公开(公告)号：US09799448B2

公开(公告)日：2017-10-24

申请号：US14505474

申请日：2014-10-02

Applicant: James Jen-Ho Wang

Inventor： James Jen-Ho Wang

IPC: H01F27/29 ,  H01F41/04 ,  H01F27/28

CPC classification number: H01F41/042 ,  H01F27/2804 ,  H01F27/29

Abstract: In accordance with an embodiment, a circuit element includes a flexible foldable substrate having portions of a first inductor formed on first and second major surfaces of the flexible substrate. In accordance with another embodiment, a first electrically conductive trace having a first terminal, a second terminal, and a first annular-shaped portion between the first terminal and the second terminal is formed on a first portion of the first major surface. A second electrically conductive trace having a first terminal, a second terminal, a first annular-shaped portion between the first terminal and the second terminal of the second electrically conductive trace, and a second annular-shaped portion between the first terminal and the second terminal of the second electrically conductive trace is formed on the second major surface. The first electrically conductive trace is coupled to the second electrically conductive trace by a thru-via.

公开(公告)号：US20120061796A1

公开(公告)日：2012-03-15

申请号：US12807756

申请日：2010-09-14

Applicant: James Jen-Ho Wang

Inventor： James Jen-Ho Wang

IPC: H01L23/525 ,  H01L21/768

CPC classification number: H01L23/5252 ,  H01L23/522 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05551 ,  H01L2224/05552 ,  H01L2224/05563 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/30107 ,  H01L2924/01024 ,  H01L2924/01046 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A mechanically programmable anti-fuse is configured in a thick, top metallic layer of a semiconductor. The metallic layer is selected of a material that possesses malleable properties. The metal anti-fuse programming pad is surrounded, either wholly or in part, by a pad segment. An intervening space between the anti-fuse pad and the pad segment is selected from a predetermined value such that capillary pressure, exerted when a ball-bond is placed atop the anti-fuse pad and the pad segment, causes the pads to deform and shorts to the anti-fuse pad to the pad segment. The shorting, created during the wire bonding process, programs the anti-fuse.

Abstract translation: 机械可编程的反熔丝被配置在半导体的厚的顶部金属层中。 金属层选自具有韧性的材料。 金属反熔丝编程焊盘全部或部分由焊盘段包围。 反熔丝焊盘和焊盘部分之间的中间空间从预定值中选择，使得当将球接头放置在反熔丝焊盘和焊盘部分顶部时施加的毛细管压力导致焊盘变形和短路 到反熔丝焊盘到焊盘段。 在引线接合过程中产生的短路程序是防熔丝。

公开(公告)号：US07670220B2

公开(公告)日：2010-03-02

申请号：US11035632

申请日：2005-01-14

Applicant: Martyn Chudley ,  James Jen

Inventor： Martyn Chudley ,  James Jen

IPC: A63F9/24 ,  A63F13/00 ,  G06F17/00 ,  G06F19/00

CPC classification number: A63F13/803 ,  A63F13/10 ,  A63F13/12 ,  A63F13/537 ,  A63F2300/8017

Abstract: Racing games and other computer-implemented games having garage, showroom and test drive features are disclosed herein. In one embodiment, a method for implementing a racing game in accordance with one embodiment of the invention includes displaying a plurality of cars in a simulated showroom setting. Game players can roam freely about the showroom in first-person mode and inspect the cars in close detail. If a player desires, he or she can test drive one or more of the cars to assess its performance before competing in a racing event with the car.

Abstract translation: 本文公开了具有车库，展厅和测试驱动特征的赛车游戏和其他计算机实现的游戏。 在一个实施例中，根据本发明的一个实施例的用于实现赛车游戏的方法包括在模拟展厅设置中显示多个轿厢。 游戏玩家可以以第一人称模式自由地漫游展厅，并仔细检查汽车。 如果玩家希望，他或她可以测试驾驶一辆或多辆汽车，以便在与赛车赛事竞争之前评估其表现。

