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公开(公告)号：US20080081155A1
公开(公告)日：2008-04-03
申请号：US11906553
申请日：2007-10-02
申请人： Toshihiko Kaneda , Satoshi Kimura , Hidemichi Furihata , Jun Amako , Daisuke Sawaki , Takeshi Kijima
发明人： Toshihiko Kaneda , Satoshi Kimura , Hidemichi Furihata , Jun Amako , Daisuke Sawaki , Takeshi Kijima
CPC分类号： H05K3/182 , C23C18/1608 , C23C18/1893 , C23C18/2086 , C23C18/30 , H05K2201/09045 , H05K2201/09981 , H05K2203/0113 , Y10T428/24612 , Y10T428/31678
摘要： A method of manufacturing a plated substrate using electroless plating to form a metal layer, the method including: forming a resin section having a predetermined pattern on a substrate; forming a catalyst layer on the resin section; and depositing a metal on the catalyst layer by immersing the substrate in an electroless plating solution to form a metal layer.
摘要翻译： 一种使用化学镀制造电镀基板以形成金属层的方法，所述方法包括：在基板上形成具有预定图案的树脂部分; 在树脂部分上形成催化剂层; 以及通过将所述基板浸渍在化学镀溶液中以形成金属层而在所述催化剂层上沉积金属。
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公开(公告)号：US20070212871A1
公开(公告)日：2007-09-13
申请号：US11716720
申请日：2007-03-09
IPC分类号： H01L21/4763
CPC分类号： H01L21/288 , C23C18/1608 , C23C18/1651 , C23C18/1893 , C23C18/2086 , C23C18/30 , C23C18/34 , C23C18/40 , C23C18/54 , H01L21/76885 , H05K3/184 , H05K3/24 , H05K2201/0344 , H05K2203/0565 , H05K2203/073
摘要： A method of manufacturing an interconnect substrate by electroless plating, including: (a) forming a catalyst layer with a specific pattern on a substrate; (b) immersing the substrate in a first electroless plating solution including a first metal to deposit the first metal on the catalyst layer to form a first metal layer; and (c) immersing the substrate in a second electroless plating solution including a second metal to deposit the second metal on the first metal layer to form a second metal layer, an ionization tendency of the first metal being higher than an ionization tendency of the second metal.
摘要翻译： 一种通过化学镀制造互连基板的方法，包括：（a）在基板上形成具有特定图案的催化剂层; （b）将基板浸入包含第一金属的第一非电镀溶液中以将第一金属沉积在催化剂层上以形成第一金属层; 以及（c）将所述基板浸渍在包含第二金属的第二非电解镀液中以将所述第二金属沉积在所述第一金属层上以形成第二金属层，所述第一金属的电离倾向高于所述第二金属的电离倾向 金属。
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公开(公告)号：US07488678B2
公开(公告)日：2009-02-10
申请号：US11716720
申请日：2007-03-09
IPC分类号： H01L21/4763
CPC分类号： H01L21/288 , C23C18/1608 , C23C18/1651 , C23C18/1893 , C23C18/2086 , C23C18/30 , C23C18/34 , C23C18/40 , C23C18/54 , H01L21/76885 , H05K3/184 , H05K3/24 , H05K2201/0344 , H05K2203/0565 , H05K2203/073
摘要： A method of manufacturing an interconnect substrate by electroless plating, including: (a) forming a catalyst layer with a specific pattern on a substrate; (b) immersing the substrate in a first electroless plating solution including a first metal to deposit the first metal on the catalyst layer to form a first metal layer; and (c) immersing the substrate in a second electroless plating solution including a second metal to deposit the second metal on the first metal layer to form a second metal layer, an ionization tendency of the first metal being higher than an ionization tendency of the second metal.
摘要翻译： 一种通过化学镀制造互连基板的方法，包括：（a）在基板上形成具有特定图案的催化剂层; （b）将基板浸入包含第一金属的第一非电镀溶液中以将第一金属沉积在催化剂层上以形成第一金属层; 以及（c）将所述基板浸渍在包含第二金属的第二非电解镀液中以将所述第二金属沉积在所述第一金属层上以形成第二金属层，所述第一金属的电离倾向高于所述第二金属的电离倾向 金属。
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公开(公告)号：US20080299356A1
公开(公告)日：2008-12-04
申请号：US11866038
申请日：2007-10-02
CPC分类号： H05K3/185 , C23C18/1608 , C23C18/1641 , C23C18/1879 , C23C18/1882 , C23C18/204 , C23C18/208 , C23C18/2086 , C23C18/30 , C23C18/36 , H05K3/182 , H05K3/387 , H05K2203/0113 , H05K2203/0514 , Y10T428/24851
摘要： A plated substrate includes a substrate, a resin formed body having a specified pattern including catalytic metal that functions as a catalyst for electroless plating, and a metal layer formed on a top surface of the resin layer.
