公开(公告)号：US10081870B2

公开(公告)日：2018-09-25

申请号：US14007254

申请日：2012-03-16

申请人： Jinhyouk Shin ,  Jeonggyu Kim ,  Kwangho Lee ,  Jangwoo Lee ,  Moonkap Lee ,  Junggeun Oh

发明人： Jinhyouk Shin ,  Jeonggyu Kim ,  Kwangho Lee ,  Jangwoo Lee ,  Moonkap Lee ,  Junggeun Oh

IPC分类号： C23C16/513 ,  C23C16/458 ,  C23C16/50 ,  C23C16/54 ,  H01J37/32 ,  C23C14/24 ,  C23C16/448 ,  C23C16/455 ,  C23C14/56

CPC分类号： C23C16/513 ,  C23C14/24 ,  C23C14/243 ,  C23C14/56 ,  C23C14/562 ,  C23C14/568 ,  C23C16/4485 ,  C23C16/45548 ,  C23C16/458 ,  C23C16/50 ,  C23C16/54 ,  H01J37/3244 ,  H01J37/32706 ,  H01J37/32715 ,  H01J37/32743 ,  H01J37/32788 ,  H01J37/32862

摘要： There is disclosed a plasma enhanced chemical vapor deposition apparatus including a chamber in which plasma reaction is performed to provide a functional film to an object received therein, a pallet mechanically and electrically connected with the object, a conveyer to convey the pallet to an inside from an outside of the chamber, and a power supplier to supply an electric power to the pallet, the power supplier comprising a moving contact distant from the pallet when the pallet is conveyed and contacting with the pallet when the pallet is stopped.

公开(公告)号：US09169561B2

公开(公告)日：2015-10-27

申请号：US13428483

申请日：2012-03-23

申请人： Junggeun Oh ,  Kwangho Lee ,  Jangwoo Lee ,  Jeonggyu Kim ,  Jinhyouk Shin

发明人： Junggeun Oh ,  Kwangho Lee ,  Jangwoo Lee ,  Jeonggyu Kim ,  Jinhyouk Shin

IPC分类号： C23C16/54 ,  C23C16/50 ,  C23C16/509 ,  C23C16/505 ,  C23C16/458

CPC分类号： C23C16/54 ,  C23C16/458 ,  C23C16/50 ,  C23C16/505 ,  C23C16/509

摘要： There is disclosed a plasma enhanced chemical vapor deposition apparatus including a loading station to load an object on a pallet, an operation station to form a functional film by performing plasma reaction to the object loaded on the pallet, a unloading station to separate the object from the pallet, a circulation station to convey the pallet from the unloading station to the loading station, and a conveyer to convey the pallet to the stations sequentially to circulate the pallet.

摘要翻译： 公开了一种等离子体增强化学气相沉积装置，其包括：装载站，用于将物体装载在托盘上;操作台，通过对装载在托盘上的物体进行等离子体反应而形成功能膜;卸载站， 托盘，用于将托盘从卸载站传送到装载站的循环站，以及用于将托盘顺序地传送到站的传送器，以使托盘循环。

公开(公告)号：US20150206869A1

公开(公告)日：2015-07-23

申请号：US14516764

申请日：2014-10-17

申请人： Jongkook KIM ,  Jangwoo LEE ,  Kyoungsei CHOI ,  Sayoon KANG ,  Donghan KIM ,  Hwanggil SHIM

发明人： Jongkook KIM ,  Jangwoo LEE ,  Kyoungsei CHOI ,  Sayoon KANG ,  Donghan KIM ,  Hwanggil SHIM

IPC分类号： H01L25/00

CPC分类号： H01L23/36 ,  H01L23/42 ,  H01L23/49816 ,  H01L23/552 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2225/1094 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

摘要： Package-on-package (POP) devices and methods of manufacturing the POP devices are provided. In the POP devices, a thermal interface material layer disposed between lower and upper semiconductor packages may contact about 70% or greater of an area of a top surface of a lower semiconductor chip. According to methods, the upper semiconductor package may be mounted on the lower semiconductor chip using a weight.

