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公开(公告)号:US08941545B2
公开(公告)日:2015-01-27
申请号:US13344874
申请日:2012-01-06
申请人: Osamu Kagaya , Koji Ikawa , Koutarou Suenaga
发明人: Osamu Kagaya , Koji Ikawa , Koutarou Suenaga
CPC分类号: H01Q1/1271 , H01Q13/10
摘要: A vehicle window glass has a glass plate, a conductive film laminated on the glass plate and an antenna structured with a feeding structure placed on the conductive film, and is characterized in that the feeding structure has a dielectric and a pair of electrodes, that the conductive film has a slot one end of which makes an upper edge of the conductive film an open end, and is disposed between the glass plate and the dielectric, and that the pair of electrodes are disposed on the opposite side of the side of the conductive film with the dielectric in between so that the slot is sandwiched between the pair of electrodes when the pair of electrodes are projected onto the conductive film, and are capacitively coupled to the conductive film.
摘要翻译: 车窗玻璃具有玻璃板,层叠在玻璃板上的导电膜和设置在导电膜上的馈电结构的天线,其特征在于,馈电结构具有电介质和一对电极,即, 导电膜具有一个槽,其一端使导电膜的上边缘成为开口端,并且设置在玻璃板和电介质之间,并且一对电极设置在导电膜的一侧的相对侧上 其中电介质在其间,使得当一对电极被投影到导电膜上时狭缝夹在该对电极之间,并且电容耦合到导电膜。
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公开(公告)号:US20130163996A1
公开(公告)日:2013-06-27
申请号:US13771768
申请日:2013-02-20
申请人: Osamu Kagaya , Koyu Takahashi , Taichi Kogure
发明人: Osamu Kagaya , Koyu Takahashi , Taichi Kogure
CPC分类号: H01P1/20345 , H01P1/2039 , H04B10/40 , H05K1/0233 , H05K1/0243 , H05K1/162 , H05K1/165 , H05K2201/09309 , H05K2201/09627 , H05K2201/10121 , H05K2201/10689
摘要: A printed circuit board includes a substrate, a signal output circuit formed on the substrate for outputting a clock signal, a shield for covering the signal output circuit, a power supply wiring for connecting the signal output circuit and a power source, and a trap filter provided to the power supply wiring and provided inside the shield, for attenuating a frequency component corresponding to a frequency of clock signal. The trap filter includes a resonance circuit having one portion of the power supply wiring, an inner-layer wiring of the substrate located below the one portion of the power supply wiring, an inner-layer ground wiring of the substrate located below the inner-layer wiring, and a via hole for connecting the one portion of the power supply wiring and the inner-layer wiring.
摘要翻译: 印刷电路板包括基板,形成在基板上的用于输出时钟信号的信号输出电路,用于覆盖信号输出电路的屏蔽,用于连接信号输出电路和电源的电源布线,以及陷波滤波器 提供给电源线并设置在屏蔽内部,用于衰减对应于时钟信号频率的频率分量。 陷波滤波器包括谐振电路,其具有电源布线的一部分,位于电源布线的一部分下方的基板的内层布线,位于内层下方的基板的内层布线 布线和用于连接电源布线和内层布线的一部分的通孔。
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公开(公告)号:US08467118B2
公开(公告)日:2013-06-18
申请号:US13015769
申请日:2011-01-28
申请人: Osamu Kagaya , Hirofumi Nakagawa , Taichi Kogure
发明人: Osamu Kagaya , Hirofumi Nakagawa , Taichi Kogure
CPC分类号: G02F1/01
摘要: To achieve a size-reduction of an optical module having a circuit that generates a high-frequency clock signal for controlling optical modulation by an optical modulator and to suppress radiation of electromagnetic waves from the optical module. A through-hole via is formed on a multilayer printed circuit board so as to be insulated from a plurality of grounded wiring layers by an anti-pad. A coaxial connector and an intensity modulation control IC that generates a high-frequency clock signal are provided on the multilayer printed circuit board. The high-frequency clock signal is input to the coaxial connector through a micro-strip line formed on the multilayer printed circuit board. An open stub connected to the through-hole via is provided on a wiring layer between a first wiring layer and a second wiring layer among the plurality of wiring layers.