摘要翻译： 电镀基板包括基板，具有特定图案的树脂成型体，包括用作化学镀的催化剂的催化金属，以及形成在树脂层的顶表面上的金属层。
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公开(公告)号：US20080274338A1
公开(公告)日：2008-11-06
申请号：US12056959
申请日：2008-03-27
申请人： Toshihiko KANEDA , Satoshi KIMURA , Hidemichi FURIHATA , Jun AMAKO , Daisuke SAWAKI , Takeshi KIJIMA
发明人： Toshihiko KANEDA , Satoshi KIMURA , Hidemichi FURIHATA , Jun AMAKO , Daisuke SAWAKI , Takeshi KIJIMA
CPC分类号： H05K3/185 , C23C18/08 , C23C18/14 , C23C18/1608 , C23C18/1692 , C23C18/1844 , C23C18/2086 , C23C18/30 , C23C18/36 , H05K3/125 , H05K3/243 , H05K3/245 , H05K3/389 , H05K2201/09909 , H05K2203/0113 , H05K2203/013 , H05K2203/1105 , H05K2203/308 , Y10T428/24802
摘要： A method for manufacturing a wiring substrate includes the steps of: (a) forming a sacrificial layer in a first pattern on a substrate; (b) forming a catalyst layer in a second pattern on the substrate; (c) immersing the substrate in an electroless plating liquid, thereby depositing a metal layer on the catalyst layer in the second pattern; and (d) heating to remove the sacrificial layer and to form a metal layer in a third pattern, wherein the third pattern is a region where the first pattern and the second pattern overlap each other.
摘要翻译： 制造布线基板的方法包括以下步骤：（a）在基板上形成第一图案的牺牲层; （b）在基板上形成第二图案的催化剂层; （c）将基板浸渍在化学镀液中，由此以第二图案在催化剂层上沉积金属层; 和（d）加热以除去牺牲层并形成第三图案中的金属层，其中第三图案是第一图案和第二图案彼此重叠的区域。
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公开(公告)号：US20080261026A1
公开(公告)日：2008-10-23
申请号：US11906550
申请日：2007-10-02
IPC分类号： H01B3/12
CPC分类号： H05K3/107 , H05K3/045 , H05K3/20 , H05K2203/0108 , H05K2203/072 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T428/26
摘要： A method of manufacturing an element substrate including: forming a release layer on a first support substrate; forming a metal layer having a predetermined pattern on the release layer; applying a sol-gel solution including a material for an inorganic substrate to the first support substrate; removing a solvent from the sol-gel solution by heat treatment to form the inorganic substrate; and removing the metal layer from the first support substrate by decomposing the release layer to transfer the metal layer to the inorganic substrate.
摘要翻译： 一种元件基板的制造方法，包括：在第一支撑基板上形成剥离层; 在剥离层上形成具有预定图案的金属层; 将包含无机基材的材料的溶胶 - 凝胶溶液施加到所述第一支撑基板上; 通过热处理从溶胶 - 凝胶溶液中除去溶剂以形成无机基质; 以及通过分解所述剥离层以将所述金属层转移到所述无机基板，从所述第一支撑基板移除所述金属层。
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7.发明申请公开(公告)号：US20130240871A1
公开(公告)日：2013-09-19
申请号：US13696551
申请日：2011-05-06
IPC分类号： H01L21/368 , H01L41/33 , B05D5/06 , H01L21/02 , H01L29/786
CPC分类号： H01L29/66969 , B05D5/06 , B41J2/161 , B41J2/1623 , B41J2/1629 , B41J2/1637 , B41J2/1639 , B41J2/1643 , B41J2/1645 , C23C18/06 , C23C18/1216 , C23C18/1254 , C23C18/1279 , C23C18/1283 , C23C18/1295 , H01L21/02104 , H01L21/0237 , H01L21/02521 , H01L21/02601 , H01L21/02628 , H01L21/38 , H01L21/441 , H01L27/1225 , H01L27/1292 , H01L29/786 , H01L29/7869 , H01L41/0973 , H01L41/318 , H01L41/33
摘要： A method of producing a functional device according to the present invention includes, in this order: the functional solid material precursor layer formation step of applying a functional liquid material onto a base material to form a precursor layer of a functional solid material; the drying step of heating the precursor layer to a first temperature in a range from 80° C. to 250° C. to preliminarily decrease fluidity of the precursor layer; the imprinting step of imprinting the precursor layer that is heated to a second temperature in a range from 80° C. to 300° C. to form an imprinted structure on the precursor layer; and the functional solid material layer formation step of heat treating the precursor layer at a third temperature higher than the second temperature to transform the precursor layer into a functional solid material layer.
