公开(公告)号：US20120068338A1

公开(公告)日：2012-03-22

申请号：US12883821

申请日：2010-09-16

申请人： Belgacem Haba ,  Ellis Chau ,  Wael Zohni ,  Philip Damberg ,  Richard Dewitt Crisp

发明人： Belgacem Haba ,  Ellis Chau ,  Wael Zohni ,  Philip Damberg ,  Richard Dewitt Crisp

IPC分类号： H01L23/52

CPC分类号： H01L23/64 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/552 ,  H01L24/06 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06537 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/43

摘要： A microelectronic assembly is disclosed that is capable of achieving a desired impedance for raised conductive elements. The microelectronic assembly may include an interconnection element, a surface conductive element, a microelectronic device, a plurality of raised conductive elements, and a bond element. The microelectronic device may overlie the dielectric element and at least one surface conductive element attached to the front surface. The plurality of raised conductive elements may connect the device contacts with the element contacts. The raised conductive elements may have substantial portions spaced a first height above and extending at least generally parallel to at least one surface conductive element, such that a desired impedance may be achieved for the raised conductive elements. A bond element may electrically connect at least one surface conductive element with at least one reference contact that may be connectable to a source of reference potential.

摘要翻译： 公开了能够实现用于凸起的导电元件的期望阻抗的微电子组件。 微电子组件可以包括互连元件，表面导电元件，微电子器件，多个凸起的导电元件和接合元件。 微电子器件可以覆盖在电介质元件和附接到前表面的至少一个表面导电元件。 多个凸起的导电元件可以将元件触点与元件触点连接。 升高的导电元件可以具有在第一高度之上并且至少大致平行于至少一个表面导电元件延伸的基本部分，使得可以为凸起的导电元件实现期望的阻抗。 键合元件可以将至少一个表面导电元件与可连接到参考电位源的至少一个参考触点电连接。

公开(公告)号：US09136197B2

公开(公告)日：2015-09-15

申请号：US13472081

申请日：2012-05-15

申请人： Belgacem Haba ,  Ellis Chau ,  Wael Zohni ,  Philip Damberg ,  Richard Dewitt Crisp

发明人： Belgacem Haba ,  Ellis Chau ,  Wael Zohni ,  Philip Damberg ,  Richard Dewitt Crisp

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L23/552 ,  H01L23/00 ,  H01L25/065 ,  H01L23/13 ,  H01L23/498

CPC分类号： H01L23/3128 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/552 ,  H01L24/06 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/06156 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/4824 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06558 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A microelectronic assembly includes an interconnection element, a conductive plane, a microelectronic device, a plurality of traces, and first and second bond elements. The interconnection element includes a dielectric element, a plurality of element contacts, and at least one reference contact thereon. The microelectronic device includes a front surface with device contacts exposed thereat. The conductive plane overlies a portion of the front surface of the microelectronic device. Traces overlying a surface of the conductive plane are insulated therefrom and electrically connected with the element contacts. The traces also have substantial portions spaced a first height above and extending at least generally parallel to the conductive plane, such that a desired impedance is achieved for the traces. First bond element electrically connects the at least one conductive plane with the at least one reference contact. Second bond elements electrically connect device contacts with the traces.

摘要翻译： 微电子组件包括互连元件，导电平面，微电子器件，多个迹线以及第一和第二接合元件。 互连元件包括电介质元件，多个元件触点及其上的至少一个参考触点。 该微电子器件包括一个正面，其中设有触点暴露在该表面上。 导电平面覆盖微电子器件前表面的一部分。 覆盖导电平面表面的迹线与其绝缘，并与元件触点电连接。 迹线还具有在第一高度之上并且至少大致平行于导电平面延伸的基本部分，使得对于迹线实现期望的阻抗。 第一接合元件将至少一个导电平面与至少一个参考触点电连接。 第二接合元件将器件触点与迹线电连接。

公开(公告)号：US08222725B2

公开(公告)日：2012-07-17

申请号：US12883811

申请日：2010-09-16

申请人： Belgacem Haba ,  Ellis Chau ,  Wael Zohni ,  Richard Dewitt Crisp

发明人： Belgacem Haba ,  Ellis Chau ,  Wael Zohni ,  Richard Dewitt Crisp

IPC分类号： H01L23/02

CPC分类号： H01L23/3128 ,  H01L23/49816 ,  H01L23/552 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06537 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/013 ,  H01L2924/00013

