公开(公告)号：US20120018866A1

公开(公告)日：2012-01-26

申请号：US13188456

申请日：2011-07-21

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu ,  Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu ,  Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L21/4832 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package paddle having an upper hole below a paddle top side, the upper hole bounded by an upper non-horizontal side with a curve surface; forming a terminal adjacent the package paddle; mounting an integrated circuit on the paddle top side; and forming an encapsulation within the upper hole.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供一个封装桨叶，其具有在桨叶顶侧下方的上孔，所述上孔由具有曲面的上非水平侧限定; 形成邻近包装桨的端子; 将集成电路安装在桨叶顶侧; 并在上孔内形成封装。

公开(公告)号：US08735224B2

公开(公告)日：2014-05-27

申请号：US13102044

申请日：2011-05-05

申请人： Byung Tai Do ,  Arnel Senosa Trasporto ,  Zigmund Ramirez Camacho

发明人： Byung Tai Do ,  Arnel Senosa Trasporto ,  Zigmund Ramirez Camacho

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/49503 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49534 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/131 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a terminal having a top with a depression; applying a dielectric material in the depression, the dielectric material having a gap formed therein and exposing a portion of the top therefrom; forming a trace within the gap and in direct contact with the top, the trace extending laterally over an upper surface of the dielectric material; and connecting an integrated circuit to the terminal through the trace.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有凹部的具有顶部的端子; 在所述凹陷中施加电介质材料，所述电介质材料在其中形成间隙并暴露所述顶部的一部分; 在所述间隙内形成迹线并与所述顶部直接接触，所述迹线在所述电介质材料的上表面上横向延伸; 并通过轨迹将集成电路连接到终端。

公开(公告)号：US20120280390A1

公开(公告)日：2012-11-08

申请号：US13102044

申请日：2011-05-05

申请人： Byung Tai Do ,  Arnel Senosa Trasporto ,  Zigmund Ramirez Camacho

发明人： Byung Tai Do ,  Arnel Senosa Trasporto ,  Zigmund Ramirez Camacho

IPC分类号： H01L23/488 ,  H01L21/56 ,  H01L23/12 ,  H01L21/58

CPC分类号： H01L23/49503 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49534 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/131 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a terminal having a top with a depression; applying a dielectric material in the depression, the dielectric material having a gap formed therein and exposing a portion of the top therefrom; forming a trace within the gap and in direct contact with the top, the trace extending laterally over an upper surface of the dielectric material; and connecting an integrated circuit to the terminal through the trace.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有凹部的具有顶部的端子; 在所述凹陷中施加电介质材料，所述电介质材料在其中形成间隙并暴露所述顶部的一部分; 在所述间隙内形成迹线并与所述顶部直接接触，所述迹线在所述电介质材料的上表面上横向延伸; 并通过轨迹将集成电路连接到终端。

公开(公告)号：US08802501B2

公开(公告)日：2014-08-12

申请号：US13188456

申请日：2011-07-21

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu ,  Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu ,  Byung Tai Do ,  Arnel Senosa Trasporto ,  Linda Pei Ee Chua

IPC分类号： H01L21/48

CPC分类号： H01L21/4832 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package paddle having an upper hole below a paddle top side, the upper hole bounded by an upper non-horizontal side with a curve surface; forming a terminal adjacent the package paddle; mounting an integrated circuit on the paddle top side; and forming an encapsulation within the upper hole.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供一个封装桨叶，其具有在桨叶顶侧下方的上孔，所述上孔由具有曲面的上非水平侧限定; 形成邻近包装桨的端子; 将集成电路安装在桨叶顶侧; 并在上孔内形成封装。

公开(公告)号：US07919360B1

公开(公告)日：2011-04-05

申请号：US12562722

申请日：2009-09-18

申请人： Zigmund Ramirez Camacho ,  Jose Alvin Caparas ,  Arnel Senosa Trasporto

发明人： Zigmund Ramirez Camacho ,  Jose Alvin Caparas ,  Arnel Senosa Trasporto

IPC分类号： H01L21/00 ,  H01L23/495 ,  H01L23/48 ,  H01L23/28

CPC分类号： H01L23/49551 ,  H01L23/3107 ,  H01L23/49531 ,  H01L23/49575 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a lead to include a first tip at one end, a second tip on the end opposite from the first tip with a connect area between each end located above the first tip, and a first tier section or a second tier section located between the connect area and the second tip; connecting a bottom component assembly to the first tier section or the second tier section; connecting a top component assembly over the connect area; and applying an encapsulant over and under the connect area with the first tip exposed.

摘要翻译： 一种集成电路封装系统的制造方法，包括：形成导线，在一端包括第一端头，在与第一端部相对的端部的第二端部上具有位于第一端部上方的每个端部之间的连接区域， 位于连接区域和第二尖端之间的第一层部分或第二层部分; 将底部部件组件连接到第一层部分或第二层部分; 在连接区域上连接顶部组件组件; 以及将所述密封剂涂覆在所述连接区域上方和所述第一端部露出的下方。

公开(公告)号：US20100289128A1

公开(公告)日：2010-11-18

申请号：US12467146

申请日：2009-05-15

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Arnel Senosa Trasporto

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Arnel Senosa Trasporto

IPC分类号： H01L23/52 ,  H01L21/98

CPC分类号： H01L23/49531 ,  H01L23/4951 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: conductively bonding a first surface of a transposer to an inner end of a lead separate from the transposer; conductively bonding a die to the first surface of the transposer; and encapsulating the inner end with a mold compound having a bottom mold surface that is exposed and is coplanar with a surface of the transposer opposite the first surface.