摘要翻译： 本发明的功能元件的制造方法依次包括功能固体材料前体层的形成工序，将功能性液态材料涂布在基材上形成功能性固体材料的前体层; 所述干燥步骤将所述前体层加热至80℃至250℃的第一温度，以预先降低所述前体层的流动性; 将加热到80℃至300℃的第二温度的前体层的压印步骤，在前体层上形成压印结构; 以及在高于第二温度的第三温度下对前体层进行热处理以将前体层转变成功能性固体材料层的功能性固体材料层形成步骤。
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公开(公告)号：US20120064302A1
公开(公告)日：2012-03-15
申请号：US13263805
申请日：2010-04-09
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00 , C01B33/02 , C01B33/027 , C01B33/18 , C01P2004/01 , C01P2004/20 , C23C18/06 , C23C18/08 , C23C18/1208 , C23C18/1279 , C23C18/14 , H01L21/02164 , H01L21/02282 , H01L21/0237 , H01L21/02532 , H01L21/02623 , H01L21/02656 , H01L21/31 , Y10T428/24612
摘要： A patterning method comprising the steps of:the first step of disposing at least one silane compound selected from the group consisting of a silicon hydride compound and a silicon halide compound in the space between a substrate and a patterned mold; andthe second step of subjecting the silane compound to at least one treatment selected from a heat treatment and an ultraviolet exposure treatment.A pattern composed of silicon can be formed by carrying out the second step in an inert atmosphere or a reducing atmosphere and a pattern composed of silicon oxide can be formed by carrying out at least part of the second step in an oxygen-containing atmosphere.
摘要翻译： 一种图案化方法，包括以下步骤：在衬底和图案化模具之间的空间中设置选自由硅化合物和硅卤化物组成的组中的至少一种硅烷化合物的第一步骤; 以及对硅烷化合物进行选自热处理和紫外线曝光处理中的至少一种处理的第二步骤。 可以通过在惰性气氛或还原气氛中进行第二步骤形成由硅构成的图案，并且可以通过在含氧气氛中进行至少一部分第二步骤来形成由氧化硅组成的图案。
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公开(公告)号：US20070218192A1
公开(公告)日：2007-09-20
申请号：US11716738
申请日：2007-03-09
CPC分类号： H05K3/184 , C23C18/1608 , C23C18/1893 , C23C18/2086 , C23C18/30 , C23C18/32 , H05K3/048 , H05K2201/09781 , H05K2203/0565
摘要： A method of manufacturing an interconnect substrate having a linear interconnect by electroless plating without using a plating resist, the method including: (a) forming a plurality of rows of linear catalyst layers on a substrate; and (b) depositing a metal on the linear catalyst layers by electroless plating to form a plurality of rows of linear metal layers, at least one of the rows of linear catalyst layers having a line width of 2 micrometers or less, and a total line width of the linear catalyst layers on the substrate being 10 micrometers or more.
摘要翻译： 一种通过无电镀制造具有线性互连的互连基板的方法，其不使用电镀抗蚀剂，该方法包括：（a）在基板上形成多行线性催化剂层; 和（b）通过无电镀方法在线性催化剂层上沉积金属以形成多行线性金属层，至少一行线性催化剂层的线宽为2微米以下，总线 基板上的线性催化剂层的宽度为10微米以上。
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10.发明授权公开(公告)号：US09202895B2
公开(公告)日：2015-12-01
申请号：US13696551
申请日：2011-05-06
IPC分类号： H01L29/10 , H01L29/66 , B41J2/16 , C23C18/12 , B05D5/06 , H01L21/02 , H01L21/368 , H01L29/786 , H01L41/33 , H01L41/318 , H01L27/12 , C23C18/06 , H01L21/441 , H01L41/09
CPC分类号： H01L29/66969 , B05D5/06 , B41J2/161 , B41J2/1623 , B41J2/1629 , B41J2/1637 , B41J2/1639 , B41J2/1643 , B41J2/1645 , C23C18/06 , C23C18/1216 , C23C18/1254 , C23C18/1279 , C23C18/1283 , C23C18/1295 , H01L21/02104 , H01L21/0237 , H01L21/02521 , H01L21/02601 , H01L21/02628 , H01L21/38 , H01L21/441 , H01L27/1225 , H01L27/1292 , H01L29/786 , H01L29/7869 , H01L41/0973 , H01L41/318 , H01L41/33
摘要： A method of producing a functional device according to the present invention includes, in this order: the functional solid material precursor layer formation step of applying a functional liquid material onto a base material to form a precursor layer of a functional solid material; the drying step of heating the precursor layer to a first temperature in a range from 80° C. to 250° C. to preliminarily decrease fluidity of the precursor layer; the imprinting step of imprinting the precursor layer that is heated to a second temperature in a range from 80° C. to 300° C. to form an imprinted structure on the precursor layer; and the functional solid material layer formation step of heat treating the precursor layer at a third temperature higher than the second temperature to transform the precursor layer into a functional solid material layer.
摘要翻译： 本发明的功能元件的制造方法依次包括功能固体材料前体层的形成工序，将功能性液态材料涂布在基材上形成功能性固体材料的前体层; 所述干燥步骤将所述前体层加热至80℃至250℃的第一温度，以预先降低所述前体层的流动性; 将加热到80℃至300℃的第二温度的前体层的压印步骤，在前体层上形成压印结构; 以及在高于第二温度的第三温度下对前体层进行热处理以将前体层转变成功能性固体材料层的功能性固体材料层形成步骤。
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