摘要： A microelectronic assembly includes an interconnection element, element contacts, first and second metal layers, conductive elements, and first and second microelectronic devices. The first metal layer may extend beyond at least one of the edges of the first microelectronic device. The conductive elements may respectively extend beyond at least one of the edges of the first metal layer. The first metal layer may have a surface disposed at a substantially uniform spacing from at least substantial portions of the conductive elements, such that a desired impedance may be achieved for the conductive elements. The conductive elements may be spaced a smaller distance from the metal layer than the distance of the conductive elements from the front surface of the first microelectronic device. The second metal layer may be connectable to a source of reference potential.

摘要翻译： 微电子组件包括互连元件，元件触点，第一和第二金属层，导电元件以及第一和第二微电子器件。 第一金属层可以延伸超出第一微电子器件的至少一个边缘。 导电元件可以分别延伸超过第一金属层的至少一个边缘。 第一金属层可以具有以与导电元件的至少大部分基本上均匀的间隔设置的表面，使得可以为导电元件实现期望的阻抗。 导电元件可以距金属层的距离远离导电元件距离第一微电子器件的前表面的距离。 第二金属层可以连接到参考电位源。

公开(公告)号：US08786083B2

公开(公告)日：2014-07-22

申请号：US12883821

申请日：2010-09-16

申请人： Belgacem Haba ,  Ellis Chau ,  Wael Zohni ,  Philip Damberg ,  Richard Dewitt Crisp

发明人： Belgacem Haba ,  Ellis Chau ,  Wael Zohni ,  Philip Damberg ,  Richard Dewitt Crisp

IPC分类号： H01L23/52

CPC分类号： H01L23/64 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/552 ,  H01L24/06 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06537 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/43

摘要： A microelectronic assembly is disclosed that is capable of achieving a desired impedance for raised conductive elements. The microelectronic assembly may include an interconnection element, a surface conductive element, a microelectronic device, a plurality of raised conductive elements, and a bond element. The microelectronic device may overlie the dielectric element and at least one surface conductive element attached to the front surface. The plurality of raised conductive elements may connect the device contacts with the element contacts. The raised conductive elements may have substantial portions spaced a first height above and extending at least generally parallel to at least one surface conductive element, such that a desired impedance may be achieved for the raised conductive elements. A bond element may electrically connect at least one surface conductive element with at least one reference contact that may be connectable to a source of reference potential.

摘要翻译： 公开了能够实现用于凸起的导电元件的期望阻抗的微电子组件。 微电子组件可以包括互连元件，表面导电元件，微电子器件，多个凸起的导电元件和接合元件。 微电子器件可以覆盖在电介质元件和附接到前表面的至少一个表面导电元件。 多个凸起的导电元件可以将元件触点与元件触点连接。 升高的导电元件可以具有在第一高度之上并且至少大致平行于至少一个表面导电元件延伸的基本部分，使得可以为凸起的导电元件实现期望的阻抗。 键合元件可以将至少一个表面导电元件与可连接到参考电位源的至少一个参考触点电连接。

公开(公告)号：US20120313228A1

公开(公告)日：2012-12-13

申请号：US13472081

申请日：2012-05-15

申请人： Belgacem Haba ,  Ellis Chau ,  Wael Zohni ,  Philip Damberg ,  Richard Dewitt Crisp

发明人： Belgacem Haba ,  Ellis Chau ,  Wael Zohni ,  Philip Damberg ,  Richard Dewitt Crisp

IPC分类号： H01L23/495 ,  H01L21/60 ,  H01L25/07

CPC分类号： H01L23/3128 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/552 ,  H01L24/06 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/06156 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/4824 ,  H01L2224/49175 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06558 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A microelectronic assembly includes an interconnection element, a conductive plane, a microelectronic device, a plurality of traces, and first and second bond elements. The interconnection element includes a dielectric element, a plurality of element contacts, and at least one reference contact thereon. The microelectronic device includes a front surface with device contacts exposed thereat. The conductive plane overlies a portion of the front surface of the microelectronic device. Traces overlying a surface of the conductive plane are insulated therefrom and electrically connected with the element contacts. The traces also have substantial portions spaced a first height above and extending at least generally parallel to the conductive plane, such that a desired impedance is achieved for the traces. First bond element electrically connects the at least one conductive plane with the at least one reference contact. Second bond elements electrically connect device contacts with the traces.