摘要翻译: 为了实现具有生成用于控制光调制器的光调制的高频时钟信号的电路并且抑制来自光模块的电磁波的辐射的光模块的尺寸减小。 在多层印刷电路板上形成通孔通孔,以便通过防焊垫与多个接地布线层绝缘。 在多层印刷电路板上设置同轴连接器和产生高频时钟信号的强度调制控制IC。 高频时钟信号通过形成在多层印刷电路板上的微带线输入到同轴连接器。 在多个布线层中的第一布线层和第二布线层之间的布线层上设置有与通孔孔相连的开放短截线。
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公开(公告)号:US08385748B2
公开(公告)日:2013-02-26
申请号:US12618861
申请日:2009-11-16
申请人: Osamu Kagaya , Koyu Takahashi , Taichi Kogure
发明人: Osamu Kagaya , Koyu Takahashi , Taichi Kogure
IPC分类号: H04B10/00
CPC分类号: H01P1/20345 , H01P1/2039 , H04B10/40 , H05K1/0233 , H05K1/0243 , H05K1/162 , H05K1/165 , H05K2201/09309 , H05K2201/09627 , H05K2201/10121 , H05K2201/10689
摘要: To reduce emission of an unintentional electromagnetic wave even if a frequency of a clock signal being output is high, a printed circuit board (10) includes: a substrate (101); signal output circuits (102 and 103) formed on the substrate (101), for outputting a clock signal; power supply wirings (109 and 110) for connecting the signal output circuits (102 and 103) and a power source; and trap filters (107 and 108) provided to the power supply wirings (109 and 110), for attenuating a frequency component corresponding to a frequency of the clock signal.
摘要翻译: 为了减少输出时钟信号的频率高的无意的电磁波的发射,印刷电路板(10)包括:基板(101); 形成在基板(101)上的信号输出电路(102和103),用于输出时钟信号; 用于连接信号输出电路(102和103)和电源的电源布线(109和110); 以及提供给电源配线(109和110)的陷波滤波器(107和108),用于衰减对应于时钟信号频率的频率分量。
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公开(公告)号:US20120154229A1
公开(公告)日:2012-06-21
申请号:US13344874
申请日:2012-01-06
申请人: Osamu Kagaya , Koji Ikawa , Koutarou Suenaga
发明人: Osamu Kagaya , Koji Ikawa , Koutarou Suenaga
IPC分类号: H01Q1/32
CPC分类号: H01Q1/1271 , H01Q13/10
摘要: A vehicle window glass has a glass plate, a conductive film laminated on the glass plate and an antenna structured with a feeding structure placed on the conductive film, and is characterized in that the feeding structure has a dielectric and a pair of electrodes, that the conductive film has a slot one end of which makes an upper edge of the conductive film an open end, and is disposed between the glass plate and the dielectric, and that the pair of electrodes are disposed on the opposite side of the side of the conductive film with the dielectric in between so that the slot is sandwiched between the pair of electrodes when the pair of electrodes are projected onto the conductive film, and are capacitively coupled to the conductive film.
摘要翻译: 车窗玻璃具有玻璃板,层叠在玻璃板上的导电膜和设置在导电膜上的馈电结构的天线,其特征在于,馈电结构具有电介质和一对电极,即, 导电膜具有一个槽,其一端使导电膜的上边缘成为开口端,并且设置在玻璃板和电介质之间,并且一对电极设置在导电膜的一侧的相对侧上 其中电介质在其间,使得当一对电极被投影到导电膜上时狭缝夹在该对电极之间,并且电容耦合到导电膜。
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公开(公告)号:US07817437B2
公开(公告)日:2010-10-19
申请号:US12394421
申请日:2009-02-27
申请人: Iwamichi Kohjiro , Yasuhiro Nunogawa , Sakae Kikuchi , Shizuo Kondo , Tetsuaki Adachi , Osamu Kagaya , Kenji Sekine , Eiichi Hase , Kiichi Yamashita
发明人: Iwamichi Kohjiro , Yasuhiro Nunogawa , Sakae Kikuchi , Shizuo Kondo , Tetsuaki Adachi , Osamu Kagaya , Kenji Sekine , Eiichi Hase , Kiichi Yamashita
CPC分类号: H01L25/16 , H01L23/49844 , H01L23/552 , H01L23/645 , H01L23/66 , H01L24/06 , H01L24/48 , H01L24/49 , H01L2223/6611 , H01L2223/6644 , H01L2224/05554 , H01L2224/05599 , H01L2224/48091 , H01L2224/48227 , H01L2224/48799 , H01L2224/49113 , H01L2224/49175 , H01L2224/49433 , H01L2224/85399 , H01L2924/00014 , H01L2924/01005 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/09701 , H01L2924/10161 , H01L2924/10253 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/15153 , H01L2924/1517 , H01L2924/19105 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H03F1/56 , H03F3/195 , H03F3/213 , H03F3/604 , H03F2200/12 , H03F2200/168 , H03F2200/222 , H03F2200/318 , H03F2200/387 , H03F2200/408 , H03F2200/451 , H03H7/383 , H01L2924/00 , H01L2224/45099