公开(公告)号：US20100015793A1

公开(公告)日：2010-01-21

申请号：US12569022

申请日：2009-09-29

Applicant: James Jen-Ho Wang ,  Paul T. Hui

Inventor： James Jen-Ho Wang ,  Paul T. Hui

IPC: H01L21/768

CPC classification number: H01L21/76801 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05166 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor device has contact between the last interconnect layer and the bond pad that includes a barrier metal between the bond pad and the last interconnect layer. Both a passivation layer and a polyimide layer separate the last interconnect layer and the bond pad. The passivation layer is patterned to form a first opening to contact the last interconnect layer. The polyimide layer is also patterned to leave a second opening that is inside and thus smaller than the first opening through the passivation. The barrier layer is then deposited in contact with the last interconnect layer and bounded by the polyimide layer. The bond pad is then formed in contact with the barrier, and a wire bond is then made to the bond pad.

Abstract translation: 半导体器件在最后的互连层和包含接合焊盘和最后互连层之间的阻挡金属的接合焊盘之间具有接触。 钝化层和聚酰亚胺层都分离最后的互连层和接合焊盘。 图案化钝化层以形成第一开口以接触最后的互连层。 聚酰亚胺层也被图案化以留下内部的第二开口，因此比通过钝化的第一开口小。 然后将阻挡层沉积成与最后的互连层接触并且被聚酰亚胺层界定。 然后将接合焊盘形成为与阻挡层接触，然后对接合焊盘进行引线接合。

公开(公告)号：US07619297B2

公开(公告)日：2009-11-17

申请号：US12390133

申请日：2009-02-20

Applicant: James Jen-Ho Wang

Inventor： James Jen-Ho Wang

IPC: H01L29/00

CPC classification number: H01L23/5227 ,  H01F17/0033 ,  H01F2027/2814 ,  H01L23/552 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L27/092 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/4845 ,  H01L2224/48455 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/49175 ,  H01L2224/49431 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/20752 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: An electronic device can include an inductor overlying a shock-absorbing layer. In one aspect, the electronic device can include a substrate, an interconnect level overlying the substrate, and the shock-absorbing layer overlying the interconnect level. The inductor can include conductive traces and looped wires. The conductive traces can be attached to the conductive traces over the shock-absorbing layer. In another aspect, a process can be used to form the electronic device including the inductor. In still another aspect, an electronic device can a toroidal-shaped inductor that includes linear inductor segments that are connected in series.

Abstract translation: 电子设备可以包括覆盖减震层的电感器。 在一个方面，电子设备可以包括衬底，覆盖衬底的互连电平以及覆盖互连电平的减震层。 电感器可以包括导电迹线和环形导线。 导电迹线可以连接到震动吸收层上的导电迹线上。 在另一方面，可以使用一种方法来形成包括电感器的电子设备。 另一方面，电子设备可以是包括串联连接的线性电感器段的环形电感器。

公开(公告)号：US07339275B2

公开(公告)日：2008-03-04

申请号：US10995818

申请日：2004-11-22

Applicant: James Jen Ho Wang ,  Justin E. Poarch

Inventor： James Jen Ho Wang ,  Justin E. Poarch

IPC: H01L23/48

CPC classification number: H01L25/0657 ,  H01L24/73 ,  H01L25/0652 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Multi-chip semiconductor device assemblies and methods for fabricating such assemblies are provided. An exemplary assembly comprises a first chip having a first surface and comprising a plurality of conductive pads disposed at the first surface and a plurality of circuits. Each of the pads is electrically coupled to one of the circuits. A second chip having a second surface is disposed adjacent to the first surface of the first chip. The second chip comprises a plurality of bonding members disposed at the second surface. Each of the bonding members is connected to a corresponding pad. The second chip is electrically coupled to at least one of the circuits via a corresponding pad and a corresponding bonding member. The second chip comprises a first and a second portion. The first portion overlies at least a portion of the first chip and the second portion extends beyond the first chip.

