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    ELECTRO-OPTICAL INSPECTION APPARATUS AND METHOD WITH DUST OR PARTICLE COLLECTION FUNCTION
    1.
    发明申请
    ELECTRO-OPTICAL INSPECTION APPARATUS AND METHOD WITH DUST OR PARTICLE COLLECTION FUNCTION 有权
    电光检测装置和方法与尘埃或颗粒收集功能

    公开(公告)号：US20120074316A1

    公开(公告)日：2012-03-29

    申请号：US13195927

    申请日：2011-08-02

    申请人： Kenji WATANABE ,  Masahiro HATAKEYAMA ,  Yoshihiko NAITO ,  Tatsuya KOHAMA ,  Kenji TERAO ,  Takeshi MURAKAMI ,  Takehide HAYASHI ,  Kiwamu TSUKAMOTO ,  Hiroshi SOBUKAWA ,  Norio KIMURA

    发明人： Kenji WATANABE ,  Masahiro HATAKEYAMA ,  Yoshihiko NAITO ,  Tatsuya KOHAMA ,  Kenji TERAO ,  Takeshi MURAKAMI ,  Takehide HAYASHI ,  Kiwamu TSUKAMOTO ,  Hiroshi SOBUKAWA ,  Norio KIMURA

    IPC分类号： G01N23/20 ,  G01N23/00

    CPC分类号： H01J37/22 ,  H01J37/265 ,  H01J37/29 ,  H01J2237/004 ,  H01J2237/022 ,  H01J2237/24495 ,  H01J2237/24564 ,  H01J2237/2817

    摘要： An electro-optical inspection apparatus is provided that is capable of preventing adhesion of dust or particles to the sample surface as much as possible. A stage (100) on which a sample (200) is placed is disposed inside a vacuum chamber (112) that can be evacuated to vacuum, and a dust collecting electrode (122) is disposed to surround a periphery of the sample (200). The dust collecting electrode (122) is applied with a voltage having the same polarity as a voltage applied to the sample (200) and an absolute value that is the same or larger than an absolute value of the voltage. Thus, because dust or particles such as particles adhere to the dust collecting electrode (122), adhesion of the dust or particles to the sample surface can be reduced. Instead of using the dust collecting electrode, it is possible to form a recess on a wall of the vacuum chamber containing the stage, or to dispose on the wall a metal plate having a mesh structure to which a predetermined voltage is applied. In addition, adhesion of dust or particles can be further reduced by disposing a gap control plate (124) having a through hole (124a) at the center above the sample (200) and the dust collecting electrode (122).

    摘要翻译： 提供一种电光检查装置，其能够尽可能地防止灰尘或颗粒附着到样品表面。 将其上放置有样品（200）的载物台（100）设置在能够抽真空的真空室（112）的内部，并且设置集尘电极（122）以包围样品（200）的周围， 。 集尘电极（122）施加与施加到样品（200）的电压相同极性的电压和与电压的绝对值相同或更大的绝对值。 因此，由于灰尘或颗粒例如颗粒附着在集尘电极122上，所以可以降低灰尘或颗粒对样品表面的粘附。 代替使用集尘电极，可以在包含载物台的真空室的壁上形成凹部，或者在壁上配置具有施加了预定电压的网状结构的金属板。 此外，通过在样品（200）上方的中心和集尘电极（122）设置具有通孔（124a）的间隙控制板（124），可以进一步减少灰尘或颗粒的附着。

    POLISHING METHOD
    4.
    发明申请
    POLISHING METHOD 有权
    抛光方法

    公开(公告)号：US20090286332A1

    公开(公告)日：2009-11-19

    申请号：US12465024

    申请日：2009-05-13

    申请人： Shinrou OHTA ,  Mitsuo Tada ,  Noburu Shimizu ,  Yoichi Kobayashi ,  Taro Takahashi ,  Eisaku Hayashi ,  Hiromitsu Watanabe ,  Tatsuya Kohama ,  Itsuki Kobata