摘要: In a semiconductor device such as a high-frequency power amplifier module, a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate, and electrodes of the semiconductor chip are electrically connected by wires to electrodes of the wiring substrate. In order to make the high-frequency power amplifier module small in size, a substrate-side bonding electrode electrically connected to a wire set at a fixed reference electric potential is place at a location farther from a side of the semiconductor chip than a substrate-side output electrode electrically connected to an output wire. A substrate-side input electrode electrically connected to an input wire is located at a distance from the side of the semiconductor chip about equal to the distance from the side of the semiconductor chip to the substrate-side output electrode, or at a location farther from the side of the semiconductor chip than the substrate-side bonding electrode is.
摘要翻译: 在诸如高频功率放大器模块的半导体器件中,在安装在布线基板的主表面上的半导体芯片上形成多个放大装置,并且半导体芯片的电极通过导线电连接到电极 的布线基板。 为了使高频功率放大器模块尺寸变小,将电连接到固定基准电位的导线的基板侧接合电极位于距离半导体芯片的一侧更靠近基板侧接合电极的位置, 电连接到输出线。 电连接到输入线的基板侧输入电极位于与半导体芯片的侧面相距一定距离处,等于从半导体芯片侧到基板侧输出电极的距离,或者距离半导体芯片 半导体芯片的侧面比基板侧接合电极为止。
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公开(公告)号:US20090263140A1
公开(公告)日:2009-10-22
申请号:US12423612
申请日:2009-04-14
申请人: Osamu KAGAYA
发明人: Osamu KAGAYA
CPC分类号: H05K1/0245 , H05K1/0224 , H05K1/0234 , H05K1/025 , H05K1/0253 , H05K1/0393 , H05K1/147 , H05K1/167 , H05K2201/09236 , H05K2201/093 , H05K2201/0969 , H05K2201/09727 , H05K2201/10121
摘要: A flexible printed circuit board includes: a signal wiring pattern including: a transmission line for connecting an end of an optical device with an end of a signal generation circuit; and another transmission line for connecting another end of the optical device with another end of the signal generation circuit; a thin film resistor layer formed in a region including a region facing the signal wiring pattern so as to constitute a first microstrip line together with each of the transmission lines; a ground conductor formed in a region except a part of a region facing the thin film resistor layer within a region including a region facing the signal wiring pattern so as to constitute a second microstrip line together with each of the transmission lines; and an insulating layer formed between each two of the signal wiring pattern, the thin film resistor layer, and the ground conductor.
摘要翻译: 柔性印刷电路板包括:信号布线图案,包括:用于将光学装置的端部与信号发生电路的端部连接的传输线; 以及用于将所述光学装置的另一端与所述信号发生电路的另一端连接的另一传输线; 形成在包括面向信号布线图案的区域的区域中的薄膜电阻层,以与每个传输线一起构成第一微带线; 形成在除面向薄膜电阻层的区域以外的区域内的区域内的接地导体,所述区域包括面向信号布线图案的区域,以与每条传输线一起构成第二微带线; 以及形成在每个信号布线图案,薄膜电阻层和接地导体之间的绝缘层。
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公开(公告)号:US07400791B2
公开(公告)日:2008-07-15
申请号:US11622511
申请日:2007-01-12
申请人: Osamu Kagaya
发明人: Osamu Kagaya
IPC分类号: G02B6/12
CPC分类号: H01S5/02248 , H01L24/48 , H01L24/49 , H01L2224/45014 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49111 , H01L2224/49175 , H01L2924/00014 , H01L2924/12042 , H01L2924/30107 , H01L2924/3011 , H01S5/0208 , H01S5/02212 , H01S5/02276 , H01S5/0265 , H01S5/0422 , H01S5/0427 , H01S5/06226 , H01S5/0683 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: An optical transmission module of the invention uses a semiconductor chip forming an optical modulator integrated laser on a semi-insulating semiconductor board. An input transfer line and an anode electrode of an optical modulator element are connected by a first bonding wire. The anode electrode of the optical modulator element and one of the ends of a terminal resistor element are connected by a second bonding wire. A cathode electrode of the optical modulator element and the other end of the terminal resistor element are connected by a third bonding wire. The cathode electrode of the optical modulator element and a ground electrode are connected by a fourth bonding wire. A joint portion between the first bonding wire and the input transfer line is arranged on an opposite side to a joint portion between the fourth bonding wire and the ground electrode while interposing the semiconductor chip between them.