摘要翻译： 集成电路封装系统的制造方法包括：将转移器的第一表面导电地接合到与转移器分离的引线的内端; 导电地将模具结合到转台的第一表面; 并且用模具化合物封装内端，所述模具化合物具有暴露的底模表面，并且与转置体的与第一表面相对的表面共面。

公开(公告)号：US08664038B2

公开(公告)日：2014-03-04

申请号：US12328759

申请日：2008-12-04

申请人： Zigmund Ramirez Camacho ,  Arnel Senosa Trasporto ,  Lionel Chien Hui Tay ,  Jose Alvin Caparas

发明人： Zigmund Ramirez Camacho ,  Arnel Senosa Trasporto ,  Lionel Chien Hui Tay ,  Jose Alvin Caparas

IPC分类号： H01L21/00

CPC分类号： H01L23/49575 ,  H01L23/49503 ,  H01L23/49548 ,  H01L24/28 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a package paddle and a terminal adjacent to the package paddle; mounting a stack paddle over the package paddle with the stack paddle at a non-center offset with the package paddle; mounting a stack integrated circuit over the stack paddle; and encapsulating the stack integrated circuit and the stack paddle.

摘要翻译： 一种集成电路封装系统的制造方法，包括：形成封装焊盘和邻近封装焊盘的端子; 将堆叠桨安装在封装桨上方，堆叠桨与封装桨形件在非中心偏移处; 在堆叠桨上安装堆叠集成电路; 并封装堆叠集成电路和堆叠桨。

公开(公告)号：US07977779B2

公开(公告)日：2011-07-12

申请号：US12136768

申请日：2008-06-10

申请人： Zigmund Ramirez Camacho ,  Arnel Senosa Trasporto ,  Lionel Chien Hui Tay ,  Henry Descalzo Bathan

发明人： Zigmund Ramirez Camacho ,  Arnel Senosa Trasporto ,  Lionel Chien Hui Tay ,  Henry Descalzo Bathan

IPC分类号： H01L23/50

CPC分类号： H01L23/49548 ,  H01L21/4832 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49541 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/24226 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/83411 ,  H01L2224/83424 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/85001 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/09701 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/0105 ,  H01L2924/0665 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2924/207

摘要： A mountable integrated circuit package-in-package system includes: providing an interface integrated circuit package system with a terminal having a plated bumped portion of an inner encapsulation; mounting the interface integrated circuit package system over a package carrier with the terminal facing away from the package carrier; connecting the package carrier and a pad extension of the terminal; and forming a package encapsulation over the interface integrated circuit package system with the terminal exposed.

摘要翻译： 一种可安装的集成电路封装包装系统，包括：提供具有内部封装的镀覆凸起部分的端子的接口集成电路封装系统; 将接口集成电路封装系统安装在封装载体上，端子背离封装载体; 连接封装载体和端子的焊盘延伸部; 并在接口集成电路封装系统上形成封装封装，端子暴露。

公开(公告)号：US07919850B2

公开(公告)日：2011-04-05

申请号：US12331416

申请日：2008-12-09

申请人： Arnel Senosa Trasporto ,  Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Abelardo Hadap Advincula, Jr.

发明人： Arnel Senosa Trasporto ,  Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Abelardo Hadap Advincula, Jr.

IPC分类号： H01L23/04 ,  H01L23/02

CPC分类号： H01L23/49548 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/4952 ,  H01L23/49531 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/05553 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/06568 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a lead; mounting an inner package so that the lead is peripheral to the inner package, and the inner package having a connection pad; forming an exposed terminal interconnect on the connection pad; and encapsulating the inner package, and partially encapsulating the exposed terminal interconnect with an encapsulation.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供引线; 安装内部封装，使得引线是内部封装的周边，并且内部封装具有连接焊盘; 在连接焊盘上形成暴露的端子互连; 并封装内部封装，并用封装部分地封装暴露的端子互连。

公开(公告)号：US20110068458A1

公开(公告)日：2011-03-24

申请号：US12565144

申请日：2009-09-23

申请人： Zigmund Ramirez Camacho ,  Arnel Senosa Trasporto ,  Lionel Chien Hui Tay ,  Henry Descalzo Bathan

发明人： Zigmund Ramirez Camacho ,  Arnel Senosa Trasporto ,  Lionel Chien Hui Tay ,  Henry Descalzo Bathan

IPC分类号： H01L23/28 ,  H01L21/56

CPC分类号： H01L23/3107 ,  H01L23/49575 ,  H01L24/17 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/18161 ,  H01L2924/00

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a first device having a first exposed side and a first inward side; connecting a second device having a second exposed side and a second inward side facing the first inward side to the first device, the second device having planar dimensions less than planar dimensions of the first device; connecting a system connector to a perimeter of the first inward side, the system connector having an exposed leg partially vertical and an exposed foot partially horizontal; and applying an encapsulant exposing the first exposed side, the second exposed side, the exposed leg, and the exposed foot, the exposed leg offset from the encapsulant, the exposed foot on an end of the system connector opposite the first device.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有第一暴露侧和第一内侧的第一器件; 将具有第二暴露侧和面向所述第一内侧的第二内侧的第二装置连接到所述第一装置，所述第二装置具有小于所述第一装置的平面尺寸的平面尺寸; 将系统连接器连接到第一内侧的周边，系统连接器具有部分垂直的暴露的腿和暴露的脚部分水平; 以及施加暴露所述第一暴露侧，所述第二暴露侧，所述暴露腿和所述暴露的脚的密封剂，暴露的腿偏离所述密封剂，所述暴露的脚在所述系统连接器的与所述第一装置相对的端部上。