摘要翻译： 微电子组件包括互连元件，导电平面，微电子器件，多个迹线以及第一和第二接合元件。 互连元件包括电介质元件，多个元件触点及其上的至少一个参考触点。 该微电子器件包括一个正面，其中设有触点暴露在该表面上。 导电平面覆盖微电子器件前表面的一部分。 覆盖导电平面表面的迹线与其绝缘，并与元件触点电连接。 迹线还具有在第一高度之上并且至少大致平行于导电平面延伸的基本部分，使得对于迹线实现期望的阻抗。 第一接合元件将至少一个导电平面与至少一个参考触点电连接。 第二接合元件将器件触点与迹线电连接。

公开(公告)号：US20120068365A1

公开(公告)日：2012-03-22

申请号：US12883811

申请日：2010-09-16

申请人： Belgacem Haba ,  Ellis Chau ,  Wael Zohni ,  Richard Dewitt Crisp

发明人： Belgacem Haba ,  Ellis Chau ,  Wael Zohni ,  Richard Dewitt Crisp

IPC分类号： H01L23/49 ,  H01L21/50

CPC分类号： H01L23/3128 ,  H01L23/49816 ,  H01L23/552 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06537 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/013 ,  H01L2924/00013

摘要： A microelectronic assembly includes an interconnection element, element contacts, first and second metal layers, conductive elements, and first and second microelectronic devices. The first metal layer may extend beyond at least one of the edges of the first microelectronic device. The conductive elements may respectively extend beyond at least one of the edges of the first metal layer. The first metal layer may have a surface disposed at a substantially uniform spacing from at least substantial portions of the conductive elements, such that a desired impedance may be achieved for the conductive elements. The conductive elements may be spaced a smaller distance from the metal layer than the distance of the conductive elements from the front surface of the first microelectronic device. The second metal layer may be connectable to a source of reference potential.

摘要翻译： 微电子组件包括互连元件，元件触点，第一和第二金属层，导电元件以及第一和第二微电子器件。 第一金属层可以延伸超出第一微电子器件的至少一个边缘。 导电元件可以分别延伸超过第一金属层的至少一个边缘。 第一金属层可以具有以与导电元件的至少大部分基本上均匀的间隔设置的表面，使得可以为导电元件实现期望的阻抗。 导电元件可以距金属层的距离远离导电元件距离第一微电子器件的前表面的距离。 第二金属层可以连接到参考电位源。

公开(公告)号：US08610260B2

公开(公告)日：2013-12-17

申请号：US13439299

申请日：2012-04-04

申请人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

发明人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

IPC分类号： H01L23/48

CPC分类号： H01L23/49838 ,  G11C5/04 ,  G11C5/063 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/3171 ,  H01L23/48 ,  H01L23/4824 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/52 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L27/108 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05554 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/06156 ,  H01L2224/06164 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81447 ,  H01L2224/81805 ,  H01L2224/9202 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/3011 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package can include a substrate and a microelectronic element having a face and one or more columns of contacts thereon which face and are joined to corresponding contacts on a surface of the substrate. An axial plane may intersect the face along a line in the first direction and centered relative to the columns of element contacts. Columns of package terminals can extend in the first direction. First terminals in a central region of the second surface can be configured to carry address information usable to determine an addressable memory location within the microelectronic element. The central region may have a width not more than three and one-half times a minimum pitch between the columns of package terminals. The axial plane can intersect the central region.