摘要翻译： 提供封装（POP）设备和制造POP设备的方法。 在POP装置中，设置在下半导体封装和上半导体封装之间的热界面材料层可以接触下半导体芯片的顶表面的大约70％或更大的面积。 根据方法，上半导体封装可以使用重量安装在下半导体芯片上。

公开(公告)号：US09355931B2

公开(公告)日：2016-05-31

申请号：US14516764

申请日：2014-10-17

申请人： Jongkook Kim ,  Jangwoo Lee ,  Kyoungsei Choi ,  Sayoon Kang ,  Donghan Kim ,  Hwanggil Shim

发明人： Jongkook Kim ,  Jangwoo Lee ,  Kyoungsei Choi ,  Sayoon Kang ,  Donghan Kim ,  Hwanggil Shim

IPC分类号： H01L21/00 ,  H01L23/36 ,  H01L23/42 ,  H01L23/498 ,  H01L25/10 ,  H01L23/552

CPC分类号： H01L23/36 ,  H01L23/42 ,  H01L23/49816 ,  H01L23/552 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2225/1094 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

摘要： Package-on-package (POP) devices and methods of manufacturing the POP devices are provided. In the POP devices, a thermal interface material layer disposed between lower and upper semiconductor packages may contact about 70% or greater of an area of a top surface of a lower semiconductor chip. According to methods, the upper semiconductor package may be mounted on the lower semiconductor chip using a weight.

摘要翻译： 提供封装（POP）设备和制造POP设备的方法。 在POP装置中，设置在下半导体封装和上半导体封装之间的热界面材料层可以接触下半导体芯片的顶表面的大约70％或更大的面积。 根据方法，上半导体封装可以使用重量安装在下半导体芯片上。

公开(公告)号：US20130052775A1

公开(公告)日：2013-02-28

申请号：US13588450

申请日：2012-08-17

申请人： Tongsuk KIM ,  Jangwoo LEE ,  Heeseok LEE ,  Kyoungsei CHOI

发明人： Tongsuk KIM ,  Jangwoo LEE ,  Heeseok LEE ,  Kyoungsei CHOI

IPC分类号： H01L21/56

CPC分类号： H01L23/06 ,  H01L21/563 ,  H01L23/10 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/36 ,  H01L23/42 ,  H01L23/49816 ,  H01L23/552 ,  H01L23/562 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06568 ,  H01L2924/15311 ,  H01L2924/16172 ,  H01L2924/16251 ,  H01L2924/00

摘要： A semiconductor package including a package substrate having a chip mounting region and a peripheral region and including a ground layer formed in the peripheral region, first solder balls on the package substrate in the chip mounting region, second solder balls on the ground layer, at least one semiconductor chip stacked on the package substrate in the chip mounting region, and a package cap covering the semiconductor chip and contacting the package substrate in the peripheral region may be provided. The package cap is electrically connected to the second solder balls. Methods of fabricating the semiconductor package are also provided.

摘要翻译： 一种半导体封装，包括具有芯片安装区域和周边区域的封装基板，并且包括形成在周边区域中的接地层，在芯片安装区域中的封装基板上的第一焊球，接地层上的第二焊球，至少 可以提供在芯片安装区域中堆叠在封装基板上的一个半导体芯片，以及覆盖半导体芯片并且在周边区域中与封装基板接触的封装帽。 封装帽电连接到第二焊球。 还提供了制造半导体封装的方法。

公开(公告)号：US20120240856A1

公开(公告)日：2012-09-27

申请号：US13428483

申请日：2012-03-23

申请人： Junggeun OH ,  Kwangho Lee ,  Jangwoo Lee ,  Jeonggyu Kim ,  Jinhyouk Shin

发明人： Junggeun OH ,  Kwangho Lee ,  Jangwoo Lee ,  Jeonggyu Kim ,  Jinhyouk Shin

IPC分类号： C23C16/50

CPC分类号： C23C16/54 ,  C23C16/458 ,  C23C16/50 ,  C23C16/505 ,  C23C16/509

摘要： There is disclosed a plasma enhanced chemical vapor deposition apparatus including a loading station to load an object on a pallet, an operation station to form a functional film by performing plasma reaction to the object loaded on the pallet, a unloading station to separate the object from the pallet, a circulation station to convey the pallet from the unloading station to the loading station, and a conveyer to convey the pallet to the stations sequentially to circulate the pallet.

