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    Method for multi-step filtering spatious objects by utilizing MMP filter in spatial database system
    6.
    发明授权
    Method for multi-step filtering spatious objects by utilizing MMP filter in spatial database system 有权
    通过在空间数据库系统中利用MMP滤波器对多个空间物体进行多步过滤的方法

    公开(公告)号：US06438269B1

    公开(公告)日：2002-08-20

    申请号：US09236403

    申请日：1999-01-25

    申请人： Mi Yeon Kim ,  Sang Kyu Choe ,  Su Mi Lim ,  Jang Su Kim

    发明人： Mi Yeon Kim ,  Sang Kyu Choe ,  Su Mi Lim ,  Jang Su Kim

    IPC分类号： G06K946

    CPC分类号： G06F17/30241 ,  G06K9/4604

    摘要： The present invention relates to a method for multi-step filtering a candidate object which is filtered by a minimum bounding rectangle (MBR); and, more particulary, to a method of multi-step filtering a candidate object by employing a minimum maximum point (MMP) filter to improve spatial query filtering process performance by refiltering the candidate objects, which are filtered by using a rotated minimum bounding rectangle (Rotated Minimum Bounding Rectangle) surrounding spatial objects during filtering process at a step of spatial query filtering and refining of spatial database, by using spatial filter, i.e., MMP filter.

    摘要翻译： 本发明涉及一种用最小边界矩形（MBR）过滤的候选对象的多级过滤方法; 并且更具体地说，涉及通过采用最小最大点（MMP）过滤器来对候选对象进行多步骤过滤的方法，以通过再循环候选对象来提高空间查询过滤性能，所述候选对象被使用旋转的最小边界矩形 通过使用空间滤波器，即MMP滤波器，在空间查询过滤和空间数据库的优化步骤的过滤过程中，围绕空间对象的周期空间对象的旋转最小边界矩形。

    PACKAGE ON PACKAGE
    9.
    发明申请
    PACKAGE ON PACKAGE 审中-公开
    包装上包装

    公开(公告)号：US20120193783A1

    公开(公告)日：2012-08-02

    申请号：US13341125

    申请日：2011-12-30

    申请人： Ji-Sun HONG ,  Dae-Young CHOI ,  Mi-Yeon KIM

    发明人： Ji-Sun HONG ,  Dae-Young CHOI ,  Mi-Yeon KIM

    IPC分类号： H01L23/498 ,  H01L23/522

    CPC分类号： H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A package on package is provided herein, the package on package including a first semiconductor package including a first substrate, a first semiconductor chip stacked on the first substrate, a plurality of first connection members on an upper surface of the first substrate and in a first molding material, and a plurality of via holes which respectively expose the plurality of first connection members through the first molding material; a second semiconductor package including a second substrate, a second semiconductor chip stacked on the second substrate, and a plurality of second connection members on a lower surface of the second substrate; and a plurality of connection portions including a plurality of cores and a plurality of conductive fusion layers surrounding the plurality of cores, wherein the plurality of conductive fusion layers contact the upper surface of the first substrate and the lower surface of the second substrate.

    摘要翻译： 本文提供了一种封装在封装上的封装，其包装包括第一半导体封装，第一半导体封装包括第一衬底，堆叠在第一衬底上的第一半导体芯片，在第一衬底的上表面上的多个第一连接构件， 模制材料和多个通孔，其分别通过第一模塑材料暴露多个第一连接构件; 第二半导体封装，包括第二衬底，堆叠在第二衬底上的第二半导体芯片和在第二衬底的下表面上的多个第二连接构件; 以及包括多个芯的多个连接部分和围绕所述多个芯的多个导电熔融层，其中所述多个导电熔融层接触所述第一基板的上表面和所述第二基板的下表面。