摘要翻译： 微电子封装可以包括衬底和微电子元件，其具有面和在其上的一个或多个接触柱，其面对并连接到衬底的表面上的对应接触。 轴向平面可以沿着第一方向的线与面相交，并且相对于元件触点的列居中。 封装端子的列可以沿第一方向延伸。 可以将第二表面的中心区域中的第一端子配置为携带可用于确定微电子元件内的可寻址存储器位置的地址信息。 中心区域可以具有不大于封装端子列之间的最小间距的三倍和五倍的宽度。 轴向平面可以与中心区域相交。

公开(公告)号：US08525327B2

公开(公告)日：2013-09-03

申请号：US13439286

申请日：2012-04-04

申请人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

发明人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

IPC分类号： H01L23/34 ,  H01L23/498

CPC分类号： H01L23/49838 ,  G11C5/04 ,  G11C5/063 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/3171 ,  H01L23/48 ,  H01L23/4824 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/52 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L27/108 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05554 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/06156 ,  H01L2224/06164 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81447 ,  H01L2224/81805 ,  H01L2224/9202 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/3011 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package can include a substrate and a microelectronic element having a face and one or more columns of contacts thereon which face and are joined to corresponding contacts on a surface of the substrate. An axial plane may intersect the face along a line in the first direction and centered relative to the columns of element contacts. Columns of package terminals can extend in the first direction. First terminals in a central region of the second surface can be configured to carry address information usable to determine an addressable memory location within the microelectronic element. The central region may have a width not more than three and one-half times a minimum pitch between the columns of package terminals. The axial plane can intersect the central region.

公开(公告)号：US08436477B2

公开(公告)日：2013-05-07

申请号：US13439273

申请日：2012-04-04

申请人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

发明人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  G11C5/063 ,  H01L23/12 ,  H01L23/13 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/1715 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2225/06506 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00

摘要： A microelectronic package can include a microelectronic element having a face and a plurality of element contacts thereon, a substrate having first and second surfaces, and terminals on the second surface configured for connecting the package with an external component. The microelectronic element can include a plurality of stacked electrically interconnected semiconductor chips. The substrate can have contacts facing the element contacts of the microelectronic element and joined thereto. The terminals can include first terminals arranged at positions within first and second parallel grids. The first terminals of each grid can be configured to carry address information usable by circuitry within the microelectronic package to determine an addressable memory location from among all the available addressable memory locations within the microelectronic element. The signal assignments of the first terminals in the first grid can be a mirror image of the signal assignments of the first terminals in the second grid.

摘要翻译： 微电子封装可以包括其上具有面和多个元件触点的微电子元件，具有第一和第二表面的衬底以及被配置为将封装与外部元件连接的第二表面上的端子。 微电子元件可以包括多个堆叠的电互连半导体芯片。 衬底可以具有面向微电子元件的元件触点并且与其接合的触点。 端子可以包括布置在第一和第二平行栅格内的位置处的第一端子。 每个电网的第一个端子可被配置为承载可由微电子封装内的电路使用的地址信息，以从微电子元件内的所有可寻址的存储单元中确定可寻址的存储器位置。 第一网格中的第一终端的信号分配可以是第二网格中的第一终端的信号分配的镜像。

公开(公告)号：US20130083583A1

公开(公告)日：2013-04-04

申请号：US13440515

申请日：2012-04-05

申请人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

发明人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

IPC分类号： G11C5/06

CPC分类号： H01L25/105 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/06 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/06156 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A microelectronic package can include a substrate having first and second opposed surfaces and first and second apertures extending between the first and second surfaces, first and second microelectronic elements each having a surface facing the first surface of the substrate, a plurality of terminals exposed at the second surface in a central region thereof, and leads electrically connected between contacts of each microelectronic element and the terminals. The apertures can have first and second parallel axes extending in directions of the lengths of the respective apertures. The central region of the second surface can be disposed between the first and second axes. The terminals can be configured to carry address information usable by circuitry within the microelectronic package to determine an addressable memory location from among all the available addressable memory locations of a memory storage array within the microelectronic elements.

摘要翻译： 微电子封装可以包括具有第一和第二相对表面的衬底以及在第一和第二表面之间延伸的第一和第二孔，第一和第二微电子元件各自具有面向衬底的第一表面的表面， 并且在每个微电子元件的触点和端子之间电连接引线。 孔可以具有在相应孔的长度方向上延伸的第一和第二平行轴线。 第二表面的中心区域可以设置在第一和第二轴线之间。 终端可以被配置为承载可由微电子封装内的电路使用的地址信息，以从微电子元件内的存储器存储阵列的所有可寻址的存储器位置中确定可寻址的存储器位置。