansinh Merchant ,  John William Osenbach ,  Kurt George Steiner

IPC分类号： H01L21/60 ,  H01L23/00 ,  H01L23/485 ,  H01L23/52

CPC分类号： H01L24/05 ,  H01L21/768 ,  H01L23/562 ,  H01L24/03 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05082 ,  H01L2224/05093 ,  H01L2224/05558 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2224/05552

摘要： Disclosed herein is a reinforcing system and method for reinforcing a contact pad of an integrated circuit. Specifically exemplified is a system and method that comprises a reinforcing structure interposed between a top contact pad layer and an underlying metal layer.

摘要翻译： 本文公开了一种用于加强集成电路的接触焊盘的增强系统和方法。 具体示出的是包括插入在顶部接触垫层和下面的金属层之间的加强结构的系统和方法。

公开(公告)号：US07724359B2

公开(公告)日：2010-05-25

申请号：US12154794

申请日：2008-05-27

申请人： Ahmed Nur Amin ,  Mark Adam Bachman ,  Frank A. Baiocchi ,  John Michael DeLucca ,  John William Osenbach

发明人： Ahmed Nur Amin ,  Mark Adam Bachman ,  Frank A. Baiocchi ,  John Michael DeLucca ,  John William Osenbach

IPC分类号： G01N21/00

CPC分类号： H01L22/12 ,  H01L21/4846 ,  H01L22/20 ,  H01L23/49866 ,  H01L24/13 ,  H01L2224/81444 ,  H01L2224/85444 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/244

摘要： Many electronic entities such as integrated circuits and discrete power devices have contact pads formed from successively deposited layers of nickel and a second metal such as gold. The resulting pad structure is used to make external electrical connection such as solder connection. Problems associated with failure of such connections are avoidable by inspecting the surface of the nickel layer for excessive small particle formation.

摘要翻译： 诸如集成电路和分立功率器件的许多电子实体具有由连续沉积的镍层和诸如金的第二金属形成的接触焊盘。 所得到的焊盘结构用于形成诸如焊接连接的外部电连接。 通过检查镍层的表面以避免过度的小颗粒形成，可避免与这种连接的故障有关的问题。

公开(公告)号：US20130261642A1

公开(公告)日：2013-10-03

申请号：US13618858

申请日：2012-09-14

申请人： Lynn WILLETT ,  Philip SCHMIDT ,  Dan MONAHAN ,  Adam LEHMAN ,  Leland Ray ADAMS ,  Paul WHITING ,  Salvatore CASTRO ,  Adam BACHMAN

发明人： Lynn WILLETT ,  Philip SCHMIDT ,  Dan MONAHAN ,  Adam LEHMAN ,  Leland Ray ADAMS ,  Paul WHITING ,  Salvatore CASTRO ,  Adam BACHMAN

IPC分类号： A61B17/128

CPC分类号： A61B17/1222 ,  A61B17/122 ,  A61B17/128 ,  A61B17/1285 ,  A61B90/03 ,  A61B2017/12004

摘要： A ligation clip applier is provided. The clip applier includes: a pair of jaws; a distal clevis tube to which the jaws are pivotally mounted; a proximal clevis tube located behind the distal clevis tube, wherein the distal clevis tube and the proximal clevis tubes move axially with respect to each other; a clip lock actuator fixed to one of the proximal and distal clevis tubes; and a distal pushrod extending through the distal and proximal clevis tubes and forming a camming connection with the jaws configured to close and move the jaws toward a proximal direction toward the clip lock actuator when the distal pushrod is moved in the proximal direction. A method for applying a clip on a vessel is disclosed.