    发明人： Shinrou OHTA ,  Mitsuo Tada ,  Noburu Shimizu ,  Yoichi Kobayashi ,  Taro Takahashi ,  Eisaku Hayashi ,  Hiromitsu Watanabe ,  Tatsuya Kohama ,  Itsuki Kobata

    IPC分类号： H01L21/66

    CPC分类号： H01L22/26 ,  H01L21/3212 ,  H01L21/67219 ,  H01L22/14

    摘要： A method for polishing a substrate having a metal film thereon is described. The substrate has metal interconnects formed from part of the metal film. The polishing method includes performing a first polishing process of removing the metal film, after the first polishing process, performing a second polishing process of removing the barrier film, after the second polishing process, performing a third polishing process of polishing the insulating film, during the second polishing process and the third polishing process, monitoring a polishing state of the substrate with an eddy current sensor, and terminating the third polishing process when an output signal of the eddy current sensor reaches a predetermined threshold.

    摘要翻译： 描述了在其上抛光具有金属膜的基板的方法。 基板具有由金属膜的一部分形成的金属互连。 抛光方法包括：进行第一抛光处理后的第一抛光处理，在第一抛光处理之后，在第二抛光处理之后执行去除阻挡膜的第二抛光工艺，进行抛光绝缘膜的第三抛光处理 第二抛光工艺和第三抛光工艺，用涡流传感器监测衬底的抛光状态，并且当涡流传感器的输出信号达到预定阈值时终止第三抛光处理。

    Method and apparatus for polishing a workpiece
    5.
    发明授权
    Method and apparatus for polishing a workpiece 有权
    抛光工件的方法和设备

    公开(公告)号：US07077730B2

    公开(公告)日：2006-07-18

    申请号：US10883772

    申请日：2004-07-06

    申请人： Tatsuya Kohama ,  Yukiko Nishioka ,  Yoshikazu Ariga

    发明人： Tatsuya Kohama ,  Yukiko Nishioka ,  Yoshikazu Ariga

    IPC分类号： B24B5/00 ,  B24B29/00

    CPC分类号： B24B37/04 ,  B24B57/02

    摘要： A method and apparatus for polishing a workpiece are set forth which can polish the workpiece at a constant rate at a stable condition even when plural workpieces are continually polished. The method comprises dressing a polishing surface of a polishing table while supplying a dressing solution. After the dressing, the dressing solution remaining on the polishing surface is removed by rotating the polishing table at a dewatering rotation speed while stopping the supply of the dressing solution. Then, the workpiece is polished by making the workpiece slidingly contact with the polishing surface while supplying a polishing solution to the polishing surface.

    摘要翻译： 阐述了一种用于抛光工件的方法和装置，即使当多个工件被连续抛光时，其可以以稳定的状态以恒定的速度抛光工件。 该方法包括在提供敷料溶液的同时修整抛光台的抛光表面。 修整后，通过在停止供给敷料溶液的同时以脱水转速旋转研磨台，除去留在研磨面上的敷料液。 然后，通过使工件与研磨面滑动接触，同时向研磨面供给研磨液，抛光工件。

    Polishing method and apparatus
    6.
    发明授权
    Polishing method and apparatus 有权

    公开(公告)号：US06663469B2

    公开(公告)日：2003-12-16

    申请号：US09870479

    申请日：2001-06-01

    申请人： Norio Kimura ,  Tatsuya Kohama

    发明人： Norio Kimura ,  Tatsuya Kohama

    IPC分类号： B24B719

    CPC分类号： H01L21/7684 ,  B24B37/013 ,  B24B37/042 ,  B24B49/12 ,  H01L21/02074 ,  H01L21/3212

    摘要： A semiconductor substrate having a Cu layer formed so as to fill wiring grooves formed in the substrate surface and to cover regions of the substrate surface where no wiring groove is formed is brought into sliding contact with a polishing surface on a turntable to carry out polishing until the Cu layer is polished to a predetermined thickness. Then, the semiconductor substrate is brought into sliding contact with a polishing surface on a turntable to carry out polishing until the Cu layer on the substrate surface is removed, except for portions of the Cu layer formed to fill the wiring grooves, and a barrier metal layer is also removed. Thus, the Cu layer on the substrate surface can be removed uniformly, and the Cu wiring portions formed in the wiring grooves can be planarly and uniformly polished without giving rise to problems of over-polishing such as dishing or erosion.