Abstract translation: 提供了多芯片半导体器件组件及其制造方法。 示例性组件包括具有第一表面并且包括设置在第一表面处的多个导电焊盘的第一芯片和多个电路。 每个焊盘电耦合到一个电路。 具有第二表面的第二芯片设置成与第一芯片的第一表面相邻。 第二芯片包括设置在第二表面处的多个接合部件。 每个接合构件连接到相应的垫。 第二芯片通过相应的焊盘和相应的焊接部件电耦合到至少一个电路。 第二芯片包括第一和第二部分。 第一部分覆盖第一芯片的至少一部分，并且第二部分延伸超过第一芯片。

公开(公告)号：US20060121989A1

公开(公告)日：2006-06-08

申请号：US11007888

申请日：2004-12-08

Applicant: Patrick O'Kelley ,  Steven Lamb ,  Vincent Curley ,  Ling Chen ,  Michal Bortnik ,  James Jen ,  Jerry Johnson ,  Johan Hansen

Inventor： Patrick O'Kelley ,  Steven Lamb ,  Vincent Curley ,  Ling Chen ,  Michal Bortnik ,  James Jen ,  Jerry Johnson ,  Johan Hansen

IPC: G06F19/00 ,  G06F17/00

CPC classification number: A63F13/79 ,  A63F13/10 ,  A63F13/12 ,  A63F13/335 ,  A63F2300/407 ,  A63F2300/5546

Abstract: Information is shared among users in a system by the use of a service. The service receives information from at least two different game applications that each have a configuration file (defined with a common schema) that defines information from the game application to share with a service. An intermediary program executing on a computer that is also executing one of said game applications receives information from the application as defined by said configuration files and stores at least a portion of the information received from the application. At least a portion of the information is sent to the service when the intermediary is in communication with the service over a network wherein the service provides information about a user of said at least two game applications based on information received by said service.

公开(公告)号：US20170186533A9

公开(公告)日：2017-06-29

申请号：US14531079

申请日：2014-11-03

Applicant: James Jen-Ho Wang

Inventor： James Jen-Ho Wang

IPC: H01F41/02 ,  H05K1/18 ,  H05B33/08

CPC classification number: H01F41/0206 ,  H01F17/0013 ,  H01F41/046 ,  H01F2017/006 ,  H01F2017/0066 ,  H05B33/0803 ,  H05B33/0821 ,  H05B33/0845 ,  H05K1/0209 ,  H05K1/021 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/165 ,  H05K1/183 ,  H05K1/189 ,  H05K3/0005 ,  H05K3/0035 ,  H05K3/0061 ,  H05K3/0097 ,  H05K3/281 ,  H05K3/427 ,  H05K3/4697 ,  H05K2201/056 ,  H05K2201/086 ,  H05K2201/0919 ,  H05K2201/09672 ,  H05K2201/09709 ,  H05K2201/09845 ,  H05K2203/0126 ,  H05K2203/0384 ,  H05K2203/0571 ,  H05K2203/063 ,  H05K2203/1545

Abstract: An embedded device 105 is assembled within a flexible circuit assembly 30 with the embedded device mid-plane intentionally located in proximity to the flexible circuit assembly central plane 115 to minimize stress effects on the embedded device. The opening 18, for the embedded device, is enlarged in an intermediate layer 10 to enhance flexibility of the flexible circuit assembly.

公开(公告)号：USD732731S1

公开(公告)日：2015-06-23

申请号：US29421678

申请日：2012-09-04

Applicant: James Jen-Ho Wang

Designer： James Jen-Ho Wang

公开(公告)号：US08153510B2

公开(公告)日：2012-04-10

申请号：US12799444

申请日：2010-04-26

Applicant: James Jen-Ho Wang

Inventor： James Jen-Ho Wang

IPC: H01L21/00

CPC classification number: H01L24/05 ,  H01L24/03 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4813 ,  H01L2224/48463 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/05442 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2224/48824 ,  H01L2924/00 ,  H01L2924/207

Abstract: In a semiconductor wafer, the polyimide film underneath a power metal structure is partially etched to create corresponding surface depressions of the conformal top power metal. The depressions at the surface of power metal are visible under optical microscopy. Arrangement of the depressions in a pattern facilitates the alignment of probe needles, set-up of automated wire bonding and microscopic inspection for precise alignment of wire bonds.

Abstract translation: 在半导体晶片中，功率金属结构下方的聚酰亚胺膜被部分蚀刻，以产生适形顶部功率金属的相应的表面凹陷。 功率金属表面的凹陷在光学显微镜下是可见的。 以图案排列凹陷有助于探针的对准，自动引线接合的设置和显微检查以精确对准引线接合。