摘要翻译: 本发明的光传输模块使用在半绝缘半导体板上形成光调制器集成激光器的半导体芯片。 光调制元件的输入传输线和阳极通过第一接合线连接。 光调制元件的阳极和终端电阻元件的端部之一通过第二接合线连接。 光调制元件的阴极和端子电阻元件的另一端通过第三接合线连接。 光调制元件的阴极和接地电极通过第四接合线连接。 第一接合线和输入传输线之间的接合部分布置在第四接合线和接地电极之间的接合部分的相反侧,同时在其间插入半导体芯片。
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9.
公开(公告)号:US20070248363A1
公开(公告)日:2007-10-25
申请号:US11622511
申请日:2007-01-12
申请人: Osamu Kagaya
发明人: Osamu Kagaya
CPC分类号: H01S5/02248 , H01L24/48 , H01L24/49 , H01L2224/45014 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49111 , H01L2224/49175 , H01L2924/00014 , H01L2924/12042 , H01L2924/30107 , H01L2924/3011 , H01S5/0208 , H01S5/02212 , H01S5/02276 , H01S5/0265 , H01S5/0422 , H01S5/0427 , H01S5/06226 , H01S5/0683 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: An optical transmission module of the invention uses a semiconductor chip forming an optical modulator integrated laser on a semi-insulating semiconductor board. An input transfer line and an anode electrode of an optical modulator element are connected by a first bonding wire. The anode electrode of the optical modulator element and one of the ends of a terminal resistor element are connected by a second bonding wire. A cathode electrode of the optical modulator element and the other end of the terminal resistor element are connected by a third bonding wire. The cathode electrode of the optical modulator element and a ground electrode are connected by a fourth bonding wire. A joint portion between the first bonding wire and the input transfer line is arranged on an opposite side to a joint portion between the fourth bonding wire and the ground electrode while interposing the semiconductor chip between them.
摘要翻译: 本发明的光传输模块使用在半绝缘半导体板上形成光调制器集成激光器的半导体芯片。 光调制元件的输入传输线和阳极通过第一接合线连接。 光调制元件的阳极和终端电阻元件的端部之一通过第二接合线连接。 光调制元件的阴极和端子电阻元件的另一端通过第三接合线连接。 光调制元件的阴极和接地电极通过第四接合线连接。 第一接合线和输入传输线之间的接合部分布置在第四接合线和接地电极之间的接合部分的相反侧,同时在其间插入半导体芯片。
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公开(公告)号:US20070177883A1
公开(公告)日:2007-08-02
申请号:US11451366
申请日:2006-06-13
IPC分类号: H04B10/06
CPC分类号: H01L25/167 , H01L2224/48137 , H01L2924/30107 , H01L2924/3011 , H04B10/66 , H01L2924/00
摘要: A semiconductor chip on which a light receiving element is mounted, a preamplifier for amplifying an output signal from the light receiving element, and an insulating carrier substrate on which the light receiving element is mounted are connected such that the output signal from the light receiving element is input to the preamplifier through electrodes on the carrier substrate, and there are provided two electrodes, on the carrier substrate, having a capacitance value of 40 fF or more therebetween in a state where no light receiving element is mounted.
摘要翻译: 安装有光接收元件的半导体芯片,用于放大来自光接收元件的输出信号的前置放大器和安装有光接收元件的绝缘载体基板被连接,使得来自光接收元件的输出信号 通过载体基板上的电极输入到前置放大器,并且在不装载光接收元件的状态下,在载体基板上设置两个电极间的电容值为40fF以上的两个电极。
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