摘要翻译： 公开了一种等离子体增强化学气相沉积装置，其包括：装载站，用于将物体装载在托盘上;操作台，通过对装载在托盘上的物体进行等离子体反应而形成功能膜;卸载站， 托盘，用于将托盘从卸载站传送到装载站的循环站，以及用于将托盘顺序地传送到站的传送器，以使托盘循环。

公开(公告)号：US20200075561A1

公开(公告)日：2020-03-05

申请号：US16298421

申请日：2019-03-11

申请人： JI HWANG KIM ,  JONGBO SHIM ,  WON IL LEE ,  JANGWOO LEE ,  YOUNG KUN JEE

发明人： JI HWANG KIM ,  JONGBO SHIM ,  WON IL LEE ,  JANGWOO LEE ,  YOUNG KUN JEE

IPC分类号： H01L25/10 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L23/538

摘要： A semiconductor package includes a first substrate, a first semiconductor chip mounted on the first substrate, an interposer substrate and a chip package stacked on the first semiconductor chip, and a first molding layer encapsulating the first semiconductor chip and the chip package. The chip package includes a second semiconductor chip on the interposer substrate. The interposer substrate has a base layer consisting of silicon, a conductive pattern on a top surface of the base layer, and a through-electrode extending through the base layer and connected to the conductive pattern.

公开(公告)号：US08983379B2

公开(公告)日：2015-03-17

申请号：US13604753

申请日：2012-09-06

申请人： Chul Bum Kim ,  Jangwoo Lee ,  Changsik Yoo ,  Minki Jeon

发明人： Chul Bum Kim ,  Jangwoo Lee ,  Changsik Yoo ,  Minki Jeon

IPC分类号： H04B5/00 ,  H04B1/10

CPC分类号： H04B5/0031 ,  H04B5/0081

摘要： A data transmitting and receiving apparatus includes a coil configured to transmit and receive data through inductive coupling, where a voltage drop across the coil constitutes a sensing signal. The apparatus further includes an input unit configured to generate transmission data and a replica signal in accordance with an input data signal, the transmission data being supplied to the coil. The apparatus still further includes a replica unit configured to generate a compensation signal in accordance with the replica signal, and an output unit configured to extract reception data from the sensing signal using the compensation signal.

摘要翻译： 数据发送和接收装置包括被配置为通过电感耦合发送和接收数据的线圈，其中线圈两端的电压降构成感测信号。 该装置还包括：输入单元，被配置为根据输入数据信号产生发送数据和复制信号，所述发送数据被提供给线圈。 该装置还包括复制单元，被配置为根据复制信号生成补偿信号，以及输出单元，被配置为使用补偿信号从感测信号中提取接收数据。

公开(公告)号：US08708661B2

公开(公告)日：2014-04-29

申请号：US13035493

申请日：2011-02-25

申请人： Yunhi Lee ,  Jangwoo Lee ,  Seungjun Lee

发明人： Yunhi Lee ,  Jangwoo Lee ,  Seungjun Lee

IPC分类号： F04B49/00

CPC分类号： F04C23/008 ,  F04C18/356 ,  F04C23/001 ,  F04C28/08 ,  F04C28/28 ,  F04C29/021 ,  F04C2240/809 ,  F04C2240/81 ,  F04C2270/065 ,  F04C2270/86

摘要： A compression device includes a controller to control an operating speed of a compressor based on a detected level of oil in an oil storage area. During a speed-change operation, the controller controls acceleration of the compressor to maintain the oil level within a predetermined range when the oil level is detected to be outside the predetermined range.

摘要翻译： 压缩装置包括控制器，用于基于油储存区域中检测到的油位来控制压缩机的操作速度。 在变速操作期间，当检测到油位在预定范围之外时，控制器控制压缩机的加速度以将油位维持在预定范围内。

公开(公告)号：US20120260856A1

公开(公告)日：2012-10-18

申请号：US13428529

申请日：2012-03-23

申请人： Junggeun OH ,  Kwangho LEE ,  Jangwoo LEE ,  Jeonggyu KIM ,  Jinhyouk SHIN

发明人： Junggeun OH ,  Kwangho LEE ,  Jangwoo LEE ,  Jeonggyu KIM ,  Jinhyouk SHIN

IPC分类号： B65D19/26 ,  C23C16/50

CPC分类号： C23C16/0236 ,  C23C16/4587 ,  C23C16/50 ,  C23C16/54 ,  H01J37/32715

摘要： There is disclosed a plasma enhanced chemical vapor deposition apparatus including a pallet to load and convey an object thereon to provide a functional film to the object by plasma reaction, wherein the pallet includes a base, a jig to fix the object, and a fixing part disposed on the base at an upper side of the fixing part Lo fix the object to the pallet.

摘要翻译： 公开了一种等离子体增强化学气相沉积装置，其包括用于加载和传送物体的托盘，以通过等离子体反应向物体提供功能膜，其中托盘包括基座，固定物体的夹具和固定部件 在固定部分Lo的上侧设置在基座上，将物体固定在托盘上。