    Substrate polishing apparatus and substrate polishing method
    7.
    发明申请
    Substrate polishing apparatus and substrate polishing method 审中-公开
    基板抛光装置和基板抛光方法

    公开(公告)号：US20070238395A1

    公开(公告)日：2007-10-11

    申请号：US11806581

    申请日：2007-06-01

    申请人： Norio Kimura ,  Tatsuya Kohama ,  Makoto Akagi

    发明人： Norio Kimura ,  Tatsuya Kohama ,  Makoto Akagi

    IPC分类号： B24B1/00 ,  B24B7/00

    CPC分类号： H01L21/67051 ,  B24B37/042 ,  B24B49/006 ,  B24B49/16 ,  H01L21/02074 ,  H01L21/0209 ,  H01L21/3212 ,  H01L21/67046 ,  H01L21/7684

    摘要： A substrate polishing apparatus wherein a semiconductor substrate is held by a top ring 10-2 or 11-2 and is pressed against a polishing surface of a polishing table 10-1 or 10-2. A surface to be polished of the semiconductor substrate is polished by a relative movement between the semiconductor substrate and the polishing surface. The apparatus includes a pressing force changing mechanism for changing a pressing force for pressing the semiconductor substrate, a relative movement seed changing mechanism for changing the number of revolutions of the top ring and/or the polishing table, and a control mechanism. The control mechanism performs the polishing through plural polishing processes on the polishing table 10-1 or 10-2 while changing the pressing force and the number of revolutions.

    摘要翻译： 一种衬底抛光装置，其中半导体衬底由顶环10-2或11-2保持并且被压靠在抛光台10-1或10-2的抛光表面上。 通过半导体衬底和抛光表面之间的相对运动来抛光半导体衬底的待抛光表面。 该装置包括用于改变用于按压半导体衬底的按压力的按压力改变机构，用于改变顶环和/或抛光台的转数的相对运动种子改变机构和控制机构。 控制机构通过在研磨台10-1或10-2上进行多次研磨处理而进行研磨，同时改变按压力和转速。

    METHOD FOR POLISHING A WORKPIECE
    10.
    发明申请
    METHOD FOR POLISHING A WORKPIECE 审中-公开
    抛光工件的方法

    公开(公告)号：US20090142990A1

    公开(公告)日：2009-06-04

    申请号：US12367037

    申请日：2009-02-06

    申请人： Tatsuya KOHAMA ,  Itsuki Kobata ,  Toshikazu Nomura

    发明人： Tatsuya KOHAMA ,  Itsuki Kobata ,  Toshikazu Nomura

    IPC分类号： B24B49/04 ,  B24B49/12 ,  B24B49/10 ,  B24B57/02

    CPC分类号： B24B37/04 ,  B24B57/02

    摘要： A polishing apparatus can supply a polishing liquid uniformly and efficiently to a surface to be polished of a workpiece. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding a semiconductor wafer and pressing the semiconductor wafer against the polishing surface. The polishing apparatus also includes a polishing liquid supply port for supplying a polishing liquid to the polishing surface, and a moving mechanism for moving the polishing liquid supply port to distribute the polishing liquid uniformly over an entire surface of the workpiece due to relative movement of the workpiece and the polishing surface.

    摘要翻译： 抛光装置可以将抛光液体均匀且有效地提供给被抛光的表面。 抛光装置包括具有抛光表面的抛光台和用于保持半导体晶片并将半导体晶片压靠在抛光表面上的顶环。 抛光装置还包括用于将抛光液供给到研磨面的研磨液供给口，以及用于使抛光液供给口移动以使研磨液均匀地分布在工件的整个表面上的移动机构， 工件和抛光面。