摘要翻译： 提供结扎夹施压器。 夹子包括：一对钳口; 一个远端的U形夹管，夹爪枢转地安装在其上; 位于远侧U形夹管后面的近端U形管管，其中远端U形夹管和近端U形管相对于彼此轴向移动; 固定到近端和远端U形夹管之一的夹锁致动器; 以及远端推杆，其延伸穿过远端和近侧U形夹管，并形成与所述夹爪相配合的凸轮连接，当所述远端推杆沿所述近端方向移动时，所述夹爪构造成使所述夹爪朝向近侧方向朝向夹锁致动器移动。 公开了一种将夹子施加在容器上的方法。

公开(公告)号：US20100319967A1

公开(公告)日：2010-12-23

申请号：US12666437

申请日：2007-06-28

申请人： Ahmed Amin ,  Mark Adam Bachman ,  Frank A. Baiocchi ,  John A. Delucca ,  John W. Osenbach ,  Zhengpeng Xiong

发明人： Ahmed Amin ,  Mark Adam Bachman ,  Frank A. Baiocchi ,  John A. Delucca ,  John W. Osenbach ,  Zhengpeng Xiong

IPC分类号： H05K1/09 ,  B05D3/02 ,  C22F1/08 ,  B23K31/02 ,  B32B15/01

CPC分类号： H05K3/244 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05568 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2924/01327 ,  H01L2924/3025 ,  H05K3/3463 ,  H05K2203/1105 ,  Y10T428/12715 ,  H01L2924/00 ,  H01L2924/00014

摘要： A device fabrication method, according to which a tin-copper-alloy layer is formed adjacent to a copper-plated pad or pin that is used to electrically connect the device to external wiring. Advantageously, the tin-copper-alloy layer inhibits copper dissolution during a solder reflow process because that layer is substantially insoluble in liquid Sn—Ag—Cu (tin-silver-copper) solder alloys under typical solder reflow conditions and therefore shields the copper plating from direct physical contact with the liquefied solder.

摘要翻译： 一种器件制造方法，根据该器件制造方法，与用于将器件电连接到外部布线的镀铜焊盘或引脚相邻形成锡 - 铜合金层。 有利地，锡 - 铜合金层在焊料回流过程中抑制铜溶解，因为该层在典型的回流焊条件下基本上不溶于液体Sn-Ag-Cu（锡 - 银 - 铜）焊料合金，因此屏蔽铜电镀 与液化焊料直接接触。

公开(公告)号：US07777333B2

公开(公告)日：2010-08-17

申请号：US11884328

申请日：2006-02-24

申请人： Mark Adam Bachman ,  Donald Stephen Bitting ,  Daniel Patrick Chesire ,  Taeho Kook ,  Sailesh Mansinh Merchant

发明人： Mark Adam Bachman ,  Donald Stephen Bitting ,  Daniel Patrick Chesire ,  Taeho Kook ,  Sailesh Mansinh Merchant

IPC分类号： H01L23/488

CPC分类号： H01L24/11 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05558 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/10126 ,  H01L2224/11912 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0001 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/05552 ,  H01L2924/00

摘要： A solder bump structure and an under bump metallurgical structure. An upper surface of a semiconductor substrate comprises a first conductive pad (200) disposed thereon. A passivation layer (202) overlies the upper surface. A second conductive pad (212) is disposed in an opening (204) in the passivation layer and in contact with the first conductive pad. The under bump metallurgical structure (300) encapsulates the second conductive pad, covering an upper surface and sidewalls surfaces of the second conductive pad, protecting both the first and the second conductive pads from environmental and processing effects. According to the present invention, the conventional second passivation layer is not required. Methods for forming the various structures are also presented.

摘要翻译： 焊料凸块结构和凹凸金属结构。 半导体衬底的上表面包括设置在其上的第一导电焊盘（200）。 钝化层（202）覆盖在上表面上。 第二导电焊盘（212）设置在钝化层中的开口（204）中并与第一导电焊盘接触。 凸块下金属结构（300）封装第二导电焊盘，覆盖第二导电焊盘的上表面和侧壁表面，保护第一和第二导电焊盘免受环境和处理的影响。 根据本发明，不需要传统的第二钝化层。 还提出了形成各种结构的方法。